Magnetic field sensor for sensing a proximity of an object

• US 10,012,518 B2
• Filed: 06/08/2016
• Issued: 07/03/2018
• Est. Priority Date: 06/08/2016
• Status: Active Grant

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Inventors: David, Paul A., Vig, Ravi
• Primary Examiner(s): Nguyen, Tung X
• Assistant Examiner(s): Alejnikov, Jr., Robert P
• Application Number:
  US15/176,645
• Publication Number:
  US 20170356759A1
• Time in Patent Office: 755 Days
• Field of Search: 32420711, 32420713, 3242072, 32420721, 324260
• CPC Class Codes: G01B 7/023 for measuring distance between sensor and object G01B7/082 and G01B7/102 take precedence
• CPC Class Codes: G01D 5/142 using Hall-effect devices measuring magnetic variables using Hall-effect or other galvanomagnetic devices G01R33/06
• CPC Class Codes: G01D 5/147 influenced by the movement of a third element, the position of Hall device and the source of magnetic field being fixed in respect to each other
• CPC Class Codes: G01D 5/16 by varying resistance
• CPC Class Codes: G01P 3/488 delivered by variable reluctance detectors

Abstract

A back-biased magnetic field sensor uses one or more magnetic field sensing elements upon a substrate, each outside of a substrate region in which magnetic field lines are near perpendicular to the substrate and outside of which magnetic field lines are not to the substrate. The back-biased magnetic field sensor can sense an approaching and/or a retreating ferromagnetic object.

Claims

1. A magnetic field sensor for sensing a movement of a ferromagnetic object, the magnetic field sensor comprising:

a magnet;

a semiconductor substrate having first and second surfaces, the semiconductor substrate proximate to the magnet and at a position between the ferromagnetic object and the magnet, the semiconductor substrate comprising;

first and second orthogonal axes on the first surface of the substrate intersecting at a coordinate axes point; and

a substrate region upon the first opposing surface of the substrate, the substrate region proximate to and surrounding the coordinate axis point, wherein magnetic fields generated by the magnet within the substrate region are substantially perpendicular to the first and second surfaces of the semiconductor substrate in the absence of the ferromagnetic object, the magnetic field sensor further comprising;

a first magnetic field sensing element disposed on or under the first surface of the semiconductor substrate and disposed outside of the substrate region, wherein the first magnetic field sensing element comprises an axis of maximum sensitivity substantially parallel to the first orthogonal axis, wherein a center of the first magnetic field sensing element is disposed along the first orthogonal axis;

a second magnetic field sensing element disposed on or under the first surface of the semiconductor substrate and disposed outside of the semiconductor region, wherein the second magnetic field sensing element comprises an axis of maximum sensitivity substantially parallel to the axis of maximum sensitivity of the first magnetic field sensing element, and wherein a center of the second magnetic field sensing element is disposed along the first orthogonal axis;

a third magnetic field sensing element disposed on or under the first surface of the semiconductor substrate and disposed outside of the semiconductor region, wherein the third magnetic field sensing element comprises an axis of maximum sensitivity substantially perpendicular to the axis of maximum sensitivity of the first magnetic field sensing element and substantially parallel to the first surface of the semiconductor substrate, and wherein a center of the third magnetic field sensing element is disposed along the second orthogonal axis;

a fourth magnetic field sensing element disposed on or under the first surface of the semiconductor substrate and disposed outside of the semiconductor region, wherein the fourth magnetic field sensing element comprises an axis of maximum sensitivity substantially parallel to the axis of maximum sensitivity of the third magnetic field sensing element, wherein a center of the fourth magnetic field sensing element is disposed along the second orthogonal axis, wherein the centers of the first and second magnetic field sensing elements are substantially equidistant from and on opposite sides of the coordinate axes point, and wherein the centers of the third and fourth magnetic field sensing elements are substantially equidistant from and on opposite sides of the coordinate axes point; and

an electronic circuit disposed upon the substrate, configured to combine signals from the first, second, third, and fourth magnetic field sensing elements to generate a combined signal, and configured to compare the combined signal with a threshold signal to generate a two-state binary signal having a change of state when the ferromagnetic object moves closer to the semiconductor substrate than a predetermined distance.

2. The magnetic field sensor of claim 1, wherein the centers of the first and second magnetic field sensing elements are substantially equidistant from and on opposite sides of the coordinate axes point.

3. The magnetic field sensor of claim 1, wherein the first and second magnetic field sensing elements comprise vertical Hall effect elements.

4. The magnetic field sensor of claim 1, wherein the first and second magnetic field sensing elements comprise magnetoresistance elements.

5. The magnetic field sensor of claim 1, wherein the first, second, third, and fourth magnetic field sensing elements comprise vertical Hall effect elements.

