Optoelectronic device component package

• US RE35,069 E
• Filed: 06/16/1994
• Issued: 10/24/1995
• Est. Priority Date: 12/12/1990
• Status: Expired due to Term

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Hallenbeck, Gary A., Janson, Wilbert F. Jr., Jones, William B.
• Primary Examiner(s): Westin, Edward P.
• Assistant Examiner(s): Lee, John R.
• Application Number:
  US08/260,574
• Time in Patent Office: 495 Days
• Field of Search: 250/239, 250/216, 250/214.1, 250/214 R, 250/208.1, 257/432, 257/433, 257/434, 257/459, 257/431, 257/678
• US Class Current: 250/216
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An optoelectronic device component package comprises an optical element having a plano surface with a pattern of electrical conductors thereon, a photoelectric die having an optically active portion and die bond pads, and a printed circuit board having a pattern of electrical conductors thereon and further having an aperture for receiving the die. The die is attached to the plano surface of the optical element such that the die bond pads are electrically connected to corresponding electrical conductors of the optical elements. The circuit board is attached to the plano surface of the optical element and the electrical conductors of the circuit board are electrically connected to corresponding conductors of the optical element. A protective means affixed to the die, the plano surface of the optical element, and a portion of the circuit board protects the device package. The die can be (1) an emitter or detector die for camera autofocus applications; or (2) a photometer die for exposure control applications.

Claims

1. An optoelectronic device package comprising:

an optical element having a plano surface, the plano surface having a pattern of electrical conductors thereon;

a photoelectric die having an optically active portion and die bond pads on a front side thereof, the front side being attached to the plano surface of said optical element and the die bond pads being electrically connected to corresponding electrical conductors of said optical element; and

a printed circuit board having a pattern of electrical conductors thereon and further having an aperture for receiving said die, said circuit board being attached to the plano surface of said optical element and the electrical conductors of said circuit board being electrically connected to corresponding conductors of said optical element.

2. An optoelectronic device package as recited in claim 1, further comprising:

means for protecting a back side of said die, the plano surface of said optical element, and a portion of said circuit board.

3. An optoelectronic device package as recited in claim 1, wherein said optical element comprises a lens having a refracting surface on a front side and the plano surface on a back side.

4. An optoelectronic device package as recited in claim 3, wherein the refracting surface comprises an aspherical surface.

5. An optoelectronic device package as recited in claim 3, further comprising:

means for protecting the back side of said die, the plano surface of said lens, and a portion of said circuit board.

6. An optoelectronic device package as recited in claim 3, wherein the plano surface of said lens includes raised bumps, corresponding to first bumps and second bumps, selectively formed therein, and further wherein the electrical conductors of said lens each have a portion overlaying a first bump and a second bump, respectively, at locations for electrical contact, such that the die bond pads are electrically connected to the electrical conductors of said lens at corresponding first bumps and the circuit board conductors are electrically connected to the electrical conductors of said lens at corresponding second bumps.

7. An optoelectronic device package as recited in claim 6, further comprising:

means for protecting the back side of said die, the plano surface of said lens, and a portion of said circuit board.

8. An optoelectronic device package as recited in claim 3, wherein the electrical conductors of said lens each include a first conductive bump and a second conductive bump, the die bond pads being electrically connected to corresponding electrical conductors of said lens via corresponding first conductive bumps, and the circuit board electrical conductors being electrically connected to corresponding electrical conductors of said lens via corresponding second conductive bumps.

9. An optoelectronic device package as recited in claim 8, further comprising:

means for protecting the back side of said die, the plano surface of said lens, and a portion of said circuit board.

10. An optoelectronic device package as recited in claim 3, wherein the die bond pads of said photoelectric die include conductive bumps, the die bond pads being electrically connected to corresponding electrical conductors of said lens via the bond pad conductive bumps, and further wherein the circuit board electrical conductors include conductive bumps, the circuit board electrical conductors being electrically connected to corresponding electrical conductors of said lens via the circuit board conductor conductive bumps.

11. An optoelectronic device package as recited in claim 10, further comprising:

means for protecting the back side of said die, the plano surface of said lens, and a portion of said circuit board.

12. An optoelectronic device component comprising:

an optical element having a plano surface, the plano surface having raised bumps, corresponding to first bumps and second bumps, selectively formed therein, the plano surface further having a pattern of electrical conductors formed thereon, each conductor having a portion thereof overlaying a first bump and a second bump; and

a photoelectric die having an optically active portion and die bond pads on a front side thereof, the front side being attached to the plano surface of said optical element and the die bond pads being electrically connected to corresponding electrical conductors of said optical element at corresponding first bumps.

13. An optoelectronic device package as recited in claim 12, wherein said optical element comprises a lens having a refracting surface on a front side and the plano surface on a back side.

14. An optoelectronic device package as recited in claim 13, wherein the refracting surface comprises an aspherical surface.

15. An optoelectronic device component comprising:

an optical element having a plano surface, the plano surface having a pattern of electrical conductors formed thereon, each conductor having a first conductive bump and a second conductive bump formed thereon; and

a photoelectric die having an optically active portion and die bond pads on a front side thereof, the front side being attached to the plano surface of said optical element and the die bond pads being electrically connected to corresponding electrical conductors of said optical element at corresponding first conductive bumps.

16. An optoelectronic device package as recited in claim 15, wherein said optical element comprises a lens having a refracting surface on a front side and the plano surface on a back side.

17. An optoelectronic device package as recited in claim 16, wherein the refracting surface comprises an aspherical surface. .Iadd.

18. An optoelectronic device component comprising:

an optical element having a plano surface, said optical element including a lens having a refracting surface on a front side and the plano surface on a back side, the plano surface having a pattern of electrical conductors formed thereon and,

a photoelectric die having an optionally active portion and die bond pads on a front side thereof, the front side being attached to the plano surface of said optical element and the die bond pads being electrically connected to corresponding electrical conductors of said optical element by conductive bumps. .Iaddend.