Color-filter-on-array substrate and method of manufacturing thereof

• US 10,007,157 B2
• Filed: 01/28/2016
• Issued: 06/26/2018
• Est. Priority Date: 12/31/2015
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Zeng, Mian
• Primary Examiner(s): Trinh, Michael
• Application Number:
  US14/915,237
• Publication Number:
  US 20180052373A1
• Time in Patent Office: 880 Days
• CPC Class Codes: G02F 1/13439 characterised by their electrical, optical, physical properties; materials therefor; method of making
• CPC Class Codes: G02F 1/136222 Colour filters incorporated in the active matrix substrate
• CPC Class Codes: G02F 1/136227 Through-hole connection of the pixel electrode to the active element through an insulation layer
• CPC Class Codes: G02F 1/1368 in which the switching element is a three-electrode device G02F1/136277 takes precedence
• CPC Class Codes: G02F 2201/123 pixel
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1248 with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
• CPC Class Codes: H01L 27/1262 with a particular formation, treatment or coating of the substrate
• CPC Class Codes: H01L 27/1288 employing particular masking sequences or specially adapted masks, e.g. half-tone mask
• CPC Class Codes: H01L 27/1292 using liquid deposition, e.g. printing

Abstract

This disclosure provides a COA substrate includes a substrate, and a gate, a gate dielectric layer, an active layer, a source, a drain, a first passivation layer, a color blocking layer, a second passivation layer, and a transparent conductive layer are formed on the substrate in order subsequently. A first hole is formed in the color blocking layer to expose the first passivation layer. The second passivation layer is disposed on the color blocking layer and in the first hole. A second hole is formed in the first hole to punch through the first passivation layer and the second passivation layer for exposing the drain and the source. A conductive fill-in material layer is formed in the first hole and the second hole. The aperture rate is increased and the bubble failure is improved and the pixel electrode disconnection due to the height gap is reduced in the present disclosure.

Claims

1. A method to manufacturing a COA substrate, comprising:

forming a gate on a substrate;

forming a gate dielectric on the gate and the surface of the substrate not being covered by the gate;

forming an active layer on the gate dielectric layer being right on top of the gate;

forming a source and a drain on the gate dielectric layer wherein the source and the drain contacts the ends of the active layer respectively;

forming a first passivation layer on the source, the drain, the gate dielectric layer, and the active layer;

forming a color blocking layer on the first passivation layer;

forming a first hole in the color blocking layer to expose the first passivation layer;

forming a second passivation layer in the first hole and covering on the color blocking layer, wherein a second hole is formed to punch through the first passivation and the second passivation for exposing the drain and the source;

forming a conductive fill-in material layer with conductive materials in the first hole and the second hole, wherein the conductive material comprises organic conductive materials;

forming a transparent conductive layer on the second passivation layer and the conductive fill-in material layer; and

patterning the transparent conductive layer to form a pixel electrode.

2. The method according to claim 1, wherein the organic conductive material comprises at least one of the group consisting of p-polyphenyl (PPP), Polypyrrole (PPy), polythiophene (PTh), poly (p-phenylene vinylene) (PPV), and polyaniline (PANi).

3. The method according to claim 1, wherein the conductive fill-in material layer with conductive materials is formed in the first hole and the second hole by printing technology.

4. The method according to claim 1, wherein the step of forming a conductive fill-in material layer with conductive materials in the first hole and the second hole further comprises covering the organic conductive materials in the first hole and the second hole, covering a photo resist layer, and performing a lithography technology.

5. The method according to claim 1, wherein the surface of the conductive layer and the surface of the second passivation layer are at the same level.