Housing for a mobile computing device

• US D666,198 S1
• Filed: 02/07/2011
• Issued: 08/28/2012
• Est. Priority Date: 02/07/2011
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Van Den Nieuwenhuizen, John, Lee, Seungheon
• Primary Examiner(s): FOX, BARBARA G
• Application Number:
  US29/385,002
• Time in Patent Office: 568 Days
• Field of Search: D14341-347, D14/137, D14/138, D14/138.1, D14/138.AA, D14/138.R, D14/138.AB, D14/138.AC, D14/138.AD, D14/138.C, D14/138.G, D14/496, D14/203.1, D14/203.3, D14/203.4, D14/203.5, D14/203.7, D14/426, D14/427, D14/432, D14/429, D14/129, D14/130, D14/420, D14439-441, D14/448, D14/125, D14/147, D14/156, D14/218, D14247-248, D14/250, D14/389, D14/388, D14315-318, D10/65, D10/104, D18/6, D18/7, D21/324, D21/329, D21/330, D19/26, D19/59, D19/60, 455/556.1, 455/556.2, 455/566, 455/575.1, 455/90.3, 379/433.04, 379/433.01, 379/433.06, 379/916, 345/901, 345/905, 361/679.26, 361/679.27, 361/679.3, 361/679.55, 361/679.56
• US Class Current: D14/341
• CPC Class Codes: N/A

Claims

1. The ornamental design for a housing for a mobile computing device, as shown and described.