Shield film, shielded printed wiring board, and method for manufacturing shield film

  • US 10,015,915 B2
  • Filed: 10/12/2012
  • Issued: 07/03/2018
  • Est. Priority Date: 11/24/2011
  • Status: Active Grant
First Claim
Patent Images

1. A shield film suitable for use in shielding a signal-transmitting circuit from signal-interfering electromagnetic noise, comprising:

  • a metal layer, which is 2 μ

    m to 12 μ

    m thick;

    an insulating layer, which is 1 μ

    m to 10 μ

    m thick and is disposed along and in contact with a first surface of the metal layer; and

    an anisotropic conductive adhesive layer containing conductive filler with an average particle size of 2 μ

    m to 20 μ

    m, which anisotropic conductive adhesive layer is disposed along and in contact with a second, opposite surface of the metal layer;

    wherein the shield film exhibits between 74 dB and 96 dB of attenuation of an electric field wave at 1 GHz, as measured using KEC method.

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