Thin film coil and electronic device having the same

• US 10,122,183 B2
• Filed: 07/19/2017
• Issued: 11/06/2018
• Est. Priority Date: 03/29/2012
• Status: Active Grant

• Current Assignee: Wit Co., Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Lim, Dae Ki, Kim, Tae Sung, Nam, Hyeon Gil, An, Chan Gwang, Lee, Hyun Seok, Chang, Ki Won, Han, Chang Mok, Bae, Sang Woo, Cho, Sung Eun, Sung, Jae Suk
• Primary Examiner(s): Nguyen, Tuyen
• Application Number:
  US15/654,092
• Publication Number:
  US 20170317506A1
• Time in Patent Office: 475 Days
• Field of Search: 336 65, 336192, 336200, 336232
• CPC Class Codes: H01F 17/00 Fixed inductances of the signal type coils in general H01F5/00; inductors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof and multistep manufacturing processes therefor H01L28/10
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/004 with the coil helically wound around an axis without a core
• CPC Class Codes: H01F 2017/0053 with means to reduce eddy currents
• CPC Class Codes: H01F 2017/0073 with a special conductive pattern, e.g. flat spiral
• CPC Class Codes: H01F 2017/0086 on semiconductor substrate inductors for integrated circuits H01L28/10
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 5/00 Coils superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 7/06 with core of ferromagnetic material H01Q7/02 takes precedence
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields

Abstract

There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates.

Claims

1. A coil substrate provided in a wireless power transmitter, wirelessly transmitting power, or in a wireless power receiver, wirelessly receiving power, the coil substrate comprising:

a substrate having a first surface and a second surface;

a first spiral pattern disposed on the first surface of the substrate, and having a partially disconnected spiral shape;

a second spiral pattern disposed on the second surface of the substrate, and having both ends electrically connected to the first spiral pattern; and

a lead-out pattern having an end connected to the first spiral pattern, and disposed on the first surface of the substrate to traverse a disconnected portion of the first spiral pattern from an inside of the first spiral pattern to an outside of the first spiral pattern,

wherein electrical connection of the first spiral pattern is maintained across the disconnected portion by a plurality of first vias that penetrate through the substrate to electrically connect to the second spiral pattern,

wherein a portion of the coil substrate, outside of the disconnected portion, includes the first spiral pattern overlapping the second spiral pattern and electrically insulated therebetween by the substrate.

2. The coil substrate of claim 1, further comprising two first pads disposed on one surface of the first surface and the second surface of the substrate,

wherein one of the first pads is electrically connected to the lead-out pattern, and the other first pad is electrically connected to an end of at least one of the first spiral pattern and the second spiral pattern.

3. The coil substrate of claim 2, further comprising:

at least one second pad disposed on the other surface of the first surface and the second surface of the substrate; and

a second via disposed between the first pad and the second pad to electrically connect the first and second pads to each other.

4. The coil substrate of claim 2, further comprising a magnetic member portion disposed on the first surface over the first spiral pattern or disposed on the second surface of the substrate over the second spiral pattern.

5. The coil substrate of claim 4, further comprising a metal sheet disposed on an external surface of the magnetic member portion.

6. The coil substrate of claim 4, wherein the substrate is configured to have a protrusion portion that is at least partially not covered by the magnetic member portion, and the first pads are disposed on the protrusion portion of the substrate.

7. The coil substrate of claim 1, further comprising a third via disposed in the substrate within an inner portion of the first spiral pattern, to electrically connect an end of the lead-out pattern to the second spiral pattern.

8. The coil substrate of claim 1, wherein the first spiral pattern and the second spiral pattern are disposed on positions of two surfaces of the substrate, respectively, the positions corresponding to each other in a vertical direction.

9. The coil substrate of claim 1, wherein both ends of the first spiral pattern are connected to both ends of the second spiral pattern, respectively.

10. The coil substrate of claim 1, wherein the substrate is a circuit board.

11. The coil substrate of claim 10, wherein the circuit board is a flexible printed circuit board (FPCB), thin printed circuit board (PCB), or thin film circuit board.

12. The coil substrate of claim 1, wherein the first spiral pattern and the second spiral pattern collectively form a coil pattern with an AC resistance characteristic related to AC resistance characteristics of parallel connected twisted wire strands.

13. The coil substrate of claim 1, wherein the first spiral pattern and the second spiral pattern collectively form a coil pattern with a reduced skin effect.

14. The coil substrate of claim 1, wherein, in the lead-out pattern having the end connected to the first spiral pattern, the lead-out pattern has the end connected to an end of the first spiral pattern.

15. The coil substrate of claim 1, wherein the first spiral pattern and the second spiral pattern are respective thin film conductor patterns.

16. The coil substrate of claim 1, wherein the first spiral pattern is parallel to the second spiral pattern in the portion of the coil substrate outside of the disconnected portion.