Housing for a mobile computing device

• US D670,259 S1
• Filed: 02/07/2011
• Issued: 11/06/2012
• Est. Priority Date: 05/02/2008
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Gioscia, Richard, Lee, Seungheon, Bryan, Philip, Matsuoka, Yoshimichi, Chamberlain, Jason
• Primary Examiner(s): ASCH, JEFFREY DAVID
• Application Number:
  US29/385,003
• Time in Patent Office: 638 Days
• Field of Search: D14/138.AD, D14/138.G, D14/138.R, D14/138.AC, D14/138.C, D14/496, D14/341, D14/345, D14/346, D14/203.7, D14/203.1, D14/203.3, D14/203.4, D14/248, 455/575.1, 455/556.2, 455/556.1, 455/575.4, 455/575.3, D10/65, D10/78, D10/104
• US Class Current: D14/138.AD
• CPC Class Codes: N/A

Claims

1. The ornamental design for a housing for a mobile computing device, as shown and described.