Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices

• US RE40,145 E1
• Filed: 02/06/2004
• Issued: 03/11/2008
• Est. Priority Date: 10/17/1995
• Status: Expired due to Term

• Current Assignee: Brian P. King, Carl J. Niedzwiecki, Catherine M. Niedzwiecki, Constance J. Januzzi, Keith R. Leighton, Lois Leighton, Roland A. Januzzi
• Original Assignee: Leighton Technologies LLC (General Patent Corporation)
• Inventors: Leighton, Keith R.
• Primary Examiner(s): La; Anh V.
• Application Number:
  US10/773,810
• Time in Patent Office: 1,495 Days
• Field of Search: 340/572.1, 340/572.4, 340/572.2, 156/298, 156/312, 156/300, 156/311
• US Class Current: 340/572.1
• CPC Class Codes: B32B 2305/342 Chips
• CPC Class Codes: B32B 2309/02 Temperature
• CPC Class Codes: B32B 2309/04 Time
• CPC Class Codes: B32B 2309/12 Pressure
• CPC Class Codes: B32B 2327/06 PVC, i.e. polyvinylchloride
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2429/00 Carriers for sound or information
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 37/08 characterised by the cooling method
• CPC Class Codes: B32B 37/185 Laminating sheets, panels or inserts between two discrete plastic layers
• CPC Class Codes: B32B 38/06 Embossing
• CPC Class Codes: B32B 38/145 Printing
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/068 Features of the lamination press or of the lamination process, e.g. using special separator sheets
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 3/0044 : Mechanical working of the substrate, e.g. drilling or punching H05K3/0008 takes precedence
• CPC Class Codes: H05K 3/281 : by means of a preformed insulating foil H05K3/284 takes precedence
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 156/109 : Embedding of laminae within face of additional laminae

Abstract

A ultra-thin flexible durable radio frequency plastic of other substrate identification device, such as cards, tags, badges, bracelets and labels including at least one electronic element embedded therein and a hot or cold lamination process for the manufacture of radio frequency identification devices including a micro IC chip embedded therein. The process results in a device having an overall thickness in the range of 0.005 inches to 0.033 inches with a surface suitable for receiving dye sublimation printing—the variation in the device thickness across the surface is less than 0.0005 inches. The hot lamination process of the present invention results in an aesthetically pleasing device which can be used as a sticker when adhesive is applied to the device. The invention also relates to a plastic device in all shapes and sizes formed in accordance with the hot lamination process of the present invention and can withstand harsh chemicals and various pressures.

Claims

1. A process for incorporating at least one electronic element in the manufacture of a plastic device comprising the steps of:

(a) providing first and second plastic core sheets;

(b) positioning said at least one electronic element in the absence of a non-electronic carrier directly between said first and second plastic core sheets to form a core, said plastic core sheets defining a pair of inner and outer surfaces of said core;

(c) positioning said core in a laminator apparatus, and subjecting said core to a heat and pressure cycle, said heat and pressure cycle comprising the steps of;

(I) heating said core to a first period of time;

(II) applying a first pressure to said core for a second prior period of time such that said at least one electronic element is encapsulated by said core;

(III) cooling said core while applying a second pressure to said core;

(d) coating at least one of said outer surfaces of said core with a layer of ink; and

(e) applying a layer of overlaminate film to at least one outer surface of said core.

2. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said laminator apparatus has first and second laminating plates, at least one of said first and second laminating plates having a matte finish for creating a textured surface on at least one side of said core.

3. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 2, wherein each of said first and second laminating plates has a matte finish for creating said textured surface on both outer surfaces of said core.

4. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said first and second plastic core sheets are made from a material selected from the group consisting of polyvinyl chloride, polyester, and acrylonitrile-butadiene-styrene, each of said sheets having a thickness in the range of 0.005 inches-0.0125 inches.

5. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said first and second plastic core sheets have a thickness of approximate 0.005 inches-0.0125 inches.

6. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said second pressure is greater than said first pressure.

7. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 6, wherein said second pressure is at least approximately 25% greater than said first pressure.

8. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said core is heated in step (c) (I) to a temperature in the range of 275°

F. to 400°

F.; and

said first period of time is at least five (5) minutes.

9. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said first ram pressure is approximately 1000 p.s.i. and said second period of time is at least 10 minutes.

10. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said step (d) is carried out utilizing a printing process.

11. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said step (d) is carried out utilizing a coating technique selected from the group consisting of silk screen printing, offset printing, letterpress printing, screen printing, roller coating, spray printing and litho-printing.

12. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1 wherein said step (e) of applying a layer of overlaminate film comprises the further steps of:

(a) positioning an overlaminate film on at least one ink coated surface of said core;

(b) subjecting said core to a second heat and pressure cycle comprising the steps of;

(I) heating said core to a temperature between approximately 175°

F. to 300°

F. for approximately 10 to 25 minutes;

(II) applying approximately 1000 p.s.i. ram pressure to said core; and

(III) cooling said core to a temperature in the range of approximately 40°

F. to 65°

F. for approximately 10 to 25 minutes.

13. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said at least one electronic element is a micro-chip and an associated antenna of wire, copper etched, screen printed or litho-printed conductive inks or carbon inks.

14. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said at least one electronic element is a micro-chip and an associated circuit board antenna.

15. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said at least one electronic element is a read/write integrated chip and an associated antenna.

16. The process for incorporating at least one electronic element in the manufacture of a plastic device as recited in claim 1, wherein said at least one electronic element is a micro-chip and an associated printed antenna.

