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Light emitting device package and backlight unit comprising the same

  • US RE47,444 E1
  • Filed: 05/05/2016
  • Issued: 06/18/2019
  • Est. Priority Date: 11/17/2011
  • Status: Active Grant
First Claim
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1. A light emitting element package, comprising:

  • a lead frame;

    a light emitting element on the lead frame;

    a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element;

    a reflection structure having an opening that corresponds to the opening of the molded material and contacting the molded material; and

    an adhesive layer provided in at least part of a region between the molded material and the reflection structure to fix the reflection structure onto the molded material,wherein the adhesive layer has a first thickness in an area adjacent to the light emitting element and a second thickness in an area away from the light emitting element, and wherein the first thickness is greater than the second thickness.

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