Method of clearing electrical contact pads in thin film sealed OLED devices
First Claim
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1. A process of cleaning wire bond pads associated with OLED devices formed on a substrate using a shadow mask wherein the shadow mask has openings adapted to align with the active matrix display region and the wire bond pad region, the method comprising the steps of (a) depositing a conductive layer on a substrate;
- (b) placing the shadow mask over the conductive layer;
(c) depositing an organic material layer on the conductive layer through the openings in the shadow mask to form an OLED pattern on the conductive layer in the active matrix display region and cover the wire bond pad region;
(d) removing the shadow mask;
forming a thin film encapsulation layer over substantially the entire surface of the wafer; and
applying a laser beam to the wire bond pad region of the wafer so as to remove the organic material and all layers above same to expose the wire bond pads.
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Abstract
A process of cleaning wire bond pads associated with OLED devices, including the steps of depositing on the wire bond pads one or more layers of ablatable material, and ablating the one or more layers with a laser, thereby exposing a clean wire bond pad.
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Citations
12 Claims
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1. A process of cleaning wire bond pads associated with OLED devices formed on a substrate using a shadow mask wherein the shadow mask has openings adapted to align with the active matrix display region and the wire bond pad region, the method comprising the steps of (a) depositing a conductive layer on a substrate;
- (b) placing the shadow mask over the conductive layer;
(c) depositing an organic material layer on the conductive layer through the openings in the shadow mask to form an OLED pattern on the conductive layer in the active matrix display region and cover the wire bond pad region;
(d) removing the shadow mask;
forming a thin film encapsulation layer over substantially the entire surface of the wafer; and
applying a laser beam to the wire bond pad region of the wafer so as to remove the organic material and all layers above same to expose the wire bond pads. - View Dependent Claims (2, 3, 4, 5)
- (b) placing the shadow mask over the conductive layer;
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6. A process of cleaning wire bond pads associated with OLED devices formed on a substrate using a shadow mask wherein the shadow mask has openings adapted to align with the active matrix display region and the wire bond pad region, the process comprising:
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depositing a conductive layer on a substrate; placing the shadow mask over the conductive layer; depositing an organic material layer on the conductive layer through the openings in the shadow mask to cover the active matrix display region and the wire bond pad region; removing the shadow mask; forming one or more encapsulation layers over substantially the entire surface of the wafer; and applying a laser beam to the wire bond pad region of the wafer so as to remove the organic material and all layers above same to expose the wire bond pads. - View Dependent Claims (7, 8, 9, 10)
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11. A process for forming an OLED device, the process comprising:
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forming a conductive layer over a substrate, the conductive layer comprising a wire bond pad region and an active matrix display region; positioning a shadow mask over the conductive layer, the shadow mask having first opening and a second opening, the first opening corresponding to the wire bond pad region and the second opening corresponding to the active display matrix region; depositing an organic material through the first and second openings of the shadow mask to form an organic material layer over the wire bond pad region and the active matrix display region; forming one or more layers over the organic material layer; and applying a directed energy source to the wire bond pad region to remove the organic material layer and all layers above the organic material layer. - View Dependent Claims (12)
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Specification