Active-by-active programmable device
First Claim
1. An integrated circuit (IC) system, comprising:
- a package substrate having a programmable integrated circuit (IC) die and a companion IC die mounted thereon, the programmable IC die including a programmable fabric and the companion IC die including application circuitry;
a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC die, a second SiP IO circuit disposed in the companion IC die, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit;
first aggregation and first dispersal circuits in the programmable IC die coupled between the programmable fabric and the first SiP IO circuit; and
second aggregation and second dispersal circuits in the companion IC die coupled between the application IO and the second SiP IO circuit;
wherein the first and second SiP IO circuits are configured to multiplex multi-channel output of the first and second aggregation circuits, respectively, onto a first plurality of physical channels implemented over the conductive interconnect; and
de-multiplex input from a second plurality of channels implemented over the conductive interconnect onto multi-channel input of the first and second dispersal circuits, respectively.
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Accused Products
Abstract
An example integrated circuit (IC) system includes a package substrate having a programmable integrated circuit (IC) and a companion IC mounted thereon, the programmable IC including a programmable fabric and the companion IC including application circuitry. The IC system further includes a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC, a second SiP IO circuit disposed in the companion IC, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit. The IC System further includes first aggregation and first dispersal circuits in the programmable IC coupled between the programmable fabric and the first SiP IO circuit. The IC system further includes second aggregation and second dispersal circuits in the companion IC coupled between the application circuitry and the second SiP IO circuit.
47 Citations
19 Claims
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1. An integrated circuit (IC) system, comprising:
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a package substrate having a programmable integrated circuit (IC) die and a companion IC die mounted thereon, the programmable IC die including a programmable fabric and the companion IC die including application circuitry; a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC die, a second SiP IO circuit disposed in the companion IC die, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit; first aggregation and first dispersal circuits in the programmable IC die coupled between the programmable fabric and the first SiP IO circuit; and second aggregation and second dispersal circuits in the companion IC die coupled between the application IO and the second SiP IO circuit; wherein the first and second SiP IO circuits are configured to multiplex multi-channel output of the first and second aggregation circuits, respectively, onto a first plurality of physical channels implemented over the conductive interconnect; and
de-multiplex input from a second plurality of channels implemented over the conductive interconnect onto multi-channel input of the first and second dispersal circuits, respectively. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A programmable integrated circuit (IC), comprising:
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a system-in-package (SiP) input/output (IO) circuit configured to be coupled to a companion IC through external conductive interconnect; a programmable fabric without at least a portion of application circuitry; and aggregation and dispersal circuits coupled between the programmable fabric and the SiP IO circuit; wherein the aggregation and the dispersal circuits comprise a system-level interconnect coupled between programmable interconnect of the programmable fabric and the SiP IO circuit; and wherein the system-level interconnect comprises a network-on-chip (NoC). - View Dependent Claims (10, 11, 12)
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13. A method of transmitting data from a programmable integrated circuit (IC) in an IC system, the method comprising:
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coupling the data to a first system-in-package (SiP) IO circuit through a plurality of channels of an aggregation circuit in the programmable IC; transmitting the data from the plurality of channels by multiplexing the data over a smaller number of physical channels implemented over a conductive interconnect between the programmable IC and a companion IC; receiving the data from the plurality of physical channels at a second SiP IO circuit in the companion IC; and coupling the data from the second SiP IO circuit to application circuitry in the companion IC by demultiplexing the data through a plurality of channels of a dispersal circuit in the companion IC. - View Dependent Claims (14, 15, 16, 17)
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18. An integrated circuit (IC) system, comprising:
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a package substrate having a programmable integrated circuit (IC) die and a companion IC die mounted thereon, the programmable IC die including a programmable fabric and the companion IC die including application circuitry; a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC die, a second SiP IO circuit disposed in the companion IC die, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit; first aggregation and first dispersal circuits in the programmable IC die coupled between the programmable fabric and the first SiP IO circuit; and second aggregation and second dispersal circuits in the companion IC die coupled between the application IO and the second SiP IO circuit; wherein the programmable IC die comprises a direct connection to the companion IC die separate from the SiP bridge.
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19. An integrated circuit (IC) system, comprising:
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a package substrate having a programmable integrated circuit (IC) die and a companion IC die mounted thereon, the programmable IC die including a programmable fabric and the companion IC die including application circuitry; a system-in-package (SiP) bridge including a first SiP IO circuit disposed in the programmable IC die, a second SiP IO circuit disposed in the companion IC die, and conductive interconnect on the package substrate electrically coupling the first SiP IO circuit and the second SiP IO circuit; first aggregation and first dispersal circuits in the programmable IC die coupled between the programmable fabric and the first SiP IO circuit; and second aggregation and second dispersal circuits in the companion IC die coupled between the application IO and the second SiP IO circuit; wherein the programmable IC die includes arbitration logic, and wherein the first SiP IO circuit comprises a data link circuit and a transceiver circuit, where; an internal interface of the data link circuit is coupled to the first aggregation and the first dispersal circuits; an external interface of the data link circuit is coupled to an internal interface of the transceiver circuit; an external interface of the transceiver circuit is coupled to the conductive interconnect; and a control interface of the data link circuit is coupled to the arbitration logic.
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Specification