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Surface acoustic wave device and method of adjusting LC component of surface acoustic wave device

  • US RE47,410 E1
  • Filed: 11/23/2016
  • Issued: 05/28/2019
  • Est. Priority Date: 04/16/2003
  • Status: Expired due to Fees
First Claim
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1. A device, comprising:

  • an electrode pad comprising a first wiring pattern and a second wiring pattern connected together at a common end and electrically short-circuited by a first stud bump, wherein an entirety of a second stud bump is located on at least one of the first wiring pattern or the second wiring pattern, and the electrode pad is electrically connected to an inter-digital transducer attached to a piezoelectric substrate.

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