Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device
First Claim
1. A hermetically sealed feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:
- a) an electrically conductive ferrule comprising a ferrule sidewall defining a ferrule opening extending to a ferrule body fluid end surface and to a ferrule device side end surface, wherein, when the ferrule is attached to an opening in a housing of an AIMD, the ferrule body fluid end surface and the ferrule device side end surface reside outside the AIMD and inside the AIMD, respectively;
b) an alumina substrate comprised of at least 96% alumina and having a thickness extending from to a substrate body fluid side and to a substrate device side, wherein the alumina substrate resides in the ferrule opening where the alumina substrate is hermetically sealed to the ferrule;
b) ac) an active via hole disposedextending through the alumina substrate fromto the substrate body fluid side and to the substrate device side, wherein a counter-bore in the substrate is aligned with the active via hole and has a depth that extends from the substrate body fluid side part-way into the substrate thickness;
c)d) a substantially closed pore and substantially pureclosed-pore platinum fill disposed withinthat is hermetically sealed to the alumina substrate in the active via hole and, the substantially closed-pore platinum extending betweento the counter-bore at the substrate body fluid side and to or adjacent to the substrate device side of the alumina substrate; and
d) a hermetic seal between the platinum fill and the alumina substrate,e) an electrically conductive bond pad comprising a pad portion and a post, wherein the pad portion at least partially resides in the counter-bore on the substrate body fluid side with the post extending into the substantially closed-pore platinum in the active via hole, andf) wherein the platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill pad portion of the bond pad has an uninterrupted upper surface of a width that is greater than a diameter of the via hole, andg) wherein the combined length of the pad portion and the post of the bond pad is less than the substrate thickness.
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Accused Products
Abstract
A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
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Citations
74 Claims
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1. A hermetically sealed feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:
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a) an electrically conductive ferrule comprising a ferrule sidewall defining a ferrule opening extending to a ferrule body fluid end surface and to a ferrule device side end surface, wherein, when the ferrule is attached to an opening in a housing of an AIMD, the ferrule body fluid end surface and the ferrule device side end surface reside outside the AIMD and inside the AIMD, respectively; b) an alumina substrate comprised of at least 96% alumina and having a thickness extending from to a substrate body fluid side and to a substrate device side, wherein the alumina substrate resides in the ferrule opening where the alumina substrate is hermetically sealed to the ferrule; b) ac) an active via hole disposedextending through the alumina substrate fromto the substrate body fluid side and to the substrate device side, wherein a counter-bore in the substrate is aligned with the active via hole and has a depth that extends from the substrate body fluid side part-way into the substrate thickness; c)d) a substantially closed pore and substantially pureclosed-pore platinum fill disposed withinthat is hermetically sealed to the alumina substrate in the active via hole and, the substantially closed-pore platinum extending betweento the counter-bore at the substrate body fluid side and to or adjacent to the substrate device side of the alumina substrate; and d) a hermetic seal between the platinum fill and the alumina substrate, e) an electrically conductive bond pad comprising a pad portion and a post, wherein the pad portion at least partially resides in the counter-bore on the substrate body fluid side with the post extending into the substantially closed-pore platinum in the active via hole, and f) wherein the platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill pad portion of the bond pad has an uninterrupted upper surface of a width that is greater than a diameter of the via hole, and g) wherein the combined length of the pad portion and the post of the bond pad is less than the substrate thickness. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 66, 70, 71, 72, 73)
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49. A hermetically sealed feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:
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a) an electrically conductive ferrule comprising a ferrule sidewall defining a ferrule opening extending to a ferrule body fluid end surface and to a ferrule device side end surface, wherein, when the ferrule is attached to an opening in a housing of an AIMD, the ferrule body fluid end surface and the ferrule device side end surface reside outside the AIMD and inside the AIMD, respectively; b) an alumina substrate comprised of at least 96% alumina and having a thickness extending from to a substrate body fluid side and to a substrate device side, wherein the alumina substrate resides in the ferrule opening where the alumina substrate is hermetically sealed to the ferrule; b)c) a via hole disposed through the alumina substrate from, the via hole extending to the substrate body fluid side and to the substrate device side, wherein a counter-bore in the substrate is aligned with the via hole and has a depth that extends from the substrate body fluid side part-way into the substrate thickness; c)d) a substantially closed pore and substantially pureclosed-pore platinum fill disposed withinin the via hole and extending betweento the counter-bore at the substrate body fluid side and to or adjacent to the substrate device side of the alumina substrate; and d) a hermetic seal between the platinum fill ande) wherein the platinum in the via hole is hermetically sealed to the alumina substrate, and e)f) wherein the hermetic seal has a leak rate that is no greater than 1×
