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Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device

  • US RE47,624 E1
  • Filed: 02/05/2016
  • Issued: 10/01/2019
  • Est. Priority Date: 01/16/2012
  • Status: Active Grant
First Claim
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1. A hermetically sealed feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:

  • a) an electrically conductive ferrule comprising a ferrule sidewall defining a ferrule opening extending to a ferrule body fluid end surface and to a ferrule device side end surface, wherein, when the ferrule is attached to an opening in a housing of an AIMD, the ferrule body fluid end surface and the ferrule device side end surface reside outside the AIMD and inside the AIMD, respectively;

    b) an alumina substrate comprised of at least 96% alumina and having a thickness extending from to a substrate body fluid side and to a substrate device side, wherein the alumina substrate resides in the ferrule opening where the alumina substrate is hermetically sealed to the ferrule;

    b) ac) an active via hole disposedextending through the alumina substrate fromto the substrate body fluid side and to the substrate device side, wherein a counter-bore in the substrate is aligned with the active via hole and has a depth that extends from the substrate body fluid side part-way into the substrate thickness;

    c)d) a substantially closed pore and substantially pureclosed-pore platinum fill disposed withinthat is hermetically sealed to the alumina substrate in the active via hole and, the substantially closed-pore platinum extending betweento the counter-bore at the substrate body fluid side and to or adjacent to the substrate device side of the alumina substrate; and

    d) a hermetic seal between the platinum fill and the alumina substrate,e) an electrically conductive bond pad comprising a pad portion and a post, wherein the pad portion at least partially resides in the counter-bore on the substrate body fluid side with the post extending into the substantially closed-pore platinum in the active via hole, andf) wherein the platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill pad portion of the bond pad has an uninterrupted upper surface of a width that is greater than a diameter of the via hole, andg) wherein the combined length of the pad portion and the post of the bond pad is less than the substrate thickness.

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