Apparatus for testing electronic devices
First Claim
1. A software assembly and test method, comprising:
- storing a plurality of net files, each net file having information representing a scheme of current passing through conductors of a respective electrical subassembly;
providing an input of an interconnection scheme of a plurality of the electrical subassemblies connected to one another; and
assembling a plurality of the net files based on the interconnection scheme to construct a configuration file having information representing flow of current through the electrical subassemblies of the interconnection scheme;
connecting an electronic device through the electrical sub assemblies of the interconnection scheme to a test head; and
executing a test application, the test application utilizing a test program and the configuration file to provide instructions to the electrical sub assemblies of the interconnection scheme with the configuration file determining flow of current between the test head and the electronic device through the electrical sub assemblies of the interconnection scheme to test the electronic device.
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Accused Products
Abstract
An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.
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Citations
16 Claims
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1. A software assembly and test method, comprising:
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storing a plurality of net files, each net file having information representing a scheme of current passing through conductors of a respective electrical subassembly; providing an input of an interconnection scheme of a plurality of the electrical subassemblies connected to one another; and assembling a plurality of the net files based on the interconnection scheme to construct a configuration file having information representing flow of current through the electrical subassemblies of the interconnection scheme; connecting an electronic device through the electrical sub assemblies of the interconnection scheme to a test head; and executing a test application, the test application utilizing a test program and the configuration file to provide instructions to the electrical sub assemblies of the interconnection scheme with the configuration file determining flow of current between the test head and the electronic device through the electrical sub assemblies of the interconnection scheme to test the electronic device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A software assembler application and tester, comprising:
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a plurality of net files, each file having information representing a scheme of current passing through conductors of a respective electrical sub assembly; an input module to provide an input of an interconnection scheme of a plurality of electrical sub assemblies; and an assembly module that assembles a plurality of the net files based on the interconnection scheme and constructs a configuration file having information representing flow of current through the electrical sub assemblies of the interconnection scheme; a test head; a holder for an electronic device, the electronic device being connected through the electrical sub assemblies of the interconnection scheme to the test head; a test program; and a test application, the test application utilizing a test program and the configuration file to provide instructions to the electrical sub assemblies of the interconnection scheme with the configuration file determining flow of current between the test head and the electronic device through the electrical sub assemblies of the interconnection scheme to test the electronic device. - View Dependent Claims (13, 14, 15, 16)
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Specification