Post passivation metal scheme for high-performance integrated circuit devices
First Claim
1. A post passivation interconnect structure, comprising:
- one or more internal circuits comprising one or more active devices formed in and on a semiconductor substrate;
a fine line metallization system, formed over said semiconductor substrate in one or more thin layers of dielectric;
a passivation layer over said fine line metallization system;
a thick, wide metallization system formed above said passivation layer, wherein said thick, wide metallization system is used as a distribution network for a clock or signal voltage, and wherein said thick, wide metallization system is connected to said one or more internal circuits; and
at least one wire-bondable bond pad created over said thick layers of dielectric, said at least one bond pad being connected with said thick, wide metallization system.
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Abstract
A new post-passivation metal interconnect scheme is provided over the surface of a IC device that has been covered with a conventional layer of passivation. The metal scheme of the invention comprises, overlying a conventional layer of passivation, thick and wide metal lines in combination with thick layers of dielectric and bond pads. The interconnect system of the invention can be used for the distribution of power, ground, signal and clock lines from bond pads to circuits of a device that are provided in any location of the IC device without introducing significant power drop. No, or smaller ESD circuits are required due to the low impedance post-passivation interconnection, since any accumulated electrostatic discharge will be evenly distributed across all junction capacitance of the circuits on the chip. The post passivation metal scheme is connected to external circuits through bond pads, solder bonding, TAB bonding and the like. A top layer of the interconnect metal scheme is formed using a composite metal for purposes of wirebonding, the composite metal is created over a bulk conduction metal. A diffusion metal may be applied between the bulk metal and the composite metal, in addition a layer of Under-Barrier-Metal (UBM) may be required underneath the bulk conduction metal.
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Citations
119 Claims
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1. A post passivation interconnect structure, comprising:
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one or more internal circuits comprising one or more active devices formed in and on a semiconductor substrate; a fine line metallization system, formed over said semiconductor substrate in one or more thin layers of dielectric; a passivation layer over said fine line metallization system; a thick, wide metallization system formed above said passivation layer, wherein said thick, wide metallization system is used as a distribution network for a clock or signal voltage, and wherein said thick, wide metallization system is connected to said one or more internal circuits; and at least one wire-bondable bond pad created over said thick layers of dielectric, said at least one bond pad being connected with said thick, wide metallization system. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for creating a post passivation interconnect structure, comprising:
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providing one or more internal circuits comprising one or more active devices formed in and on a semiconductor substrate; providing a fine line metallization system, formed over said semiconductor substrate in one or more thin layers of dielectric; providing a passivation layer over said fine line metallization system; providing a thick, wide metallization system formed above said passivation layer, in one or more thick layers of dielectric, wherein said thick layers of dielectric are thicker than said thin layers of dielectric, wherein said thick, wide metallization system is used as a distribution network for a clock or signal voltage, and wherein said thick, wide metallization system is connected to said one or more internal circuits; and providing at least one wire-bondable bond pad created over said thick layers of dielectric, said at least one wire-bondable bond pad being connected with said thick, wide metallization system. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65)
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44. A method for creating a post passivation interconnect structure, comprising:
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providing a substrate, active devices having been created in or on the substrate, a layer of fine-line interconnect metal including top metal being connected to said active devices having been provided over the substrate, said top metal comprising wire-bondable metal, said top metal comprising at least one first portion of top metal which comprises a bond pad, said top metal further comprising at least one second portion of top metal that needs to be connected to said first portion of top metal, a layer of passivation having been provided over the layer of fine-line interconnect metal; patterning and etching a first, second and a third opening through the layer of passivation, said first opening being aligned with a portion of said first portion of top metal, said second opening being aligned with a portion of said first portion of top metal, said third opening being aligned with a portion of said second portion of top metal, exposing said first and second portion of top metal; depositing a first layer of dielectric, preferably comprising polyimide, over said layer of passivation, including said first, second and third openings created in said layer of passivation; patterning and etching the deposited first layer of dielectric, creating a fourth, a fifth and a sixth openings through said first layer of dielectric, said fourth opening through said first layer of dielectric being aligned with said first opening created through said layer of passivation, said fifth and sixth openings through said first layer of dielectric respectively being aligned with said second and third openings created through the layer of passivation; creating a first layer metal over said first layer of dielectric, creating a second layer of metal serving as seed layer over said first layer of metal; creating an exposure mask, preferably comprising photoresist, over the created second layer of metal, exposing the second layer of metal only over the surface area of the second layer of metal at least in a region over and between said second and third opening while not exposing said first opening; creating a patterned third layer of metal over the exposed surface of the second layer of metal; creating a patterned fourth layer of metal over the patterned third layer of metal; removing the exposure mask, exposing the second layer of metal, leaving in place a mask of the patterned third and fourth layers of metal in place overlying the second layer of metal; etching the second and the first layers of metal in accordance with the masking of third and fourth layers of metal overlying these second and first layers of metal, through selection of an etchant to avoid etch damage to said top metal in said bond pad, thereby exposing said bond pad and a portion of said passivation layer and said first layer of dielectric; depositing a second layer of dielectric over the patterned fourth layer of metal and the first layer of dielectric, preferably comprising polyimide; and patterning and etching the deposited second layer of dielectric, creating an opening through the second layer of dielectric that aligns with said bond pad. - View Dependent Claims (45, 46, 47, 48, 49, 50, 51, 52)
