Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
First Claim
1. An electronic device and coupled flexible circuit board comprising:
- the electronic device, including;
a substrate having a back surface;
a plurality of electronic components coupled to the substrate; and
a plurality of device electrical contacts coupled to the back surface of the substrate and electrically coupled to the plurality of electronic components;
the flexible circuit board including;
a flexible substrate having a front surface and a back surface;
and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate corresponding to plurality of device electrical contacts;
a plurality of Z-interconnections, each Z-interconnection electrically and mechanically coupling one device electrical contact to a corresponding circuit board electrical contact; and
a fill layer mechanically coupling a portion of the back surface of the electronic device to a corresponding portion of the front surface of the flexible substrate.
4 Assignments
0 Petitions
Accused Products
Abstract
An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.
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Citations
48 Claims
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1. An electronic device and coupled flexible circuit board comprising:
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the electronic device, including;
a substrate having a back surface;
a plurality of electronic components coupled to the substrate; and
a plurality of device electrical contacts coupled to the back surface of the substrate and electrically coupled to the plurality of electronic components;
the flexible circuit board including;
a flexible substrate having a front surface and a back surface;
anda plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate corresponding to plurality of device electrical contacts;
a plurality of Z-interconnections, each Z-interconnection electrically and mechanically coupling one device electrical contact to a corresponding circuit board electrical contact; and
a fill layer mechanically coupling a portion of the back surface of the electronic device to a corresponding portion of the front surface of the flexible substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 20)
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14. An electronic device and coupled flexible circuit board comprising:
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the electronic device including;
a substrate having a back surface;
a plurality of electronic components coupled to the substrate; and
a plurality of device electrical contacts coupled to the back surface of the substrate and electrically coupled to the plurality of electronic components;
the flexible circuit board including;
a flexible substrate having a front surface and a back surface;
anda plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate corresponding to plurality of device electrical contacts;
a plurality of Z-interconnections, each Z-interconnection electrically and mechanically coupling one device electrical contact to a corresponding circuit board electrical contact;
wherein the flexible substrate of the flexible circuit board includes an elevated portion which extends away from the back surface of the substrate of the electronic device, and none of the plurality of circuit board electrical contacts is formed on the elevated portion of the flexible substrate of the flexible circuit board. - View Dependent Claims (15)
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16. An electronic device and coupled flexible circuit board comprising:
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the electronic device including;
a substrate having a back surface;
a plurality of electronic components coupled to the substrate; and
a plurality of device electrical contacts coupled to the back surface of the substrate and electrically coupled to the plurality of electronic components;
the flexible circuit board including;
a flexible substrate having a front surface and a back surface;
anda plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate corresponding to plurality of device electrical contacts;
a plurality of Z-interconnections, each Z-interconnection electrically and mechanically coupling one device electrical contact to a corresponding circuit board electrical contact;
wherein;
the flexible circuit board further includes a thermal conduction thermally conductive coating formed on at least a portion of the front surface of the flexible substrate; and
the thermal conduction thermally conductive coating is not electrically coupled to the plurality of electrical contacts formed on the front surface of the flexible substrate. - View Dependent Claims (17)
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18. An electronic device and coupled flexible circuit board comprising:
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the electronic device, including;
a substrate having a back surface;
a plurality of electronic components coupled to the substrate;
anda plurality of device electrical contacts coupled to the back surface of the substrate and electrically coupled to the plurality of electronic components;
the flexible circuit board including;
a flexible substrate having a front surface and a back surface; and
a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate corresponding to plurality of device electrical contacts;
anda plurality of Z-interconnections, each Z-interconnection electrically and mechanically coupling one device electrical contact to a corresponding circuit board electrical contact;
wherein the flexible circuit board further includes a thermal conduction thermally conductive coating formed on at least a portion of the back surface of the flexible substrate.
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19. An electronic device and coupled flexible circuit board comprising:
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the electronic device including;
a substrate having a back surface;
a plurality of electronic components coupled to the substrate; and
a plurality of device electrical contacts coupled to the back surface of the substrate and electrically coupled to the plurality of electronic components;
the flexible circuit board including;
a flexible substrate having a front surface and a back surface; and
a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate corresponding to plurality of device electrical contacts;
a plurality of Z-interconnections, each Z-interconnection electrically and mechanically coupling one device electrical contact to a corresponding circuit board electrical contact;
wherein the flexible circuit board further includes a heat sink coupled to the back surface of the flexible substrate.
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21. An apparatus, comprising:
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a first substrate having a front surface and a back surface;
a plurality of electrical contacts coupled to the front surface of the first substrate and corresponding to a plurality of device electrical contacts coupled to an electronic device;
a plurality of Z-interconnections, wherein the individual Z-interconnections are configured to couple an electrical contact to a corresponding device electrical contact coupled to the electronic device; and
a fill layer configured to couple the front surface of the first substrate to a corresponding portion of a back surface of the electronic device, wherein the fill layer comprises a plurality of thermally conductive, non-electrically conductive particles within an organic material. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. An apparatus, comprising:
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a flexible substrate having a front surface and a back surface;
a plurality of electrical contacts coupled to the front surface of the flexible substrate and corresponding to a plurality of device electrical contacts coupled to a device substrate of an electronic device; and
a plurality of Z-interconnections, wherein the individual Z-interconnections are configured to couple an electrical contact to a corresponding device electrical contact in the electronic device, wherein the flexible substrate comprises an elevated portion extending away from a back surface of the device substrate and none of the plurality of electrical contacts is formed on the elevated portion of the flexible substrate. - View Dependent Claims (38, 39, 40)
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41. An apparatus comprising:
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a first substrate having a front surface and a back surface;
a thermally conductive coating formed on at least a portion of the first substrate and configured for lateral heat diffusion;
a plurality of electrical contacts coupled to the front surface of the first substrate and corresponding to a plurality of device electrical contacts coupled to an electronic device; and
a plurality of Z-interconnections, wherein the individual Z-interconnections are configured to couple an electrical contact to a corresponding device electrical contact of the electronic device. - View Dependent Claims (42, 43, 44, 45, 46)
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47. An electronic device, comprising:
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a substrate having a surface;
a plurality of electrical contacts coupled to the surface of the substrate;
a plurality of Z-interconnections coupled to the electrical contacts; and
a thermally conductive, non-electrically conductive fill layer around the Z-interconnections;
wherein the fill layer comprises thermally conductive, non-electrically conductive particles in an organic matrix and the Z-interconnections comprise electrically conductive particles in an organic matrix. - View Dependent Claims (48)
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Specification