Amplification circuit and heat sink used with a light emitting apparatus having varying voltages
First Claim
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1. A light emitting apparatus comprising:
- a housing including a portion defining a thermally conductive outer surface;
a high power LED light source positioned within the housing, wherein photometric output of the high power LED increases proportionately with supplied current, and wherein the high power LED is electrically coupled to a voltage source, and a pulse width modulation controller for controlling a duty cycle of supplied input voltage;
a lens housed by the housing and aligned with the light source; and
an internal heat sink located to thermally couple with the high power LED light source and conduct heat away from the light source, independent of another conducting medium, and transfer the conducted heat to the thermally conductive outer surface portion of the housing, upon being connected to the thermally conductive outer surface;
wherein a junction temperature of the high power LED is maintained and controlled through the thermal coupling of the high power LED light source, the internal heat sink and the conductive outer surface portion of the housing.
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Abstract
A light emitting apparatus having a housing including a portion defining a thermally conductive outer surface, a light source positioned within the housing, and an internal heat sink thermally coupling the light source and the thermally conductive outer surface portion of the housing. The light source may be a solid state device, such as a light emitting diode.
32 Citations
8 Claims
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1. A light emitting apparatus comprising:
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a housing including a portion defining a thermally conductive outer surface; a high power LED light source positioned within the housing, wherein photometric output of the high power LED increases proportionately with supplied current, and wherein the high power LED is electrically coupled to a voltage source, and a pulse width modulation controller for controlling a duty cycle of supplied input voltage; a lens housed by the housing and aligned with the light source; and an internal heat sink located to thermally couple with the high power LED light source and conduct heat away from the light source, independent of another conducting medium, and transfer the conducted heat to the thermally conductive outer surface portion of the housing, upon being connected to the thermally conductive outer surface; wherein a junction temperature of the high power LED is maintained and controlled through the thermal coupling of the high power LED light source, the internal heat sink and the conductive outer surface portion of the housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification
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Current AssigneeIngersoll-Rand Industrial U.S., Inc. (Ingersoll Rand, Inc.)
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Original AssigneeIngersoll-Rand Company (Trane Technologies plc)
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InventorsMadineni, Vikram, Bartoszek, Jason
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Primary Examiner(s)Vu, Jimmy
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Application NumberUS13/764,885Publication NumberTime in Patent Office2,093 DaysField of Search362235, 362294, 362362, 362373, 362800US Class CurrentCPC Class CodesF21V 29/70 characterised by passive he...H05B 45/325 Pulse-width modulation [PWM]H05B 45/375 using buck topologyH05B 45/397 Current mirror circuitsY02B 20/30 Semiconductor lamps, e.g. s...
