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Stressed substrates for transient electronic systems

  • US RE47,570 E1
  • Filed: 10/06/2017
  • Issued: 08/13/2019
  • Est. Priority Date: 10/11/2013
  • Status: Active Grant
First Claim
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1. A transient electronic device comprising:

  • a stressed substrate including at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress and being operably integrally connected to the at least one tensile stress layer such that the residual tensile and compressive stresses are self-equilibrating; and

    a trigger mechanism attached to the stressed substrate and including means for generating configured to generate an initial fracture in said stressed substrate,wherein said residual tensile and compressive stresses are sufficient to generate secondary fractures in response to said initial fracture that propagate throughout through said stressed substrate, whereby said stressed substrate is powderized.

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