6. The magnetic field sensor of claim 1, wherein the first, second, third, and fourth magnetic field sensing elements comprise magnetoresistance elements.

7. The magnetic field sensor of claim 1, wherein magnetic fields generated by the magnet outside of the substrate region are tilted relative to the first and second surfaces of the semiconductor substrate in the absence of the ferromagnetic object, and wherein the magnetic fields generated by the magnet at the centers of the first and second magnetic field sensing elements outside of the substrate region tilt less relative to the first and second surfaces of the semiconductor substrate as the ferromagnetic object approaches the magnetic field sensor.

8. The magnetic field sensor of claim 1, wherein the two state binary signal changes state when the ferromagnetic object approaches the magnetic field sensor in a straight line toward the magnetic field sensor.

9. A magnetic field sensor for sensing a movement of a ferromagnetic object, the magnetic field sensor comprising:

a magnet;

a semiconductor substrate having first and second surfaces, the semiconductor substrate proximate to the magnet and at a position between the ferromagnetic object and the magnet, the semiconductor substrate comprising;

first and second orthogonal axes on the first surface of the substrate intersecting at a coordinate axes point; and

a substrate region upon the first opposing surface of the substrate, the substrate region proximate to and surrounding the coordinate axis point, wherein magnetic fields generated by the magnet within the substrate region are substantially perpendicular to the first and second surfaces of the semiconductor substrate in the absence of the ferromagnetic object, the magnetic field sensor further comprising;

a first magnetic field sensing element disposed on or under the first surface of the semiconductor substrate and disposed outside of the substrate region, wherein the first magnetic field sensing element comprises an axis of maximum sensitivity substantially parallel to the first orthogonal axis, wherein a center of the first magnetic field sensing element is disposed along the first orthogonal axis;

a second magnetic field sensing element disposed on or under the first surface of the semiconductor substrate and disposed outside of the substrate region, wherein the second magnetic field sensing element comprises an axis of maximum sensitivity substantially perpendicular to the axis of maximum sensitivity of the first magnetic field sensing element and substantially parallel to the first surface of the semiconductor substrate, wherein a center of the second magnetic field sensing element is disposed along the second orthogonal axis; and

an electronic circuit disposed upon the substrate, coupled to the first and second magnetic field sensing elements and configured to combine first and second signals from the first and second magnetic field sensing elements to generate a combined signal, and configured to compare the combined signal with a reference signal to generate a two-state binary signal having a change of state when the ferromagnetic object moves closer to the semiconductor substrate than a predetermined distance.

10. The magnetic field sensor of claim 9, wherein the centers of the first and second magnetic field sensing elements are substantially equidistant from the coordinate axes point.

11. The magnetic field sensor of claim 9, wherein the first and second magnetic field sensing elements comprise vertical Hall effect elements.

12. The magnetic field sensor of claim 9, wherein the first and second magnetic field sensing elements comprise magnetoresistance elements.

13. The magnetic field sensor of claim 9, further comprising:

a third magnetic field sensing element disposed on or under the first surface of the semiconductor substrate and disposed outside of the semiconductor region, wherein the third magnetic field sensing element comprises an axis of maximum sensitivity substantially perpendicular to the axis of maximum sensitivity of the first magnetic field sensing element and substantially parallel to the first surface of the semiconductor substrate, and

a fourth magnetic field sensing element disposed on or under the first surface of the semiconductor substrate and disposed outside of the semiconductor region, wherein the fourth magnetic field sensing element comprises an axis of maximum sensitivity substantially parallel to the axis of maximum sensitivity of the third magnetic field sensing element.

14. The magnetic field sensor of claim 13, wherein a center of the third magnetic field sensing element is disposed along the first orthogonal axis, wherein a center of the fourth magnetic field sensing element is disposed along the second orthogonal axis, wherein the centers of the first and second magnetic field sensing elements are substantially equidistant from and on opposite sides of the coordinate axes point, and wherein the centers of the third and fourth magnetic field sensing elements are substantially equidistant from and on opposite sides of the coordinate axes point.

15. The magnetic field sensor of claim 13, wherein the electronic circuit is further configured to combine third and fourth signals from the third and fourth magnetic field sensing elements with the first and second signals to generate the combined signal.

16. The magnetic field sensor of claim 9, wherein magnetic fields generated by the magnet outside of the substrate region are tilted relative to the first and second surfaces of the semiconductor substrate in the absence of the ferromagnetic object, and wherein the magnetic fields generated by the magnet at the centers of the first and second magnetic field sensing elements are less tilted relative to the first and second surfaces of the semiconductor substrate as the ferromagnetic object approaches the magnetic field sensor.

17. The magnetic field sensor of claim 9, wherein the two state binary signal changes state when the ferromagnetic object approaches the magnetic field sensor in a straight line toward the magnetic field sensor.