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Energy analysis method for hidden damage detection

  • US 10,006,886 B2
  • Filed: 05/12/2015
  • Issued: 06/26/2018
  • Est. Priority Date: 07/09/2014
  • Status: Active Grant
First Claim
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1. A method of detecting hidden internal defects in a component comprising a multi layer material from a single side of a surface of the component, the method comprising:

  • connecting at least one transducer to the component;

    actuating the transducer to generate an ultrasonic guided wavefield in the multilayer material and on the surface of the multilayer material such that guided wave energy is trapped near the surface due to a first defect below the surface;

    collecting wavefield data from the ultrasonic guided wavefield on the surface of the multi layer material at the single side, without contacting the multilayer material, using a non-contact laser Doppler vibrometer or an air-coupled ultrasound device;

    processing the wavefield data, including calculating a cumulative amount of the guided wave energy trapped near the surface using the collected wavefield data; and

    identifying and/or quantifying whether the multilayer material has hidden internal defects that are further from the surface than the first defect and overlap the first defect, including comparing the calculated cumulative guided wave energy to the known cumulative energy data for a sample set of the multilayer materials having known hidden internal defects.

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