Methods for forming integrated circuits within substrates
First Claim
1. A method of forming a radio frequency communication device comprising:
- providing a recess within a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit at least partially within the recess and in operative electrical connection with the antenna; and
wherein the antenna is a loop antenna which crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the loop antenna.
3 Assignments
0 Petitions
Accused Products
Abstract
The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a recess in a substrate; b) printing an antenna within the recess; and c) providing an integrated circuit chip and a battery in electrical connection with the antenna. In another aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a substrate having a first recess and a second recess formed therein; b) printing a conductive film between the first and second recesses and within the first and second recesses, the conductive film forming electrical interconnects between and within the first and second recesses; c) providing a first electrical component within the first recess and in electrical connection with the electrical interconnets therein; d) providing a second electrical component within the second recess and in electrical connection with the electrical interconnects therein; and e) covering the first electrical component, the second electrical component and the conductive film with at least one protective cover. In another aspect, the invention includes an embedded circuit comprising: a) a substrate having a recess therein, the recess having a bottom surface and a sidewall surface joined to the bottom surface; b) interconnect circuitry formed on the bottom and sidewall surfaces; and c) an integrated circuit chip within the recess and operatively connected to the interconnect circuitry.
Method of forming a radio frequency identification (RFID) device. In one embodiment, a recess is provided in a plastic substrate containing an integrated circuit comprising RFID circuitry. A conductive material extends over a sidewall of the recess and is coupled to the integrated circuit in a first region and to an antenna in a second region. A flexible film may be disposed over the recess, the integrated circuit, and the conductive material.
129 Citations
58 Claims
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1. A method of forming a radio frequency communication device comprising:
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providing a recess within a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit at least partially within the recess and in operative electrical connection with the antenna; and
wherein the antenna is a loop antenna which crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the loop antenna.
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2. A method of forming an integrated circuit within a substrate comprising:
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providing a recess in a substrate;
providing substantially an entirety of an antenna within the recess; and
providing an integrated circuit chip and a battery supported by the substrate and in operative electrical connection with the antenna.
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3. A method of forming an integrated circuit within a substrate comprising:
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providing a recess in a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit chip and a battery supported by the substrate and in operative electrical connection with the antenna; and
wherein the antenna is provided within the recess and on a portion of the substrate outside of the recess. - View Dependent Claims (4, 5, 7, 8, 9, 10)
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6. A method of forming an integrated circuit within a substrate comprising:
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providing a recess in a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit chip and a battery supported by the substrate and in operative electrical connection with the antenna; and
wherein the antenna is a loop antenna which crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the loop antenna.
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11. A method of forming an integrated circuit within a substrate comprising:
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providing a recess in a substrate;
providing at least a portion of a loop antenna within the recess, the loop antenna comprising a bypass where portions of the antenna cross one another, the bypass comprising a dielectric material between the crossing portions of the antenna; and
providing an integrated circuit chip in operative electrical connection with the antenna. - View Dependent Claims (12)
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13. A method of forming an integrated circuit within a substrate comprising:
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providing a recess in a substrate;
pad printing a conductive material within the recess to form at least a portion of a conductive circuit within the recess and to form at least a portion of an antenna within the recess;
placing an integrated circuit chip within the recess and bonding the integrated circuit chip to the conductive circuit and the antenna; and
placing a battery within the recess and in electrical connection with the integrated circuit chip. - View Dependent Claims (14, 15, 16, 17)
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18. A method of forming an integrated circuit within a substrate comprising:
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providing a substrate having a recess formed therein, said recess having a bottom surface and a sidewall surface joined to the bottom surface;
pad printing a conductive film within the recess to form electrical interconnects within the recess and to form at least a portion of an antenna, the electrical interconnects extending along the bottom surface and the sidewall surface of the recess;
placing an integrated circuit chip within the recess and in electrical connection with the electrical interconnects;
covering the integrated circuit and the conductive film within the recess with a protective cover; and
wherein the integrated circuit comprises radio frequency identification device circuitry, and further comprising placing a battery within the recess and in electrical connection with the radio frequency identification device circuitry through the electrical interconnects.