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66. A method of forming post passivation interconnect structure, comprising:
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providing one or more internal circuits comprising one or more active devices formed in and on a semiconductor substrate; providing a fine line metallization system, formed over said semiconductor substrate in one or more thin layers of dielectric; providing a passivation layer over said fine line metallization system; providing a thick, wide metallization system formed above said passivation layer, in one or more thick layers of dielectric, wherein said thick layers of dielectric are thicker than said thin layers of dielectric, wherein said thick, wide metallization system is used as a distribution network for a clock or signal voltage, and wherein said thick, wide metallization system is connected to said one or more internal circuits; and providing at least one wire-bondable bond pad adjacent to said thick layers of dielectric, said at least one wire-bondable bond pad being connected with said thick, wide metallization system. - View Dependent Claims (67, 68, 69)
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70. A chip comprising:
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a silicon substrate; an active device in and on said silicon substrate; a dielectric layer over said silicon substrate; a metal layer over said silicon substrate; a passivation layer on said dielectric layer, wherein a first opening in said passivation layer is over a first contact point of said metal layer, and said first contact point is at a bottom of said first opening, and wherein a second opening in said passivation layer is over a second contact point of said metal layer, and said second contact point is at a bottom of said second opening; a polymer layer on said passivation layer, wherein a third opening in said polymer layer is over said first contact point, and a fourth opening in said polymer layer is over said second contact point; and a metallization structure on said polymer layer and said first and second contact points, wherein said metallization structure is connected to said first contact point through said third opening and connected to said second contact point through said fourth opening, wherein said first contact point is connected to said second contact point through said metallization structure, wherein said metallization structure comprises an adhesion layer on said polymer layer and said first and second contact points, a copper-containing seed layer over said adhesion layer, and an electroplated copper layer over said copper-containing seed layer, wherein said adhesion layer is under said electroplated copper layer, but is not at a sidewall of said electroplated copper layer. - View Dependent Claims (71, 72, 73, 74, 75, 76, 91)
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77. A chip comprising:
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a silicon substrate; an active device in and on said silicon substrate; a dielectric layer over said silicon substrate; a metal layer over said silicon substrate; a passivation layer on said dielectric layer, wherein a first opening in said passivation layer is over a first contact point of said metal layer, and said first contact point is at a bottom of said first opening, and wherein a second opening in said passivation layer is over a second contact point of said metal layer, and said second contact point is at a bottom of said second opening; an interconnecting structure over said passivation layer and on said first and second contact points, wherein said interconnecting structure is connected to said first contact point through said first opening and connected to said second contact point through said second opening, wherein said first contact point is connected to said second contact point through said interconnecting structure, wherein no polymer layer is between said passivation layer and said interconnecting structure, wherein said interconnecting structure comprises an adhesion layer over said passivation layer and on said first and second contact points, a copper-containing seed layer over said adhesion layer, and an electroplated copper layer over said copper-containing seed layer, wherein said adhesion layer is under said electroplated copper layer, but is not at a sidewall of said electroplated copper layer; and a polymer layer over said interconnecting structure and said passivation layer, wherein said polymer layer covers a top surface and a sidewall of said interconnecting structure. - View Dependent Claims (78, 79, 80, 81, 82, 83, 92)
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84. A chip comprising:
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a silicon substrate; an active device in and on said silicon substrate; a dielectric layer over said silicon substrate; a metal layer over said silicon substrate; a passivation layer on said dielectric layer, wherein a first opening in said passivation layer is over a first contact point of said metal layer, and said first contact point is at a bottom of said first opening, and wherein a second opening in said passivation layer is over a second contact point of said metal layer, and said second contact point is at a bottom of said second opening; a first polymer layer on said passivation layer, wherein a third opening in said first polymer layer is over said first contact point, and a fourth opening in said first polymer layer is over said second contact point; an interconnecting structure on said first polymer layer and said first and second contact points, wherein said interconnecting structure is connected to said first contact point through said third opening and connected to said second contact point through said fourth opening, wherein said first contact point is connected to said second contact point through said interconnecting structure, wherein said interconnecting structure comprises an adhesion layer on said first polymer layer and said first and second contact points, a copper-containing seed layer over said adhesion layer, and an electroplated copper layer over said copper-containing seed layer, wherein said adhesion layer is under said electroplated copper layer, but is not at a sidewall of said electroplated copper layer; and a second polymer layer on said interconnecting structure and said first polymer layer, wherein said second polymer layer covers a top surface and a sidewall of said interconnecting structure. - View Dependent Claims (85, 86, 87, 88, 89, 90, 93)
