Inductor embedded in a package substrate

• US 10,008,316 B2
• Filed: 03/28/2014
• Issued: 06/26/2018
• Est. Priority Date: 03/28/2014
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Fazelpour, Siamak, Paynter, Charles David, Lane, Ryan David
• Primary Examiner(s): Chan, Tsz
• Application Number:
  US14/229,367
• Publication Number:
  US 20150279545A1
• Time in Patent Office: 1,551 Days
• Field of Search: 336200, 336232
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 2017/0066 with a magnetic layer
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

Some novel features pertain to a package substrate that includes a core layer, a first via, a first dielectric layer, and a first inductor. The core layer includes a first surface and a second surface. The first via is located in the core layer. The first dielectric layer is coupled to the first surface of the core layer. The first inductor is located in the first dielectric layer. The first inductor is coupled to the first via in the core layer. The first inductor is configured to generate a magnetic field that laterally traverses the package substrate. In some implementations, the package substrate further includes a first pad coupled to the first inductor, wherein the first pad is configured to couple to a solder ball. In some implementations, the package substrate includes a second via located in the core layer, and a second inductor located in the first dielectric layer.

Claims

1. A package substrate comprising:

a core layer comprising a first surface and a second surface;

a first via located in the core layer;

a first dielectric layer coupled to the first surface of the core layer;

a first inductor coupled to the first via in the core layer and configured to generate a first magnetic field, wherein the first inductor includes a first inductor segment coupled to a second inductor segment to form a first set of windings, wherein the first inductor segment is located in the first dielectric layer and the second inductor segment is located in a second dielectric layer, and wherein at least one of the first inductor segment and the second inductor segment include a first C configuration;

a second via located in the core layer; and

a second inductor coupled to the second via in the core layer and configured to generate a second magnetic field, wherein the second inductor includes a third inductor segment coupled to a fourth inductor segment to form a second set of windings, wherein the third inductor segment is located in the first dielectric layer and the fourth inductor segment is located in the second dielectric layer, and wherein at least one of the third inductor segment and the fourth inductor segment include a second C configuration.

2. The package substrate of claim 1, further comprising a first pad coupled to the first inductor, wherein the first pad is configured to couple to a solder ball.

3. The package substrate of claim 2, wherein the first inductor is configured to provide an impedance difference between the first pad and a signal interconnect of 2.5 ohms or less.

4. The package substrate of claim 1, wherein the first inductor comprises:

a first set of vias; and

a first set of interconnects.

5. The package substrate of claim 1, wherein the first inductor is positioned in at least the first dielectric layer and the second dielectric layer such that the first magnetic field that is generated by the first inductor affects the impedance of a second pad coupled to the second inductor.

6. The package substrate of claim 1,

wherein the first inductor and the second inductor are positioned adjacent to each other and the first and second C configurations are aligned such that the first magnetic field that is generated by the first inductor amplifies the second magnetic field that is generated by the second inductor.

7. The package substrate of claim 1, further comprising:

a third dielectric layer coupled to the second surface of the core layer; and

a set of interconnects in the third dielectric layer, the set of interconnects coupled to the first via located in the core layer.

8. The package substrate of claim 1, wherein the package substrate is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, and a laptop computer.

9. The package substrate of claim 1, wherein the first inductor is oriented to generate the first magnetic field according to an orientation of the second inductor.

10. An apparatus comprising:

a core layer comprising a first surface and a second surface;

a first via located in the core layer;

a first dielectric layer coupled to the first surface of the core layer;

a first inductor means coupled to the first via in the core layer and configured to generate a first magnetic field, wherein the first inductor means includes a first inductor segment coupled to a second inductor segment to form a first set of windings, wherein the first inductor segment is located in the first dielectric layer and the second inductor segment is located in a second dielectric layer, and wherein at least one of the first inductor segment and the second inductor segment include a first C configuration;

a second via located in the core layer; and

a second inductor means coupled to the second via in the core layer and configured to generate a second magnetic field, wherein the second inductor means includes a third inductor segment coupled to a fourth inductor segment to form a second set of windings, wherein the third inductor segment is located in the first dielectric layer and the fourth inductor segment is located in the second dielectric layer, and wherein at least one of the third inductor segment and the fourth inductor segment includes a second C configuration.

