Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
First Claim
1. A method of manufacturing an electronic device, which includes a substrate having a non-planar back surface and a first thermal expansion coefficient, a plurality of electronic components coupled to the substrate, and a plurality of device electrical contacts coupled to the non-planar back surface of the substrate and electrically coupled to the plurality of electronic components, and a coupled flexible circuit board, which includes a flexible substrate having a front surface and a back surface, and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate corresponding to plurality of device electrical contacts, comprising the steps of:
- a) providing the electronic device;
b) providing the flexible circuit board;
c) forming a plurality of conductive bumps on at least one of the electronic device and the flexible circuit board, for each device electrical contact, a conductive bump formed on at least one of that device electrical contact and a corresponding circuit board electrical contact;
d) aligning the plurality of device electrical contacts of the electronic device and the corresponding plurality of circuit board electrical contacts;
e) pressing the electronic device and the flexible circuit board together such that at least one of the plurality of conductive bumps spans the gap between each device electrical contact and the corresponding circuit board electrical contact; and
f) curing the plurality of conductive bumps to form a plurality of Z-interconnections electrically and mechanically coupling the plurality of device electrical contacts to the corresponding plurality of circuit board electrical contacts, wherein the at least one of the front or back surfaces of the flexible substrate is non-planar.
1 Assignment
0 Petitions
Accused Products
Abstract
An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.
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Citations
51 Claims
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1. A method of manufacturing an electronic device, which includes a substrate having a non-planar back surface and a first thermal expansion coefficient, a plurality of electronic components coupled to the substrate, and a plurality of device electrical contacts coupled to the non-planar back surface of the substrate and electrically coupled to the plurality of electronic components, and a coupled flexible circuit board, which includes a flexible substrate having a front surface and a back surface, and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate corresponding to plurality of device electrical contacts, comprising the steps of:
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a) providing the electronic device; b) providing the flexible circuit board; c) forming a plurality of conductive bumps on at least one of the electronic device and the flexible circuit board, for each device electrical contact, a conductive bump formed on at least one of that device electrical contact and a corresponding circuit board electrical contact; d) aligning the plurality of device electrical contacts of the electronic device and the corresponding plurality of circuit board electrical contacts; e) pressing the electronic device and the flexible circuit board together such that at least one of the plurality of conductive bumps spans the gap between each device electrical contact and the corresponding circuit board electrical contact; and f) curing the plurality of conductive bumps to form a plurality of Z-interconnections electrically and mechanically coupling the plurality of device electrical contacts to the corresponding plurality of circuit board electrical contacts, wherein the at least one of the front or back surfaces of the flexible substrate is non-planar. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method comprising:
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forming an electrical contact on a first surface of a flexible substrate; forming a device electrical contact on a non-planar surface of a device substrate; and forming a Z-interconnection, wherein the Z-interconnection electrically and mechanically couples the electrical contact on the flexible substrate to the device electrical contact on the non-planar surface of the device substrate, and wherein the first surface of the flexible substrate is non-planar after said forming a Z-interconnection. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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44. A method comprising:
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forming a conductive bump on at least one of a flexible substrate or a device substrate; aligning an electrical contact of the flexible substrate with a corresponding device electrical contact located on a non-planar surface of the device substrate such that the flexible substrate comprises a non-planar surface; and curing the conductive bump to form a Z-interconnection between the flexible substrate and the device substrate, wherein the Z-interconnection electrically and mechanically couples the electrical contact of the flexible substrate to the corresponding device electrical contact located on the non-planar surface of the device substrate. - View Dependent Claims (45, 46, 47)
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48. A method comprising:
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forming a conductive bump between an electrical contact of a flexible substrate and a corresponding device electrical contact on a non-planar surface of a device substrate; and curing the conductive bump to form a Z-interconnection between the flexible substrate and the device substrate, wherein the Z-interconnection is configured to electrically and mechanically couple the electrical contact of the flexible substrate to the corresponding device electrical contact on the non-planar surface of the device substrate. - View Dependent Claims (49, 50, 51)
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Specification