Emitter package

• US D615,504 S1
• Filed: 10/31/2007
• Issued: 05/11/2010
• Est. Priority Date: 10/31/2007
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Medendorp, Nicholas Jr., Keller, Bernd, Yuan, Thomas Cheng-Hsin
• Primary Examiner(s): Sikder; Selina
• Application Number:
  US29/292,900
• Time in Patent Office: 923 Days
• Field of Search: D13/180, D26/2, 257/79, 257/80, 257/81, 257/88, 257/89, 257/95, 257/98, 257/99, 257/100, 313/483, 313/498, 313/500, 362/555, 362/800
• US Class Current: D13/180
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Claims

1. The ornamental design for an emitter package, as shown and described.