Hermetic seal and method to create the same

• US RE40,436 E1
• Filed: 07/07/2005
• Issued: 07/15/2008
• Est. Priority Date: 08/01/2001
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: IDC, LLC
• Inventors: Chui, Clarence, Kothari, Manish
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US11/176,878
• Time in Patent Office: 1,104 Days
• Field of Search: 428/46, 428/49, 428/76, 428/192, 428/355.R, 961/54
• US Class Current: 428/46
• CPC Class Codes: B81B 7/0041 maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: Y10T 428/162 Transparent or translucent layer or section
• CPC Class Codes: Y10T 428/166 Glass, ceramic, or metal sections [e.g., floor or wall tile, etc.]
• CPC Class Codes: Y10T 428/239 Complete cover or casing
• CPC Class Codes: Y10T 428/24777 Edge feature
• CPC Class Codes: Y10T 428/2852 Adhesive compositions

Abstract

An electronic display screen is created by processing a mirror on a substrate glass. A back plate glass is then placed on top of the substrate glass and sealed to the back plate glass. A hermetic seal that includes an adhesive mixed with zeolites is disclosed. The hermetic seal can seal the back plate glass with the substrate glass. The application of the hermetic seal is not limited to the electronic display screen. Rather, the hermetic seal can be used to seal a variety of surfaces including metals, polymers, plastics, alloys, ceramics and the like.

Claims

1. A micro-electromechanical systems based device package comprising:

a back plate glass;

a substrate glass;

at least one mirror located between the substrate glass and the back plate glass;

the at lease one mirror being configured to be actuated in an electronic display; and

a bead of an adhesive mixed with a zeolite, the adhesive applied between the back plate glass and the substrate glass; and

, wherein the adhesive is applied substantially around the outer perimeter of the at least one mirror.

a mirror processed on the substrate glass.

2. The micro-electromechanical systems based device package of claim 1, including the bead being applied around the perimeter of the mirror.

3. The micro-electromechanical systems based device package of claim 1, wherein the bead adhesive acts as a hermetic seal.

4. The micro-electromechanical systems based device package of claim 1, wherein the bead adhesive traps moisture and other contaminant gases that can be harmful to the mirror.

5. The micro-electromechanical systems based device package of claim 1, wherein the micro-electromechanical systems device includes an electronic display screen.

23. The micro-electromechanical systems device of claim 1, wherein the adhesive is applied as a bead between the back plate glass and the substrate glass.

28. The micro-electromechanical systems device of claim 1, wherein the at least one mirror comprises a plurality of mirrors, and wherein the adhesive is applied substantially around the perimeter of the plurality of mirrors.

6. A micro-electromechanical systems based (MEMS) device package comprising:

a back plate glass;

a substrate glass;

at least one MEMS structure located between the substrate glass and the back plate glass;

and

a bead of an adhesive mixed with zeolites of different pore sizes, the adhesive applied between the back plate glass and the substrate glass, wherein the zeolites of different pore sizes are selected to absorb molecules of different diameters, wherein the adhesive is applied substantially around the outer perimeter of the at least one MEMS structure.

7. The micro-electromechanical systems based device package of claim 6, wherein some of the zeolites have a pore size to allow absorption of molecules having a diameter of up to ten angstroms.

8. The micro-electromechanical systems based device package of claim 6, wherein some of the zeolites have a pore size to allow absorption of molecules having a diameter of less than two angstroms.

9. The micro-electromechanical systems based device package of claim 6, wherein the pore sizes of some of the zeolites allow absorption of nitrogen and carbon dioxide molecules.

24. The micro-electromechanical systems device of claim 6, wherein the adhesive is applied as a bead between the back plate glass and the substrate glass.

25. The micro-electromechanical systems device of claim 6, wherein the adhesive acts as a hermetic seal.

10. A micro-electromechanical systems based (MEMS) device package comprising:

a back plate glass;

a substrate glass;

at least one MEMS structure located between the substrate glass and the back plate glass, the at least one MEMS structure being configured to be actuated;

and

a bead of an adhesive mixed with a zeolite, the adhesive applied between the back plate glass and the substrate glass, wherein the zeolite is selected to have a pore size which allows the zeolite to absorb a contaminant gas that is outgassed by components of the packagethe at least one MEMS structure, and wherein said pore size is up to about fifty Angstroms, wherein the adhesive is supplied substantially around the outer perimeter of the at least one MEMS structure.

11. The micro-electromechanical systems based device package of claim 10, wherein the zeolite has a pore size that allows it to absorb aromatic branched-chain hydrocarbons.

12. The micro-electromechanical systems based device package of claim 10, wherein the zeolite has a pore size that allows it to absorb hydrogen molecules.

13. The micro-electromechanical systems based device package of claim 10, wherein the zeolite has a pore size that allows it to absorb nitrogen and carbon dioxide molecules.

26. The micro-electromechanical systems device of claim 10, wherein the adhesive is applied as a bead between the back plate glass and the substrate glass.

27. The micro-electromechanical systems device of claim 10, wherein the adhesive acts as a hermetic seal.

14. A micro-electromechanical systems (MEMS) device, comprising:

a back plate;

a substrate;

at least one reflective MEMS device located between the substrate glass and the back plate glass; and

an adhesive mixed with a zeolite, the adhesive applied between the back plate and the substrate, wherein the zeolite is selected to absorb contaminant molecules outgassed by the at least one MEMS device, said contaminant molecules having a diameter of up to about ten angstroms, and wherein the adhesive is applied substantially around the outer perimeter of the at least one MEMS device.

15. The micro-electromechanical systems device of claim 14, wherein the zeolite is selected to absorb molecules having a diameter less than about two angstroms.

16. The micro-electromechanical systems device of claim 14, wherein the zeolite is selected to have a pore size between about two and three angstroms.

17. The micro-electromechanical systems device of claim 14, wherein the zeolite is selected to absorb aromatic branched-chain hydrocarbons.

18. The micro-electromechanical systems device of claim 14, wherein the zeolite is selected to absorb hydrogen molecules.

19. The micro-electromechanical systems device of claim 14, wherein the zeolite is selected to absorb moisture molecules.

20. A micro-electromechanical systems device, comprising:

a back plate;

a substrate;

at least one mirror located between the substrate and the back plate, the at least one mirror being configured to be actuated; and

an adhesive mixed with a zeolite, the adhesive applied between the back plate and the substrate, wherein the zeolite is selected to have a pore size of about fifty angstroms, and wherein the adhesive is applied substantially around the outer perimeter of the at least one mirror.

21. The micro-electromechanical systems device of claim 20, wherein the zeolite is selected to absorb nitrogen.

22. The micro-electromechanical systems device of claim 20, wherein the zeolite is selected to absorb carbon dioxide.