Stressed substrates for transient electronic systems
First Claim
1. A transient electronic device comprising:
- a stressed substrate including at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress and being operably integrally connected to the at least one tensile stress layer such that the residual tensile and compressive stresses are self-equilibrating; and
a trigger mechanism attached to the stressed substrate and including means for generating configured to generate an initial fracture in said stressed substrate,wherein said residual tensile and compressive stresses are sufficient to generate secondary fractures in response to said initial fracture that propagate throughout through said stressed substrate, whereby said stressed substrate is powderized.
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Abstract
A stressed substrate for transient electronic systems (i.e., electronic systems that visually disappear when triggered to do so) that includes one or more stress-engineered layers that store potential energy in the form of a significant internal stress. An associated trigger mechanism is also provided that, when triggered, causes an initial fracture in the stressed substrate, whereby the fracture energy nearly instantaneously travels throughout the stressed substrate, causing the stressed substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. The internal stress is incorporated into the stressed substrate through strategies similar to glass tempering (for example through heat or chemical treatment), or by depositing thin-film layers with large amounts of stress. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.
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Citations
25 Claims
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1. A transient electronic device comprising:
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a stressed substrate including at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress and being operably integrally connected to the at least one tensile stress layer such that the residual tensile and compressive stresses are self-equilibrating; and a trigger mechanism attached to the stressed substrate and including means for generating configured to generate an initial fracture in said stressed substrate, wherein said residual tensile and compressive stresses are sufficient to generate secondary fractures in response to said initial fracture that propagate throughout through said stressed substrate, whereby said stressed substrate is powderized. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for manufacturing a transient electronic device comprising:
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forming a stressed substrate including at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress and being operably integrally connected to the at least one tensile stress layer such that residual tensile and compressive stresses are self-equilibrating; and disposing a trigger mechanism configured to generate an initial fracture in the stressed substrate and one or more electronic elements on the stressed substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method comprising:
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actuating a trigger mechanism attached to a stressed substrate, the stressed substrate including at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress and being operably integrally connected to the at least one tensile stress layer such that the residual tensile and compressive stresses are self-equilibrating; and generating an initial fracture in said stressed substrate in response to actuating the trigger mechanism, wherein the residual tensile and compressive stresses of the stressed substrate are sufficient to generate secondary fractures in response to the initial fracture, the secondary fractures propagating through the stressed substrate. - View Dependent Claims (22, 23, 24, 25)
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Specification