11. The apparatus of claim 10, further comprising a first pad coupled to the first inductor means, wherein the first pad is configured to couple to a solder ball.

12. The apparatus of claim 11, wherein the first inductor means is configured to provide an impedance difference between the first pad and a signal interconnect of 2.5 ohms or less.

13. The apparatus of claim 10, wherein the first inductor means comprises:

a first set of vias; and

a first set of interconnects.

14. The apparatus of claim 10, wherein the first inductor means is positioned in at least the first dielectric layer and the second dielectric layer such that the first magnetic field that is generated by the first inductor means affects the impedance of a second pad coupled to the second inductor means.

15. The apparatus of claim 10,

wherein the first inductor means and the second inductor means are positioned adjacent to each other and the first and second C configurations are aligned such that the first magnetic field that is generated by the first inductor means amplifies the second magnetic field that is generated by the second inductor means.

16. The apparatus of claim 10, further comprising:

a third dielectric layer coupled to the second surface of the core layer; and

a set of interconnects in the third dielectric layer, the set of interconnects coupled to the first via located in the core layer.

17. The apparatus of claim 10, wherein the apparatus is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, and a laptop computer.

18. The apparatus of claim 10, wherein the first inductor means is oriented to generate the first magnetic field according to an orientation of the second inductor means.

19. A method for fabricating a package substrate, comprising:

forming a core layer comprising a first surface and a second surface;

forming a first via in the core layer;

forming a first dielectric layer coupled to the first surface of the core layer;

forming a first inductor coupled to the first via in the core layer and configured to generate a first magnetic field, wherein the first inductor includes a first inductor segment coupled to a second inductor segment to form a first set of windings, wherein the first inductor segment is located in the first dielectric layer and the second inductor segment is located in a second dielectric layer, and wherein at least one of the first inductor segment and the second inductor segment include a first C configuration;

forming a second via in the core layer; and

forming a second inductor coupled to the second via in the core layer and configured to generate a second magnetic field, wherein the second inductor includes a third inductor segment coupled to a fourth inductor segment to form a second set of windings, wherein the third inductor segment is located in the first dielectric layer and the fourth inductor segment is located in the second dielectric layer, and wherein at least one of the third inductor segment and the fourth inductor segment include a second C configuration.

20. The method of claim 19, further comprising forming a first pad such that the first pad is coupled to the first inductor, wherein the first pad is configured to couple to a solder ball.

21. The method of claim 20, wherein the first inductor is configured to provide an impedance difference between the first pad and a signal interconnect of 2.5 ohms or less.

22. The method of claim 19, wherein forming the first inductor comprises:

forming a first set of vias; and

forming a first set of interconnects.

23. The method of claim 19, wherein the first inductor is positioned in at least the first dielectric layer and the second dielectric layer such that the first magnetic field that is generated by the first inductor affects the impedance of a second pad coupled to the second inductor.

24. The method of claim 19,

wherein the first inductor and the second inductor are positioned adjacent to each other and the with their respective first and second C configurations are aligned such that the first magnetic field that is generated by the first inductor amplifies the second magnetic field that is generated by the second inductor.

25. The method of claim 19, further comprising:

forming a third dielectric layer coupled to the second surface of the core layer; and

forming a set of interconnects in the third dielectric layer, the set of interconnects coupled to the first via located in the core layer.

26. The method of claim 19, wherein the package substrate is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, and a laptop computer.

27. The method of claim 19, wherein the first inductor is oriented to generate the first magnetic field according to an orientation of the second inductor.