Shield film, shielded printed wiring board, and method for manufacturing shield film
First Claim
1. A shield film suitable for use in shielding a signal-transmitting circuit from signal-interfering electromagnetic noise, comprising:
- a metal layer, which is 2 μ
m to 12 μ
m thick;
an insulating layer, which is 1 μ
m to 10 μ
m thick and is disposed along and in contact with a first surface of the metal layer; and
an anisotropic conductive adhesive layer containing conductive filler with an average particle size of 2 μ
m to 20 μ
m, which anisotropic conductive adhesive layer is disposed along and in contact with a second, opposite surface of the metal layer;
wherein the shield film exhibits between 74 dB and 96 dB of attenuation of an electric field wave at 1 GHz, as measured using KEC method.
1 Assignment
0 Petitions
Accused Products
Abstract
To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 μm to 12 μm thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.
13 Citations
13 Claims
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1. A shield film suitable for use in shielding a signal-transmitting circuit from signal-interfering electromagnetic noise, comprising:
-
a metal layer, which is 2 μ
m to 12 μ
m thick;an insulating layer, which is 1 μ
m to 10 μ
m thick and is disposed along and in contact with a first surface of the metal layer; andan anisotropic conductive adhesive layer containing conductive filler with an average particle size of 2 μ
m to 20 μ
m, which anisotropic conductive adhesive layer is disposed along and in contact with a second, opposite surface of the metal layer;wherein the shield film exhibits between 74 dB and 96 dB of attenuation of an electric field wave at 1 GHz, as measured using KEC method. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A shield film suitable for use in shielding a signal-transmitting circuit from signal-interfering electromagnetic noise, comprising:
-
a metal layer, which is 2 μ
um to 12 μ
m thick;an insulating layer, which is 1 μ
m to 10 μ
m thick and is disposed along and in contact with a first surface of the metal layer; andan anisotropic conductive adhesive layer containing conductive filler with an average particle size of 2 μ
m to 20 μ
m, which anisotropic conductive adhesive layer is disposed along and in contact with a second, opposite surface of the metal layer;wherein the shield film exhibits between about 70 dB and about 85 dB of attenuation of a magnetic field wave at 1 GHz, as measured using KEC method.
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Specification
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- Resources
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Current AssigneeTatsuta Electric Wire & Cable Co Ltd
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Original AssigneeTatsuta Electric Wire & Cable Co Ltd
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InventorsTajima, Hiroshi, Yamauchi, Sirou, Kamino, Kenji, Watanabe, Masahiro
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Primary Examiner(s)Ngo, Hung V
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Application NumberUS14/360,609Publication NumberTime in Patent Office2,090 DaysField of Search174382, 174384US Class CurrentCPC Class CodesH05K 1/0216 Reduction of cross-talk, no...H05K 2201/0715 provided by an outer layer ...H05K 3/28 Applying non-metallic prote...H05K 9/00 Screening of apparatus or c...H05K 9/0084 comprising a single continu...H05K 9/0088 comprising a plurality of s...Y10T 29/49226 Electret making