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94. A chip comprising:
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a silicon substrate; an active device in and on said silicon substrate; a dielectric layer over said silicon substrate; a first metal layer over said silicon substrate; a separating layer on said dielectric layer, wherein a first opening in said separating layer is over a first contact point of said first metal layer, and said first contact point is at a bottom of said first opening, and wherein a second opening in said separating layer is over a second contact point of said first metal layer, and said second contact point is at a bottom of said second opening; an interconnecting layer over said separating layer and on said first and second contact points, wherein said interconnecting layer is connected to said first contact point through said first opening and connected to said second contact point through said second opening, wherein said first contact point is connected to said second contact point through said interconnecting layer, wherein no polymer layer is between said separating layer and said interconnecting layer, wherein said interconnecting layer comprises an adhesion layer over said separating layer and on said first and second contact points, and a second metal layer over said adhesion layer, wherein said adhesion layer is under said second metal layer, but is not at a sidewall of said second metal layer; and a polymer layer over said interconnecting layer and said separating layer, wherein said polymer layer covers a top surface and a sidewall of said interconnecting layer wherein no opening in said polymer layer is over said interconnecting layer. - View Dependent Claims (95, 96, 97, 98)
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99. A chip comprising:
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a silicon substrate; an active device in and on said silicon substrate; a first dielectric layer over said silicon substrate; a metal layer over said silicon substrate and in said first dielectric layer, wherein said metal layer comprises a damascene metal; a passivation layer on said first dielectric layer, wherein a first opening in said passivation layer is over a first contact point of said metal layer, and said first contact point is at a bottom of said first opening, and wherein a second opening in said passivation layer is over a second contact point of said metal layer, and said second contact point is at a bottom of said second opening; an interconnecting structure on said passivation layer and said first and second contact points, wherein said first contact point is connected to said second contact point through said interconnecting structure, wherein said interconnecting structure comprises a first adhesion layer and a first copper layer over said first adhesion layer, wherein said interconnecting structure has a top surface at a horizontal level; a second dielectric layer on said top surface and over said passivation layer, wherein a third opening in said second dielectric layer is over a third contact point of said interconnecting structure, and said third contact point is at a bottom of said third opening, wherein said third contact point is connected to said first contact point through said first opening, and said third contact point is connected to said second contact point through said second opening, wherein said second dielectric layer comprises a polymer layer over said top surface and across an edge of said interconnecting structure, wherein said polymer layer comprises a first portion over said horizontal level and a second portion under said horizontal level, wherein said second dielectric layer covers said top surface and a sidewall of said interconnecting structure; and a metallization structure on said polymer layer and said third contact point, wherein said metallization structure is connected to said third contact point through said third opening, wherein said metallization structure comprises a second adhesion layer and a second copper layer over said second adhesion layer. - View Dependent Claims (100, 101, 102, 103, 104, 105)
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106. A chip comprising:
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a silicon substrate; an active device in and on said silicon substrate; a dielectric layer over said silicon substrate; a metal layer over said silicon substrate and in said dielectric layer, wherein said metal layer comprises a damascene metal, wherein said metal layer has a first top surface with a first region, a second region and a third region between said first and second regions, wherein said first top surface is substantially coplanar with a second top surface of said dielectric layer; a passivation layer on said first and second regions and said second top surface, wherein a first opening in said passivation layer is over said third region, and said third region is at a bottom of said first opening; a first polymer layer on said passivation layer, wherein a second opening in said first polymer layer is over said third region; and a metallization structure over said silicon substrate, wherein said metallization structure is connected to said third region through said second opening, wherein said metallization structure comprises an aluminum layer having a thickness greater than 1 micrometer. - View Dependent Claims (107, 108, 109, 110, 111, 112)
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113. A chip comprising:
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a silicon substrate; a first dielectric layer over said silicon substrate; an interconnecting structure in said first dielectric layer, wherein said interconnecting structure comprises a damascene metal; a separating layer over said first dielectric layer, wherein multiple first vias are in said separating layer; an interconnect over said separating layer, wherein said interconnect comprises an aluminum layer, wherein said multiple first vias are connected to each other through said interconnect; and a second dielectric layer over said separating layer, wherein said second dielectric layer has a portion over said interconnect, wherein a second via in said portion is vertically over said interconnect and one of said multiple first vias. - View Dependent Claims (114, 115, 116, 117, 118, 119)
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Specification