Package for light emitting diode (LED) lighting

• US D667,801 S1
• Filed: 07/11/2011
• Issued: 09/25/2012
• Est. Priority Date: 07/16/2010
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Joo, Sung Chul, Hussell, Christopher P.
• Primary Examiner(s): Sikder, Selina
• Application Number:
  US29/397,017
• Time in Patent Office: 442 Days
• Field of Search: D13/180, D26/1, D26/2, 257/79, 257/80, 257/81, 257/88, 257/89, 257/95, 257/98, 257/99, 257/100, 257/E33.058, 313/483, 313/498, 313/500, 362/555, 362/800
• US Class Current: D13/180
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Claims

1. The ornamental design for a package for light emitting diode (LED) lighting, as shown and described.