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Elastic membrane for semiconductor wafer polishing apparatus

  • US D634,719 S1
  • Filed: 02/25/2010
  • Issued: 03/22/2011
  • Est. Priority Date: 08/27/2009
  • Status: Active Grant
First Claim
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1. The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.

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