18. The process as recited in claim 15 wherein said first and second core layers are devoid of any appreciable cut outs.

17. A hot lamination process for the manufacture of plastic devices, said process comprising the steps of:

(a) providing first and second plastic core sheets;

(b) positioning at least one electronic element in the absence of a non-electric carrier directly between said first and second plastic sheets to form a layered core;

(c) positioning said core in a laminator apparatus, and subjecting said core to a heat and pressure cycle, said heat and pressure cycle comprising the steps of;

(I) heating said core in said laminator apparatus, in the presence of a minimal first ram pressure, to a temperature which causes controlled flow of said plastic which makes up said first and second plastic core sheets;

(II) applying a second pressure uniformly across said core for encapsulating said at least one electronic element within said controlled flow plastic;

(III) subsequently cooling said core in conjunction with the concurrent applicantion of a third pressure uniformly across said core, said core including upper and lower surfaces.

19. A process for incorporating an electronic element in a plastic device, comprising the steps of:

(a) providing first and second plastic core sheets;

(b) positioning the electronic element between the first and second plastic core sheets to form a core;

(c) positioning the core in a laminator apparatus, and subjecting the core to a heat and pressure cycle, the heat and pressure cycle comprising the steps of;

(I) heating the core;

(II) applying a first pressure to the core such that the electronic element is encapsulated by the core; and

(III) cooling the core while applying a second pressure to the core.

20. The process of claim 19, wherein step (c)(III) comprises cooling the core while applying a second pressure to the core, wherein the second pressure is greater than the first pressure.

21. The process of claim 20, wherein step (b) comprises positioning the electronic element in the absence of a non-electronic carrier between the first and second plastic core sheets to form the core.

22. The process of claim 20, wherein step (b) comprises positioning the electronic element in the absence of a non-electronic carrier directly between the first and second plastic core sheets to form the core.

23. The process of claim 19, wherein step (c)(III) comprises cooling the core while applying a second pressure to the core, wherein the second pressure is approximately at least 10% greater than the first pressure.

24. The process of claim 19, wherein step (c)(I) comprises heating the core under a third pressure, wherein the third pressure is less that the first pressure.

25. The process of claim 20, wherein step (c)(II) comprises applying the first pressure uniformly to the core such that the electronic element is encapsulated by the core.

26. The process of claim 20, wherein step (c)(III) comprises cooling the core while applying the second pressure uniformly to the core.

27. The process of claim 20, wherein the electronic element comprises a micro-chip.

28. The process of claim 27, wherein the electronic element further comprises a circuit board antenna.

29. The process of claim 27, wherein the electronic element includes a protective coating thereon.

30. A process for manufacturing a plastic device that includes an electronic element therein, comprising the steps of:

(a) providing first and second plastic core sheets;

(b) positioning the electronic element between the first and second plastic core sheets to form a core;

(c) positioning the core in a laminator apparatus;

(d) heating the core;

(e) causing the laminator apparatus to apply a first pressure to the core such that the electronic element is encapsulated by the core; and

(f) cooling the core while the laminator apparatus applies a second pressure to the core, wherein the second pressure is greater than the first pressure.

31. The process of claim 30, wherein step (f) comprises cooling the core while the laminator apparatus applies the second pressure to the core, wherein the second pressure is approximately at least 10% greater than the first pressure.

32. The process of claim 31, wherein step (b) comprises positioning the electronic element in the absence of a non-electronic carrier between the first and second plastic core sheets to form the core.

33. The process of claim 31, wherein step (b) comprises positioning the electronic element in the absence of a non-electronic carrier directly between the first and second plastic core sheets to form the core.

34. The process of claim 30, wherein the electronic element comprises a micro-chip.

35. The process of claim 34, wherein the electronic element further comprises a circuit board antenna.

36. The process of claim 34, wherein the electronic element includes a protective coating thereon.

37. A process for incorporating an electronic element in a plastic device, wherein the electronic element has a top surface and a bottom surface, comprising the steps of:

(a) providing top and bottom plastic core sheets;

(b) positioning the electronic element between the top and bottom plastic core sheets to form a core, wherein the top surface of the electronic element is in contact with the top plastic core sheet;

(c) positioning the core in a laminator apparatus, and subjecting the core to a heat and pressure cycle, the heat and pressure cycle comprising the steps of;

(I) heating the core;

(II) applying a first pressure to the core so that the electronic element is encapsulated by the core; and

(iii) cooling the core while applying a second pressure to the core, wherein the second pressure is greater than the first pressure.

38. The process of claim 37, wherein step (c)(III) comprises cooling the core while applying a second pressure to the core, wherein the second pressure is approximately at least 10% greater than the first pressure.

39. The process of claim 37, wherein step (b) comprises positioning the electronic element between the top and bottom plastic core sheets to form the core, wherein the top and bottom surfaces of the electronic element are in contact with the top and bottom plastic core sheets, respectively.

40. The process of claim 37, wherein step (b) comprises positioning the electronic element in the absence of a non-electronic carrier between the top and bottom plastic core sheets to form the core.

41. The process of claim 37, wherein step (b) comprises positioning the electronic element in the absence of a non-electronic carrier directly between the top and bottom plastic core sheets to form the core.

42. The process of claim 37, wherein the electronic element comprises a micro-chip.

43. The process of claim 42, wherein the electronic element further comprises a circuit board antenna.

44. The process of claim 42, wherein the electronic element includes a protective coating thereon.