Shield film, shielded printed wiring board, and method for manufacturing shield film

  • US 10,051,765 B2
  • Filed: 02/09/2016
  • Issued: 08/14/2018
  • Est. Priority Date: 11/24/2011
  • Status: Active Grant
First Claim
Patent Images

1. A shielded printed wiring board, comprising:

  • a printed wiring board including a base member on which a printed circuit is formed and an insulating film provided on the base member so as to cover the printed circuit, wherein the printed circuit is configured to transmit signals at a frequency within the range of 10 MHz to 10 GHz; and

    a shield film provided on the printed wiring board so as to cover and shield the printed circuit;

    wherein the shield film is configured to shield the printed circuit from signal interference due to electromagnetic waves and comprisesa metal layer which is 2 μ

    m to 12 μ

    m thick and an anisotropic conductive adhesive layer that is electrically conductive in its thickness direction, which are in a deposited state,wherein the anisotropic conductive adhesive layer includes 3 wt % to 39 wt % of conductive filler with respect to the entire amount of the anisotropic conductive adhesive layer, andwherein the shield film is configured to maintain the integrity of a signal being transmitted by the printed circuit such that attenuation of a signal being transmitted by the printed circuit is less than −

    3 dB for signals up to 500 MHz.

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