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Hermetic implantable sensor

  • US 10,041,897 B2
  • Filed: 02/09/2011
  • Issued: 08/07/2018
  • Est. Priority Date: 02/13/2004
  • Status: Active Grant
First Claim
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1. A sensor, comprising:

  • a substrate made of a first insulating material having a high temperature resistance;

    at least one conductor disposed over a preselected external surface location on the substrate, wherein the external surface location is planar and disposed on an upper or lower external surface of the substrate, and the at least one conductor is elongated along the external surface location and made from a solidified electrically conductive thick film material which contains particles of a metal selected from the group consisting of platinum, palladium, rhodium, ruthenium, iridium and osmium;

    a coating made of a second insulating material formed over at least a portion of the at least one conductor to hermetically seal at least a portion of the at least one conductor;

    an exposed distal region of the at least one conductor providing a detection electrode; and

    the at least one conductor being sintered by heating to a temperature within a range that extends from below a melting point of the particles of metal to approximately 300°

    C. below the melting point of the particles of metal and having a reduced porosity that inhibits migration of fluid or constituents thereof through the at least one conductor, wherein the at least one conductor is hermetic along its elongated length.

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