Side view light emitting diode package

• US 10,096,756 B2
• Filed: 07/05/2016
• Issued: 10/09/2018
• Est. Priority Date: 11/25/2005
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Chang Wook, Han, Yoon Suk, Song, Young Jae, Kim, Byung Man, Roh, Jae Ky, Hong, Seong Jae
• Primary Examiner(s): Trinh, (Vikki) Hoa B
• Application Number:
  US15/201,967
• Publication Number:
  US 20160315239A1
• Time in Patent Office: 826 Days
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/4554 Coating
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Claims

1. A light emitting diode package comprising:

a molded package body formed of a molding material having a first surface defining a mounting surface of the molded package, a second surface opposed to the first surface and side surfaces positioned between the first and second surfaces, the molded package body including a cavity formed on one of the side surfaces and sidewalls surrounding the cavity;

first and second lead frames arranged in the molded package body, the cavity of the molded package body exposing a portion of at least one of the first and second lead frames placed in the bottom of the cavity to outside;

a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames; and

a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip, and including a fluorescent material,

wherein the depth of the cavity is from 250 μ

m to 400 μ

m, and the mounting height of the light emitting diode chip is from 50 μ

m to 200 μ

m,

wherein the cavity has a first width in a shorter axis direction and a second width in a longer axis direction perpendicular to the shorter axis direction, the second width at a top end of the cavity is from 2.0 mm to 2.5 mm and the second width of the cavity is from 1.5 mm to 1.7 mm at the bottom of the cavity,

wherein a beam angle of the light emitting diode package is more than 114.8°

in the shorter axis direction, and a difference between the beam angle in the shorter axis direction and a beam angle in the longer axis direction is 6.5°

or less.

2. The light emitting diode package according to claim 1, wherein the sidewalls include two first sidewalls along the longer axis direction and two second sidewalls along the shorter axis direction, and the second sidewalk have smaller widths than those of the first sidewalls.

3. The light emitting diode package according to claim 1, further comprising an adhesive layer disposed between the light emitting diode chip and the bottom of the cavity.

4. The light emitting diode package according to claim 1, wherein each of the sidewalls has an inner surface inclined between the bottom and a top of the cavity.

5. The light emitting diode package according to claim 4, further comprising wire for electrically connecting the light emitting diode chip to at least one of the first and second lead frames.

6. The light emitting diode package according to claim 5, wherein the wire has one end connected to a bump ball of the lead frame and the other end stitch-bonded to the light emitting diode chip.

7. The light emitting diode package according to claim 5, wherein the wire is arranged in such a fashion that a height from a top surface of the light emitting diode chip to a top end of the wire is 100 μ

m or less.

8. A light emitting diode package comprising:

a molded package body formed of a molding material and having a first surface defining a mounting surface of the molded package, a second surface opposed to the first surface and side surfaces positioned between the first and second surfaces, the molded package body including a cavity formed on one of the side surfaces and sidewalls surrounding the cavity;

first and second lead frames arranged in the molded package body, the cavity of the molded package body exposing a portion of at least one of the first and second lead frames placed in the bottom of the cavity to outside;

a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames;

an adhesive layer disposed between the light emitting diode chip and the bottom of the cavity and having substantially the same area as the mounting area of the light emitting diode chip; and

a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip, and including a fluorescent material,

wherein the depth of the cavity is from 250 μ

m to 400 μ

m, and the mounting height of the light emitting diode chip is from 50 μ

m to 200 μ

m,

wherein each of the sidewalk has an inner surface inclined between the bottom and a top of the cavity, and the cavity has a first width in a shorter axis direction and a second width in a longer axis direction perpendicular to the shorter axis direction, the second width at a top end of the cavity is from 2.0 mm to 2.5 mm and the second width of the cavity is from 1.5 mm to 1.7 mm at the bottom of the cavity,

wherein a beam angle of the light emitting diode package is more than 114.8°

in the shorter axis direction, and a difference between the beam angle in the shorter axis direction and a beam angle in the longer axis direction is 6.5°

or less.

9. The light emitting diode package according to claim 8, wherein the molded package body is formed of a molding material, and the sidewalls include two first sidewalk along the longer axis direction and two second sidewalls along the shorter axis direction, the second sidewalls having smaller widths than those of the first sidewalls.

10. A light emitting diode package comprising:

a molded package body formed of a molding material and having a first surface defining a mounting surface of the molded package, a second surface opposed to the first surface and side surfaces positioned between the first and second surfaces, the molded package body including a cavity formed on one of the side surfaces and sidewalls surrounding the cavity;

first and second lead frames arranged in the molded package body, the cavity of the molded package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside;

a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames; and

a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip, and including a fluorescent material,

wherein the depth of the cavity is from 250 μ

m to 400 μ

m, the mounting height of the light emitting diode chip is from 50 μ

m to 200 μ

m, and the package body is divided into an upper portion and a lower portion with respect to the first and second lead frames, and a thickness of the upper portion is substantially equal to or less than a thickness of the lower portion,

wherein the cavity has a first width in a shorter axis direction and a second width in a longer axis direction perpendicular to the shorter axis direction, the second width at a top end of the cavity is from 2.0 mm to 2.5 mm and the second width of the cavity is from 1.5 mm to 1.7 mm at the bottom of the cavity,

wherein a beam angle of the light emitting diode package is more than 114.8°

in the shorter axis direction, and a difference between the beam angle in the shorter axis direction and a beam angle in the longer axis direction is 6.5°

or less.