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Ruggedized photonic crystal sensor packaging

  • US 10,061,093 B2
  • Filed: 10/14/2016
  • Issued: 08/28/2018
  • Est. Priority Date: 05/09/2012
  • Status: Active Grant
First Claim
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1. A method for hermetically sealing a sensor chip, the method comprising:

  • sealing the sensor chip to an end of a front snout of a main package body;

    inserting a fiber into the main package body through an opening of a back snout of the main package body;

    aligning an end of the fiber to the sensor chip;

    locking the fiber on a fiber pedestal, wherein the fiber pedestal is located inside the main package body;

    sealing the fiber at the end of the back snout of the main package body;

    applying a fiber jacket to an end of the fiber opposite the end of the fiber that is aligned to the sensor chip, wherein a portion of the fiber jacket is located inside of the back snout of the main package body;

    sealing an internal cavity of the back snout;

    attaching a fiber boot to the end of the back snout and to at least a portion of the fiber jacket;

    out-gassing the main package body, the sensor chip, the fiber, the fiber pedestal, the fiber jacket, and the fiber boot; and

    sealing a lid to a top side of the main package body.

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