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Method for patterning a multilayered conductor/substrate structure

  • US RE44,071 E1
  • Filed: 07/13/2006
  • Issued: 03/12/2013
  • Est. Priority Date: 02/14/2001
  • Status: Expired due to Term
First Claim
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1. A method for patterning a multilayered conductor/substrate structure comprising the steps of:

  • providing a multilayered conductor/substrate structure which includes a plastic substrate and at least one conductive layer overlying the plastic substrate; and

    irradiating the multilayered conductor/substrate structure with ultraviolet radiation such that portions of the at least one conductive layer are ablated therefrom;

    wherein the irradiating step comprises employing an excimer laser of a projection-type ablation system to ablate portions of the at least one conductive layer by illuminating a mask with a collimated laser beam andemploying projection optics positioned between the mask and the at least one conductive layer to project a pattern from the mask onto the at least one conductive layer.

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