Thermosetting resin composition and use thereof

• US 10,029,438 B2
• Filed: 12/23/2014
• Issued: 07/24/2018
• Est. Priority Date: 12/27/2013
• Status: Active Grant

• Current Assignee: Shengyi Technology Co., Ltd.
• Original Assignee: Shengyi Technology Co., Ltd.
• Inventors: Zeng, Xianping, Ren, Nana
• Primary Examiner(s): Lee, Doris L
• Application Number:
  US14/580,284
• Publication Number:
  US 20150189747A1
• Time in Patent Office: 1,309 Days
• Field of Search: 428418
• CPC Class Codes: B32B 15/14 next to a fibrous or filamentary layer
• CPC Class Codes: B32B 2260/021 Fibrous or filamentary layer layers of natural mineral fibres or particles being impregnated in a plastic substance B32B19/02
• CPC Class Codes: B32B 2260/046 Synthetic resin
• CPC Class Codes: B32B 2262/101 Glass fibres
• CPC Class Codes: B32B 2264/10 Inorganic particles
• CPC Class Codes: B32B 2307/306 Resistant to heat
• CPC Class Codes: B32B 2307/3065 Flame resistant or retardant, fire resistant or retardant
• CPC Class Codes: B32B 2307/7265 Non-permeable
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 5/022 Non-woven fabric
• CPC Class Codes: B32B 5/024 Woven fabric
• CPC Class Codes: B32B 5/26 another layer next to it also being fibrous or filamentary relative arrangement of fibres or filaments of different layers B32B5/12
• CPC Class Codes: C08G 73/0655 from polycyanurates
• CPC Class Codes: C08J 2379/00 Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
• CPC Class Codes: C08J 2485/02 containing phosphorus
• CPC Class Codes: C08J 5/244 using glass fibres
• CPC Class Codes: C08K 5/0033 Additives activating the degradation of the macromolecular compound
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 79/04 Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C08L 85/02 containing phosphorus
• CPC Class Codes: H05K 1/0353 : consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
• CPC Class Codes: H05K 1/0366 : reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/012 : Flame-retardant; Preventing of inflammation
• CPC Class Codes: Y10T 428/31507 : Of polycarbonate
• CPC Class Codes: Y10T 428/31529 : Next to metal
• CPC Class Codes: Y10T 428/31605 : Next to free metal

Abstract

The present invention relates to a thermosetting resin composition, which comprises: (A) cyanate ester compound and/or cyanate ester prepolymer; and (B) polyphosphonate ester and/or phosphonate-carbonate copolymer. The thermosetting resin composition provided by the present invention has low dielectric constant and dielectric loss tangent. The prepreg and copper clad laminate made from the above-mentioned thermosetting resin composition have excellent dielectric properties and wet-heat resistance, UL94 V-0 flame resistance, and good processability.

Claims

1. A thermosetting resin composition, wherein the resin composition comprises:

(A) 50-90 weight parts of novolac type cyanate ester compound;

2. The thermosetting resin composition according to claim 1, wherein the thermosetting resin composition further comprises (D) filler;

the filler is selected from organic fillers and/or inorganic fillers;

the inorganic filler is one or more selected from the group consisting of nonmetal oxide, metal nitride, non-metal nitride, inorganic hydrate, inorganic salt, metal hydrate and inorganic phosphorus;

the organic filler is any one or a mixture of at least two selected from the group of polytetrafluoroethylene powder, polyphenylene sulfide, organophosphorus compounds and polyether sulfone powder;

the median particle diameter of the filler is 0.01-50μ

m;

based on the total weight of the component(A), component(B) and component(C) of 100parts, the addition amount of the component (D) is 5˜

1000 parts by weight.

3. The thermosetting resin composition according to claim 1, wherein the thermosetting resin composition further comprises component (E) catalyst;

the catalyst is one or more selected from the group consisting of organic metal compounds, imidazole compounds and derivatives thereof, and tertiary amine;

the metal is one or more selected from the group consisting of zinc, copper, iron, tin, cobalt and aluminum;

based on the total weight of the component (A), component (B) and component (C) of 100 parts, the addition amount of component (E) catalyst is 0.01-1.0 parts by weight.

4. The thermosetting resin composition according to claim 1, wherein the thermosetting resin composition further comprises:

(D) filler of 5-1000 parts by weight based on the total weight of the component (A), component (B) and component (C) of 100 parts; and

(E) catalyst of 0.01-1.0 parts by weight based on the total weight of the component (A), component (B) and component (C) of 100 parts.

5. A prepreg, wherein the prepreg comprises the enhancement material and the thermosetting resin composition according to claim 1 which adheres to the enhancement material by impregnation and drying.

6. A laminate, wherein the laminate comprises at least one prepreg according to claim 5.

7. A high-frequency circuit board, wherein the high-frequency circuit board comprises at least one prepreg according to claim 5 and the copper foils covered on both sides of stacked prepregs.