Thermal array system

• US 10,002,779 B2
• Filed: 08/30/2012
• Issued: 06/19/2018
• Est. Priority Date: 08/30/2011
• Status: Active Grant

• Current Assignee: Watlow Electric Manufacturing Company
• Original Assignee: Watlow Electric Manufacturing Company
• Inventors: Swanson, Cal T., Schmidt, Phillip S., Lemke, John F.
• Primary Examiner(s): Angwin, David
• Assistant Examiner(s): Bae, Gyounghyun
• Application Number:
  US13/598,995
• Publication Number:
  US 20130105457A1
• Time in Patent Office: 2,119 Days
• Field of Search: 219209, 219240, 219254, 219255, 219256, 219257, 219258, 219259, 219260, 219262, 219263, 219264, 219268, 219269, 219406, 219407, 219408, 219409, 219410, 219413, 219414, 219417, 219418, 219419, 2194431, 2194441, 2194451, 2194461, 2194471, 21944811, 21944812, 21944814, 21944817, 2194581, 2194591, 2194601, 2194611, 2194621, 2194631, 2194651, 2194681, 219476-480, 219481-506, 219507-519, 219520-537, 219538-553, 392307, 361103, 361115, 361230, 361233, 361234, 451296, 279128, 700 23, 359265
• CPC Class Codes: H01L 21/67098 Apparatus for thermal treatment
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/67248 Temperature monitoring
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H05B 1/00 Details of electric heating devices
• CPC Class Codes: H05B 1/02 Automatic switching arrangements specially adapted to apparatus ; Control of heating devices thermally-actuated switches H01H37/00
• CPC Class Codes: H05B 1/0202 Switches
• CPC Class Codes: H05B 1/0227 Applications
• CPC Class Codes: H05B 1/0233 for semiconductors manufacturing
• CPC Class Codes: H05B 2203/005 using multiple resistive elements or resistive zones isolated from each other
• CPC Class Codes: H05B 2203/013 Heaters using resistive films or coatings
• CPC Class Codes: H05B 2213/03 Heating plates made out of a matrix of heating elements that can define heating areas adapted to cookware randomly placed on the heating plate
• CPC Class Codes: H05B 3/02 Details
• CPC Class Codes: H05B 3/06 Heater elements structurally combined with coupling elements or holders
• CPC Class Codes: H05B 3/20 Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater H05B3/62, H05B3/68, H05B3/78, H05B3/84 take precedence
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A thermal array system is provided. The system includes a first thermal element and a second thermal element connected between a first node and a second node. The first thermal element being activated and the second thermal element being deactivated by a first polarity of the first node relative to the second node. Further, the first thermal element being deactivated and the second thermal element being activated by a second polarity of the first node relative to the second node.

Claims

1. A thermal system comprising:

a plurality of thermal elements comprising a plurality of first thermal elements and a plurality of second thermal elements, wherein the plurality of first thermal elements and the plurality of second thermal elements form a plurality of parallel pairs, wherein each parallel pair has one first thermal element and one second thermal element connected in parallel;

a plurality of switches;

a positive power line;

a negative power line; and

a control system having a plurality of first power nodes having a first polarity and a plurality of second power nodes having a second polarity,

wherein each parallel pair of first and second thermal elements is in electrical series with a first unidirectional circuit in forward bias and a second unidirectional circuit in reverse bias respectively, and the first and second thermal elements are connected between one of the plurality of the first power nodes and one of the plurality of the second power nodes, the first thermal element being activated and the second thermal element being deactivated by the first polarity of the one of the first power nodes relative to the one of the second power nodes, the first thermal element being deactivated and the second thermal element being activated by the second polarity of the one of the first power nodes relative to the one of the second power nodes, and

wherein the control system controls the plurality of switches such that the positive power line can be routed to any one of the plurality of first and second power nodes and the negative power line can also be routed to a corresponding one of the plurality of second and first power nodes to control which pair of the first and second thermal elements receive power and which one of the first and second thermal elements is activated to generate heat.

2. The system of claim 1, wherein the first and the second unidirectional circuits comprise a silicon controlled rectifier (SCR).

3. The system of claim 2, wherein the first and the second unidirectional circuits comprise a diode and a zener diode.

4. The system of claim 3, wherein the SCR has an anode connected to the anode of the diode, the cathode of the diode being connected to the cathode of the zener diode, and the anode of the zener diode being connected to the gate of the SCR.