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19. A method of forming a device comprising:
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providing a recess within a substrate;
providing at least a portion of an antenna within the recess;
providing an integrated circuit at least partially within the recess and in operative electrical connection with the antenna;
wherein the antenna crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the antenna; and
wherein the antenna includes a connection between the integrated circuit and a first antenna portion, the first antenna portion extending from at least partially within the recess to outside the recess, a second connection between the integrated circuit and a second antenna portion, the second antenna portion extending from at least partially within the recess to outside the recess, and a third antenna portion outside of the recess and coupled to the first and second antenna portions.
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20. A method comprising:
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forming a recess in a plastic substrate, the recess having an approximately planar bottom surface and four sidewall surfaces that slope outward from the bottom surface toward an upper surface of the substrate; and
subsequently performing the steps of;
providing a monolithic integrated circuit chip within the recess, the chip comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions, the first and second antenna ports configured to be electrically coupled together via an antenna and, subsequent to the forming of the recess;
providing a first conductive layer coupled to the first antenna port of the chip and extending over at least a portion of a first of the sidewall surfaces; and
providing a second conductive layer coupled to the second antenna port of the chip and extending over at least a portion of a second of the sidewall surfaces. - View Dependent Claims (21, 22, 23, 24)
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25. A method comprising:
providing a plastic substrate comprising a plurality of recesses, each of the recesses having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate; and
subsequently performing the steps of;
disposing a plurality of integrated circuits within the plurality of recesses such that each of the recesses contains an integrated circuit, each of the integrated circuits comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions, the first and second antenna ports configured to be electrically coupled together via an antenna; and
providing a plurality of continuous conductive films, each of the continuous conductive films having a first portion and a second portion, the first portion being coupled to respective ones of the integrated circuits disposed within the recesses and the second portions extending above the upper surface of the substrate. - View Dependent Claims (26, 27, 28, 29)
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30. A method comprising:
forming a recess in a plastic substrate, the recess having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate; and
subsequently performing the steps of;
providing an antenna portion disposed outside of the recess;
disposing an integrated circuit within the recess, the integrated circuit comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions;
disposing a conductive material layer over at least one of the four sidewall surfaces to couple the integrated circuit to the antenna portion outside the recess, wherein the antenna portion is configured to electrically couple the first antenna port to the second antenna port; and
providing a flexible film over the recess, the integrated circuit, and the conductive material layer. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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41. A method comprising:
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providing a plastic substrate comprising a recess, the recess having a bottom surface and sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate, each of the sidewall surfaces sloping outward from the bottom surface toward the upper surface;
providing an antenna, at least a portion of which is a first conductive film disposed above the upper surface;
providing an integrated circuit within the recess, the integrated circuit comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions;
providing a second conductive film, separate from the first conductive film, having a first region coupled to the integrated circuit and a second region coupled to the portion of the antenna; and
disposing a flexible film above the recess, the antenna, the integrated circuit, and the second conductive film, and electrically coupling the first and second antenna ports together via the antenna. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48)
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49. A method comprising:
providing a plastic substrate comprising a plurality of recesses, each of the recesses having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate; and
subsequently performing the steps of;
disposing a plurality of integrated circuits within the plurality of recesses such that each of the recesses contains no more than a single respective integrated circuit, each respective integrated circuit comprising respective RFID circuitry to provide memory and processing functions, the respective RFID circuitry coupled to respective first and second antenna ports configured to be coupled together via a respective antenna; and
forming a plurality of continuous conductive films, each of the continuous conductive films having a first portion and a second portion, the first portion being coupled to respective ones of the integrated circuits disposed within the recesses and the second portion extending above the upper surface of the substrate. - View Dependent Claims (50, 51, 52, 53)
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54. A method comprising:
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providing a substrate comprising a recess, the recess having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate, each of the sidewall surfaces sloping outward from the bottom surface toward the upper surface;
providing an antenna, at least a portion of which is a first conductive material disposed above the upper surface;
providing an integrated circuit within the recess, the integrated circuit comprising RFID circuitry to provide memory and processing functions and coupled to first and second antenna ports of the integrated circuit;
providing a second conductive material, separated from the first conductive material, having a first region coupled to the integrated circuit and disposed above the bottom surface, having a second region coupled to the portion of the antenna and disposed above the upper surface, and having a third region between the first and second regions and disposed above one of the sidewall surfaces; and
disposing a flexible film over the recess, the integrated circuit, the antenna, and the second conductive material, wherein the first and second antenna ports are electrically coupled together via the antenna. - View Dependent Claims (55, 56, 57, 58)
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Specification