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Vacuum processing operating method with wafers, substrates and/or semiconductors

  • US RE39,756 E1
  • Filed: 02/01/2002
  • Issued: 08/07/2007
  • Est. Priority Date: 08/29/1990
  • Status: Expired due to Fees
First Claim
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1. A method of treating a sample in a vacuum processing chamber, comprising the steps of:

  • providing a cassette table, for mounting a cassette in which plural samples are stored, disposed under atmospheric pressure;

    supplying said cassette to said cassette table using one of a mechanical transfer and a manual transfer ;

    carrying in the sample from said cassette to the vacuum processing chamber through a lock chamber;

    treating the sample in said vacuum processing chamber; and

    carrying out said treated sample to said cassette through said lock chamber.

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