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Integrated overhead console assembly for vehicle

  • US 10,053,009 B2
  • Filed: 11/09/2015
  • Issued: 08/21/2018
  • Est. Priority Date: 11/10/2014
  • Status: Active Grant
First Claim
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1. An integrated overhead console assembly for a vehicle, comprising:

  • a camera module configured to capture a forward image of a vehicle in a direction of travel, the camera module including;

    a lens for converging light constituting the forward image;

    an image sensor coupled to a rear end of the lens to detect the image converged through the lens; and

    an image processing board electrically connected to the image sensor;

    a multi-display unit configured to provide a driver with a display of the forward image or a reflection of a rear view image of the vehicle; and

    an overhead console case assembly providing an installation space for accommodating the camera module and the multi-display unit such that the camera module is hidden from an interior of the vehicle, whereas the multi-display unit is exposed to the interior of the vehicle,wherein the multi-display unit is spaced apart from the image processing board by a predetermined distance,wherein the lens comprises a pair of lenses, and the image sensor comprises a pair of image sensors,wherein the camera module comprises;

    a camera holder;

    a mounting part to which the pair of lenses and the pair of image sensors are coupled in a state of being longitudinally spaced apart from each other and through which the lenses and the image sensors are coupled to an upper surface of the camera holder; and

    a lower cover assembly which accommodates the image processing board and through which the image processing board is coupled to a lower surface of the camera holder, wherein the lower cover assembly is made of highly thermally conductive material, and is in contact with a heat generating region of the image processing board, andwherein the lower cover assembly comprises;

    an upper heat dissipation bracket disposed between the camera holder and the lower cover assembly to dissipate heat generated from the image processing board; and

    a lower heat dissipation bracket coupled to the upper heat dissipation bracket with the image processing board disposed therebetween,wherein a heat generating region of the image processing board contacts a heat transfer portion located at an inner surface of the lower heat dissipation bracket.

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