Liquid crystal panel assembly and liquid crystal display apparatus having the same

• US RE47,196 E1
• Filed: 10/06/2015
• Issued: 01/08/2019
• Est. Priority Date: 03/13/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Cho, Jin-hyun, Kang, Joon
• Primary Examiner(s): TORRES VELAZQUEZ, NORCA LIZ
• Application Number:
  US14/876,369
• Time in Patent Office: 1,190 Days
• Field of Search: 349 58, 349 65, 349612
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G02F 1/133615 Edge-illuminating devices, i.e. illuminating from the side
• CPC Class Codes: G02F 2001/133314 Back frame
• CPC Class Codes: G02F 2001/133317 Intermediate frame, e.g. between backlight housing and front frame
• CPC Class Codes: G02F 2001/133334 Electromagnetic shield
• CPC Class Codes: G02F 2001/133628 with cooling means

Abstract

A liquid crystal panel assembly includes a liquid crystal panel, a backlight module having at least one light emitting diode (LED) light source to irradiate light to the liquid crystal panel, and a housing which surrounds the liquid crystal panel and the backlight module. At least a portion of the housing adjacent to the at least one LED light source is formed of a thermal-conductive material.

Claims

1. A liquid crystal panel assembly comprising:

a liquid crystal panel;

a backlight module having at least one light emitting diode (LED) light source which irradiates light to the liquid crystal panel and a light guide plate which guides light from the at least one LED light source; and

a housing which surrounds the liquid crystal panel and the backlight module,

wherein at least a portion of the housing is formed of a thermal-conductive material, and

wherein the housing is arranged to be in contact with a circuit board of the at least one LED light source so that heat is transmitted from the circuit board of the at least one LED light source to the housing.

2. The liquid crystal panel assembly as claimed in claim 1,

wherein the housing comprises a front housing and a rear housing, and the rear housing is formed of the thermal-conductive material.

3. The liquid crystal panel assembly as claimed in claim 2,

wherein at least a portion of the rear housing near the at least one LED light source is formed of the thermal-conductive material.

4. The liquid crystal panel assembly as claimed in claim 1,

wherein the housing comprises a front housing and a rear housing, and the rear housing is arranged to be in contact with the circuit board of the at least one LED light source so that heat is transmitted from the circuit board of the lat least one LED light source to the rear housing.

5. The liquid crystal panel assembly as claimed in claim 4,

wherein the rear housing is arranged to be in indirect contact with the circuit board of the at least one LED light source so that heat is transmitted from the circuit board of the lat least one LED light source to the rear housing.

6. A liquid crystal panel assembly comprising:

a liquid crystal panel;

a backlight module having at least one light emitting diode (LED) light source which irradiates light to the liquid crystal panel and a light guide plate which guides light from the at least one LED light source; and

a front housing and a rear housing which surround the liquid crystal panel and the backlight module,

wherein at least a portion of the rear housing near the at least one LED light source is formed of a thermal-conductive material, and

wherein the rear housing is arranged to be in contact with a circuit board of the at least one LED light source so that heat is transmitted from the circuit board of the at least one LED light source to the rear housing.

7. The liquid crystal panel assembly as claimed in claim 6,

wherein the rear housing is arranged to be in indirect contact with the circuit board of the at least one LED light source so that heat is transmitted from the circuit board of the lat least one LED light source to the rear housing.

8. A liquid crystal panel assembly comprising:

a liquid crystal panel;

a frame to which the liquid crystal panel is mounted, wherein a least a portion of the frame is formed of a first thermal-conductive material;

a backlight module having at least one light emitting diode (LED) light source which irradiates light to the liquid crystal panel and a light guide plate which guides light from the at least one LED light source; and

a housing which surrounds the liquid crystal panel and the backlight module,

wherein at least a portion of the housing is formed of a second thermal-conductive material, and

wherein the housing is arranged to be in contact with a circuit board of the at least one LED light source so that heat is transmitted from the circuit board of the at least one LED light source to the housing.

9. The liquid crystal panel assembly as claimed in claim 8,

wherein the housing comprises a front housing and a rear housing, and the rear housing is formed of the second thermal-conductive material.

10. The liquid crystal panel assembly as claimed in claim 8,

wherein the housing comprises a front housing and a rear housing, and at least a portion of the rear housing near the at least one LED light source is formed of the second thermal-conductive material.

11. The liquid crystal panel assembly as claimed in claim 8,

wherein the housing comprises a front housing and a rear housing, and the rear housing is arranged to be in contact with the circuit board of the at least one LED light source so that heat is transmitted from the circuit board of the at least one LED light source to the rear housing.

12. The liquid crystal panel assembly as claimed in claim 11,

wherein the rear housing is arranged to be in indirect contact with the circuit board of the at least one LED light source so that heat is transmitted from the circuit board of the at least one LED light source to the rear housing.

13. An electronic apparatus comprising:

a liquid crystal panel;

a backlight module including a plurality of light emitting diodes (LEDs) to irradiate light to the liquid crystal panel via a light guide plate, the plurality of LEDs mounted to a LED circuit member;

a thermal-conductive backlight housing to support the backlight module, the LED circuit member is mounted to the thermal-conductive backlight housing;

a thermal-conductive frame which forms an external appearance of the electronic apparatus and surrounds the thermal-conductive backlight housing; and

a plurality of electronic components disposed between the thermal-conductive backlight housing and the thermal-conductive frame.

14. The electronic apparatus according to claim 13, wherein the LED circuit member is mounted to the housing such that heat generated by the LEDs transfers to at least a portion of the thermal-conductive housing.

15. The electronic apparatus according to claim 13, wherein the plurality of electronic components are disposed between a rear surface of the housing and a front surface of the frame.

16. The electronic apparatus according to claim 15, wherein the frame is formed of an electric-conductive material so as to intercept electromagnetic waves generated from the electronic components.

17. The electronic apparatus according to claim 16, wherein the electric-conductive material includes aluminum.

18. The electronic apparatus according to claim 15, wherein the plurality of electronic components comprise a drive circuit to drive the liquid crystal panel.

19. The electronic apparatus according to claim 15, wherein the plurality of electronic components comprise a power supply to supply electric power.

20. The electronic apparatus according to claim 15, wherein the plurality of electronic components comprise an inverter.