Capacitive sensors for electronic devices and methods of forming the same

• US 10,006,937 B2
• Filed: 03/06/2015
• Issued: 06/26/2018
• Est. Priority Date: 03/06/2015
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Bushnell, Tyler S., Garg, Vikram
• Primary Examiner(s): Shah, Manish S
• Assistant Examiner(s): Plumb, Nigel
• Application Number:
  US14/641,150
• Publication Number:
  US 20160258981A1
• Time in Patent Office: 1,208 Days
• Field of Search: 738663, 73862626, 73862625, 73862621, 73862381, 73862, 73714, 73700
• CPC Class Codes: G01R 1/04 Housings; Supporting members; Arrangements of terminals
• CPC Class Codes: G06F 2203/04102 Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06F 3/0447 Position sensing using the local deformation of sensor cells
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/0162 Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/103 by bonding or embedding conductive wires or strips
• CPC Class Codes: H05K 3/105 by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Abstract

Capacitive sensor assemblies for electronic devices, and methods of forming capacitive sensor assemblies. The capacitive sensor assembly may include a top component having an intermediate layer formed on the top component, a bottom component positioned opposite the top component, a silicone layer positioned between the top component and the bottom component, and a first electrical trace positioned adjacent the silicone layer.

Claims

1. An electronic device, comprising:

a housing, comprising;

a top portion; and

a bottom portion coupled to the top portion; and

a capacitive sensor assembly positioned within the housing, the capacitive sensor comprising;

a silicone layer coupled to the bottom portion of the housing;

a flex layer coupled to the silicone layer opposite the bottom portion; and

an electrical trace positioned within the flex layer and capacitively coupled with an electrically conductive region of the bottom portion, wherein

the capacitive sensor assembly is configured to generate a signal responsive to a change in a capacitance between the electrical trace and the electrically conductive region.

2. The electronic device of claim 1, wherein both the flex layer and the electrical trace of the capacitive sensor assembly are positioned between the top portion of the housing and the silicone layer.

3. The electronic device of claim 2, wherein the capacitive sensor assembly further comprises an adhesive positioned between the flex layer and top portion of the housing, the adhesive bonding the flex layer to top portion of the housing.

4. The electronic device of claim 2, wherein the silicone layer of the capacitive sensor assembly is coupled directly to the bottom portion of the housing.

5. The electronic device of claim 1, further comprising:

an intermediate layer positioned between the top portion of the housing and the silicone layer.

6. The electronic device of claim 5, wherein the silicone layer of the capacitive sensor assembly is coupled directly to the intermediate layer.

7. An electronic device, comprising:

a housing;

a cover glass at least partially positioned within an opening of the housing;

an intermediate layer formed on an inner surface of the cover glass and configured to visually obscure an interior volume of the housing; and

a capacitive sensor assembly positioned within the interior volume of the housing and comprising;

a silicone layer positioned below the intermediate layer; and

an electrical trace positioned within the intermediate layer, wherein

the capacitive sensor assembly is configured to detect a change in capacitance between the electrical trace and another internal component of the electronic device.

8. The electronic device of claim 7, wherein the another internal component of the electronic device is an electrically conductive inner surface of the housing.

9. The electronic device of claim 8, wherein the silicone layer of the capacitive sensor is coupled to the housing.

10. The electronic device of claim 7, wherein:

the electrical trace is a first electrical trace;

the capacitive sensor assembly further comprises a flex layer positioned between the silicone layer and the housing; and

the another component of the electronic device is a second electrical trace positioned within the flex layer.

11. The electronic device of claim 10, wherein the capacitive sensor assembly further comprises an adhesive positioned between the flex layer and the housing, the adhesive bonding the flex layer to the housing.

12. An electronic device, comprising:

a housing defining an opening and an internal surface forming a first electrical trace;

a transparent layer positioned at least partially within the opening and defining an input surface;

an opaque layer positioned on an underside of the transparent layer;

a capacitive sensor assembly positioned below the transparent layer and along the internal surface of the housing, the capacitive sensor assembly including a second electrical trace separated from the first electrical trace by a deformable component, wherein

the transparent layer is operative to compress the capacitive sensor assembly and move the first electrical trace and the second electrical trace toward one another, thereby triggering a switch event.

13. The electronic device of claim 12, wherein

the capacitive sensor assembly is configured to trigger the switch event using a change in capacitance measured between the first electrical trace and the second electrical trace.

14. The electrical device of claim 12, wherein the capacitive sensor assembly further comprises:

an adhesive layer positioned above the deformable component and adhered to the opaque layer; and

a silicon layer positioned between the deformable component and the support structure.

15. The electronic device of claim 12, wherein:

the capacitive sensor assembly comprises a silicon layer positioned below the deformable component and the opaque layer; and

the deformable component is adhered to the internal surface via an adhesive layer.

16. The electronic device of claim 12, wherein the opaque layer is formed from an ink.