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Semiconductor wire bonding method

  • US RE37,396 E1
  • Filed: 09/26/1996
  • Issued: 10/02/2001
  • Est. Priority Date: 05/07/1993
  • Status: Expired due to Term
First Claim
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1. In a wire bonding process, in which a bond wire is bonded to bond pads formed on a semiconductor die and then to a bond site located on a tip portion of a lead finger of a semiconductor leadframe, utilizing an automated wire bonding apparatus, a method for teaching a location of the bond site on the lead finger, said method comprising the steps of:

  • sensing a location of the lateral edge and a terminal edge of the tip portion of the lead finger using an automated vision sensing system of the wire bonding apparatus;

    determining a location of a longitudinal axis of the tip portion of the lead finger; and

    then locating the bond site on the lead finger along the longitudinal axis of the lead finger and spaced by a predetermined distance from the terminal edge.

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