Thin film coil and electronic device having the same

• US 10,103,554 B2
• Filed: 07/19/2017
• Issued: 10/16/2018
• Est. Priority Date: 03/29/2012
• Status: Active Grant

• Current Assignee: Wit Co., Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Lim, Dae Ki, Kim, Tae Sung, Nam, Hyeon Gil, An, Chan Gwang, Lee, Hyun Seok, Chang, Ki Won, Han, Chang Mok, Bae, Sang Woo, Cho, Sung Eun, Sung, Jae Suk
• Primary Examiner(s): Nguyen, Tuyen
• Application Number:
  US15/653,725
• Publication Number:
  US 20170317505A1
• Time in Patent Office: 454 Days
• Field of Search: 336 65, 336192, 336200, 336232
• CPC Class Codes: H01F 17/00 Fixed inductances of the signal type coils in general H01F5/00; inductors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof and multistep manufacturing processes therefor H01L28/10
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/004 with the coil helically wound around an axis without a core
• CPC Class Codes: H01F 2017/0053 with means to reduce eddy currents
• CPC Class Codes: H01F 2017/0073 with a special conductive pattern, e.g. flat spiral
• CPC Class Codes: H01F 2017/0086 on semiconductor substrate inductors for integrated circuits H01L28/10
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 5/00 Coils superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 7/06 with core of ferromagnetic material H01Q7/02 takes precedence
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields

Abstract

There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates.

Claims

1. A thin film coil, comprising:

a substrate comprising a first surface and a second surface, and formed of an insulating layer;

a first coil strand disposed on the first surface of the substrate, and including a spiral pattern and a lead-out pattern, the lead-out pattern having an end disposed inside the spiral pattern to be led out from the end, outwardly of the spiral pattern;

a second coil strand disposed on the second surface of the substrate, wherein the second coil strand overlaps and is insulated from the spiral pattern in a portion away from the lead-out pattern; and

a plurality of detour vias electrically connecting the first coil strand and the second coil strand to each other, while penetrating through the substrate in a position adjacent to the lead out pattern,

wherein windings of the spiral pattern are spaced apart from each other on the first surface and electrically maintained across the lead-out pattern by the second coil strand through at least one of the plurality of detour vias.

2. The thin film coil of claim 1, further comprising two contact pads disposed outwardly of the spiral pattern, and electrically connected to both ends of at least one of the first coil strand or the second coil strand.

3. The thin film coil of claim 1, wherein the first coil strand and the second coil strand are connected in parallel.

4. The thin film coil of claim 1, wherein the second coil strand is provided with a conductive connection via disposed at each of both ends of the second coil strand, and is electrically connected to the first coil strand by the conductive connection via.

5. The thin film coil of claim 1, wherein the first coil strand and the second coil strand are disposed in positions on two surfaces of the substrate, respectively, the positions corresponding to each other in a vertical direction.

6. The thin film coil of claim 1, wherein the substrate comprises a circuit board.

7. The thin film coil of claim 1, wherein the plurality of detour vias comprises two detour vias for a winding of the spiral pattern.