Polishing slurry composition

  • US 10,077,381 B2
  • Filed: 07/08/2016
  • Issued: 09/18/2018
  • Est. Priority Date: 07/23/2015
  • Status: Active Grant
First Claim
Patent Images

1. A polishing slurry composition comprising:

  • at least two types of abrasive particles among first abrasive particles, second abrasive particles, and third abrasive particles; and

    an oxidizer,wherein a peak-to-valley roughness Rpv decreases when a contact area between the abrasive particles and a tungsten-containing film increases,wherein the contact area between the abrasive particles and the tungsten-containing film ranges from 0.5 to 0.9, and is calculated by the following equation;


    A=C01/3s−

    φ



    1/3
    wherein A denotes the contact area, C0 denotes a concentration of the abrasive particles in % by weight (wt %), and φ

    denotes a diameter of an abrasive particle in nanometers (nm),wherein the polishing slurry composition satisfies a removal ratio of 35% to 70% calculated by the following equation;

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