5. The system of claim 3, wherein the SCR has an anode connected to the cathode of the zener diode, the anode of the diode being connected to the anode of the zener diode, and the cathode of the diode being connected to the gate of the SCR.

6. The system of claim 1, wherein a thermal element of the plurality of thermal elements is connected between each pair of the first and second power nodes.

7. The system of claim 1, wherein the control system is configured to apply selectively an activation voltage, a return voltage, and an open-circuit condition to each of the power nodes.

8. The system of claim 1, wherein the control system is configured to define a plurality of control modes, each control mode being configured to energize at least one thermal element of the plurality of thermal elements.

9. The system of claim 8, wherein the control system is configured to determine which set of control modes of the plurality of control modes will drive each thermal element to a predefined set point for each mode.

10. The system of claim 1, wherein the thermal element is a dissipative element.

11. The system of claim 10, wherein the thermal element is a resistive element.

12. The system of claim 11, wherein the thermal elements are comprised of an electrically conductive material with a temperature dependent electrical resistance.

13. The system of claim 12, wherein the control system is configured to measure the resistance of the resistive element to calculate a temperature of the resistive element.

14. The system of claim 1, wherein the control system comprises a pair of transistors for each node, a first transistor of the pair being configured to connect the node to a supply power, a second transistor of the pair being configured to connect the node to a return, wherein a shunt is connected between the return and the second transistor or between the supply power and the first transistor.

15. The system of claim 14, wherein the control system is configured to measure the voltage across the shunt or the current through the shunt.

16. The system of claim 14, wherein the first and second transistors are field effect transistors and a drain of the first transistor is connected to the supply voltage and the source of the first transistor is connected to the node, the drain of the second transistor being connected to the node and the source of the second transistor being connected to the return.

17. The system of claim 1 further comprising:

a base plate;

a base heater secured to the base plate;

a substrate secured to the base heater;

a tuning heater secured to the substrate, the tuning heater comprising the plurality of thermal elements; and

a chuck secured to the tuning heater.

18. The system of claim 17, wherein the first and second unidirectional circuits comprise a silicon controlled rectifier (SCR).

19. The system of claim 18, wherein the SCR has an anode connected to an anode of a diode, a cathode of the diode being connected to a cathode of a zener diode, and an anode of the zener diode being connected to a gate of the SCR.

20. The system of claim 18, wherein the SCR has an anode connected to the cathode of the zener diode, the anode of the diode being connected to the anode of the zener diode, and the cathode of the diode being connected to the gate of the SCR.

21. A thermal system comprising:

a plurality of thermal elements, comprising a plurality of first thermal elements and a plurality of second thermal elements, wherein the plurality of first thermal elements and the plurality of second thermal elements form a plurality of parallel pairs, wherein each parallel pair has one first thermal element and one second thermal element connected in parallel;

a control system having a plurality of power nodes, wherein the first thermal element and the second thermal element of a parallel pair are connected between a first power node and a second power node,

wherein each parallel pair of first and second thermal elements is in electrical series with a first unidirectional circuit in forward bias and a second unidirectional circuit in reverse bias respectively, and

wherein the first thermal element is activated and the second thermal element is deactivated by a first polarity of the first node relative to the second node, and the first thermal element is deactivated and the second thermal element is activated by a second polarity of the first node relative to the second node.

22. A thermal system comprising:

a base plate;

a base heater secured to the base plate;

a substrate secured to the base heater;

a tuning heater secured to the substrate, the tuning heater comprising a plurality of thermal elements, the plurality of thermal elements comprising a plurality of first thermal elements and a plurality of second thermal elements, wherein the plurality of first thermal elements and the plurality of second thermal elements form a plurality of parallel pairs, wherein each parallel pair has one first thermal element and one second thermal element connected in parallel, and each parallel pair of first and second thermal elements is in electrical series with a first unidirectional circuit in forward bias and a second unidirectional circuit in reverse bias respectively;

a chuck secured to the tuning heater; and

a control system having a plurality of power nodes, wherein the first thermal element and the second thermal element of a parallel pair are connected between a first power node and a second power node, and wherein the first thermal element is activated and the second thermal element is deactivated by a first polarity of the first node relative to the second node, the first thermal element is deactivated and the second thermal element is activated by a second polarity of the first node relative to the second node.