10−
7 std cc He/sec,; and
f)g) an electrically conductive bond pad comprising a pad portion and a post, wherein the pad portion resides in the counter-bore with the post extending into the platinum in the via hole, and h) wherein the platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill pad portion of the bond pad has an uninterrupted upper surface of a width that is greater than a diameter of the via hole, and i) wherein the combined length of the pad portion and the post of the bond pad is less than the substrate thickness. - View Dependent Claims (50, 51, 67)
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52. A hermetically sealed feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:
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a) an electrically conductive ferrule comprising a ferrule sidewall defining a ferrule opening extending to a ferrule body fluid end surface and to a ferrule device side end surface, wherein, when the ferrule is attached to an opening in a housing of an AIMD, the ferrule body fluid end surface and the ferrule device side end surface reside outside the AIMD and inside the AIMD, respectively; b) an alumina substrate comprised of at least 96% alumina and having a thickness extending from to a substrate body fluid side and to a substrate device side, wherein the alumina substrate resides in the ferrule opening where the alumina substrate is hermetically sealed to the ferrule; b) ac) an active via hole disposed through the alumina substrate from, the active via hole extending to the substrate body fluid side and to the substrate device side; c)d) a first substantially closed pore and substantially pureclosed-pore platinum fill disposed within in the active via hole and, the substantially closed-pore platinum extending between to the substrate body fluid side and to or adjacent to the substrate device side of the alumina substrate, wherein the first substantially closed-pore platinum fill forms a tortuous and mutually conformal knitline or interface between in the active via hole forms a first hermetic seal with the alumina substrate and the platinum fill;
at a first tortuous and mutually conformal knitline, andd) a hermetic seal between the first platinum fill and the alumina substrate,e) wherein the first hermetic seal has a leak rate that is no greater than 1×
10−
7 std cc He/sec;e)f) a groundedground via hole disposedextending through the alumina substrate fromto the substrate body fluid side and to the substrate device side; f)g) a second substantially closed poreclosed-pore platinum fill disposed within in the grounded ground via hole and extending between to the substrate body fluid side and to or adjacent to the substrate device side of the alumina substrate;
, wherein the second substantially closed-pore platinum in the ground via hole forms a second hermetic seal with the alumina substrate at a second tortuous and mutually conformal knitline, andg) a second hermetic seal between the second platinum fill and the alumina substrate,h) wherein the second hermetic seal has a leak rate that is no greater than 1×
10−
7 std cc He/sec;h)i) at least one groundedground electrode plate that is electrically coupled to the second groundedsubstantially closed-pore platinum filleddisposed within the ground via andhole, but is in a non-conductive relation towith the first substantially closed-pore platinum filleddisposed within the active via hole; and i)j) an outer metallization disposed on the alumina dielectric substrate and being electrically connected to the plurality of grounded at least one ground electrode plates plate, k) wherein at least one of the active via hole and the ground via hole has a counter-bore aligned with the via hole, the counter-bore having a depth that extends from the substrate body fluid side part-way into the substrate thickness; and l) an electrically conductive bond pad comprising a pad portion and a post, wherein the pad portion resides in the counter-bore with the post extending into the first and second substantially closed-pore platinum in the respective at least one of the active via hole and the ground via hole, and m) wherein the pad portion of the bond pad has an uninterrupted upper surface of a width that is greater than a diameter of the via hold, and n) wherein the combined length of the pad portion and the post of the bond pad is less than the substrate thickness. - View Dependent Claims (53, 54, 68)
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55. A hermetically sealed feedthrough that is attachable to an active implantable medical device, the feedthrough comprising:
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a) an electrically conductive ferrule comprising a ferrule sidewall defining a ferrule opening extending to a ferrule body fluid end surface and to a ferrule device side end surface, wherein, when the ferrule is attached to an opening in a housing of an AIMD, the ferrule body fluid end surface and the ferrule device side end surface reside outside the AIMD and inside the AIMD, respectively; b) an alumina substrate comprised of at least 96% alumina and having a thickness extending to a substrate first side and to a substrate second side, wherein the alumina substrate resides in the ferrule opening where the alumina substrate is hermetically sealed to the ferrule; c) an active via hole extending through the alumina substrate to the substrate first side and to the substrate second side, wherein a counter-bore in the substrate is aligned with the active via hole and has a depth that extends from the substrate first side part-way into the substrate thickness; d) a substantially closed-pore platinum that is hermetically sealed to the alumina substrate in the active via hole, the substantially closed-pore platinum extending to the counter-bore at the substrate first side and to or adjacent to the substrate second side; and e) an electrically conductive bond pad comprising a pad portion and a post, wherein the pad portion resides in the counter-bore with the post extending into the substantially closed-pore platinum in the active via hole, and f) wherein the pad portion of the bond pad has an uninterrupted upper surface of a width that is greater than a diameter of the via hole, and g) wherein the combined length of the pad portion and the post of the bond pad is less than the substrate thickness. - View Dependent Claims (56, 57, 58, 69)
