Bridge rectifier package with heat sink
First Claim
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1. The ornamental design for a new bridge rectifier package with heat sink, as shown and described.
1 Assignment
0 Petitions
Accused Products
22 Citations
1 Claim
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1. The ornamental design for a new bridge rectifier package with heat sink, as shown and described.
Specification
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Current AssigneeVishay General Semiconductor LLC (Vishay Intertechnology Incorporated)
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Original AssigneeVishay General Semiconductor LLC (Vishay Intertechnology Incorporated)
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InventorsChou, Ta-Te, Zhang, Xiong-Jie, Li, Xian, Fu, Hai, Tian, Yong-Qi
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Primary Examiner(s)Sikder, Selina
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Application NumberUS29/359,100Time in Patent Office693 DaysField of SearchD13/179, D13/182, 165/80.3, 165/104.33, 165/151, 165/122, 165/185, 257/706, 257/707, 257718-722, 257/177, 257/347, 361/687, 361/695, 361/697, 361/700, 361/702, 361/704, 361/709, 361/710, 361/711, 361/719US Class CurrentD13/182CPC Class CodesN/A