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59. A hermetically sealed feedthrough that is attachable to an active implantable medical device, the feedthrough comprising:
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a) an electrically conductive ferrule comprising a ferrule sidewall defining a ferrule opening extending to a ferrule body fluid end surface and to a ferrule device side end surface, wherein, when the ferrule is attached to an opening in a housing of an AIMD, the ferrule body fluid end surface and the ferrule device side end surface reside outside the AIMD and inside the AIMD, respectively; b) an alumina substrate comprised of at least 96% alumina and having a thickness extending to a substrate first side and to a substrate second side, wherein the alumina substrate resides in the ferrule opening where the alumina substrate is hermetically sealed to the ferrule; c) an active via hole extending through the alumina substrate to the substrate first side and to the substrate second side, wherein a counter-bore in the substrate is aligned with the active via hole and has a depth that extends from the substrate first side part-way into the substrate thickness; d) a substantially closed-pore platinum that is hermetically sealed to the alumina substrate in the active via hole, the substantially closed-pore platinum extending to the counter-bore at the substrate first side and to or adjacent to the substrate second side; and e) an electrically conductive leadwire connection feature extending to a leadwire connection feature first portion having a leadwire connection feature first end and to a leadwire connection feature second portion, wherein the leadwire connection feature first portion is seated on the substrate first side in the counter-bore with the leadwire connection feature first end residing adjacent to the substrate first side, and wherein the leadwire connection feature second portion extends into the substantially closed-pore platinum in the active via hole, and f) wherein the leadwire connection feature first portion has an uninterrupted upper surface of a width that is greater than a diameter of the via hole, and g) wherein the combined length of the leadwire connection feature first and second portions is less than the substrate thickness. - View Dependent Claims (60, 61, 62, 63)
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64. A feedthrough insulator substrate assembly, comprising:
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a) an insulator substrate having a thickness extending to a substrate body fluid side and to a substrate device side, wherein the insulator substrate resides in the ferrule opening where the substrate is hermetically sealed to the ferrule; b) an active via hole extending through the insulator substrate to the substrate body fluid side and to the substrate device side, wherein a counter-bore in the substrate is aligned with the active via hole and has a depth that extends from the substrate body fluid side part-way into the substrate thickness; c) a substantially closed-pore platinum that is hermetically sealed to the insulator substrate in the active via hole, the substantially closed-pore platinum extending to the counter-bore at the substrate body fluid side and to or adjacent to the substrate device side; and d) an electrically conductive bond pad comprising a pad portion and a post, wherein the pad portion resides in the counter-bore, seated on the substrate body fluid side with the post extending into the substantially closed-pore platinum in the active via hole, and wherein the pad portion of the bond pad has a height that is greater than the depth of the counter-bore so that part of the pad portion in the counter-bore extends outwardly beyond the substrate body fluid side bordering the counter-bore, and wherein the substantially closed-pore platinum resides in the counter-bore contacting the pad portion of the bond pad, and e) wherein the pad portion of the bond pad has an uninterrupted upper surface of a width that is greater than a diameter of the via hole, and f) wherein the combined length of the pad portion and the post of the bond pad is less than the substrate thickness. - View Dependent Claims (65)
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74. A hermetically sealed feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:
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a) an electrically conductive ferrule comprising a ferrule sidewall defining a ferrule opening extending to a ferrule body fluid end surface and to a ferrule device side end surface, wherein, when the ferrule is attached to an opening in a housing of an AIMD, the ferrule body fluid end surface and the ferrule device side end surface reside outside the AIMD and inside the AIMD, respectively; b) an alumina substrate comprised of at least 96% alumina and having a thickness extending to a substrate body fluid side and to a substrate device side, wherein the alumina substrate resides in the ferrule opening where the alumina substrate is hermetically sealed to the ferrule; c) an active via hole extending through the alumina substrate to the substrate body fluid side and to the substrate device side; d) a substantially closed-pore platinum that is hermetically sealed to the alumina substrate in the active via hole, the substantially closed-pore platinum extending to or adjacent to the substrate body fluid side and to or adjacent to the substrate device side; and e) an electrically conductive double-sided crimp post disposed through the substantially closed-pore platinum in the active via hole, the double-sided crimp post comprising a crimp post first end adjacent to the substrate body fluid side and a crimp post second end adjacent to the substrate device side.
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Specification