Low power and small form factor infrared imaging

• US 10,122,944 B2
• Filed: 07/10/2017
• Issued: 11/06/2018
• Est. Priority Date: 06/10/2011
• Status: Active Grant

• Current Assignee: Teledyne FLIR LLC (Teledyne Technologies Incorporated)
• Original Assignee: FLIR Systems, Inc. (Teledyne Technologies Incorporated)
• Inventors: Nussmeier, Mark, Kurth, Eric A., Hogasten, Nicholas, Hoelter, Theodore R., Strandemar, Katrin, Boulanger, Pierre, Sharp, Barbara
• Primary Examiner(s): Rao, Anand S
• Assistant Examiner(s): Edwards, Tyler B
• Application Number:
  US15/645,949
• Publication Number:
  US 20170318237A1
• Time in Patent Office: 484 Days
• Field of Search: None
• CPC Class Codes: H04M 1/725 Cordless telephones user interfaces specially adapted therefor H04M1/724
• CPC Class Codes: H04M 2250/52 including functional features of a camera constructional features concerning the integration of cameras in portable phones H04M1/0264
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 25/60 Noise processing, e.g. detecting, correcting, reducing or removing noise
• CPC Class Codes: H04N 25/75 Circuitry for providing, modifying or processing image signals from the pixel array
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.

Claims

1. A system comprising:

a focal plane array (FPA) comprising;

an array of infrared sensors adapted to image a scene, wherein a size of the array of infrared sensors is less than or equal to 160 by 120; and

a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames; and

a bias circuit adapted to provide a bias voltage of approximately 0.2 volts to approximately 0.7 volts to the infrared sensors in response to a regulated voltage of approximately 1.5 volts to approximately 2.8 volts.

2. The system of claim 1, further comprising a low-dropout regulator (LDO) integrated with the FPA and adapted to provide the regulated voltage to the bias circuit in response to an external supply voltage selected from a range of approximately 2.8 volts to approximately 11 volts.

3. The system of claim 1, wherein the size is one of 80 by 64, 80 by 60, 64 by 64, 64 by 32, or 32 by 32.

4. The system of claim 1, wherein:

the ROIC is adapted to provide the captured image frames at a first frame rate; and

the system further comprises a processor adapted to combine at least a subset of the captured image frames to provide processed image frames at a second frame rate with reduced noise in comparison with the captured image frames.

5. The system of claim 4, wherein:

the first frame rate is within a range from approximately 120 Hz to approximately 480 Hz; and

the second frame rate is within a range from approximately 30 Hz to approximately 60 Hz.

6. The system of claim 1, wherein the system is an infrared imaging module adapted to be inserted into a socket, and wherein the socket has a size less than approximately 8.5 mm by 8.5 mm.

7. The system of claim 1, further comprising a processor adapted to process an intentionally blurred image frame, wherein the blurred image frame comprises blurred thermal image data associated with the scene and noise introduced by the system, wherein the processor is adapted to:

use the blurred image frame to determine a plurality of non-uniformity correction (NUC) terms to reduce at least a portion of the noise; and

apply the NUC terms to the captured image frames.

8. The system of claim 1, wherein the infrared sensors are microbolometers.

9. A method comprising:

receiving, at a bias circuit of a focal plane array (FPA), a regulated voltage in a range of approximately 1.5 volts to approximately 2.8 volts;

providing a bias voltage from the bias circuit to an array of infrared sensors of the FPA in response to the regulated voltage, wherein the bias voltage is provided in a range of approximately 0.2 volts to approximately 0.7 volts;

imaging a scene using the array of infrared sensors, wherein a size of the array of infrared sensors is less than or equal to 160 by 120; and

providing signals from the infrared sensors corresponding to captured image frames using a read out integrated circuit (ROIC) of the FPA.

10. The method of claim 9, further comprising providing the regulated voltage from a low-dropout regulator (LDO) integrated with the FPA to the bias circuit in response to an external supply voltage selected from a range of approximately 2.8 volts to approximately 11 volts.

11. The method of claim 9, wherein the size is one of 80 by 64, 80 by 60, 64 by 64, 64 by 32, or 32 by 32.

12. The method of claim 9, wherein:

the ROIC provides the captured image frames at a first frame rate; and

the method further comprises combining at least a subset of the captured image frames to provide processed image frames at a second frame rate with reduced noise in comparison with the captured image frames.

13. The method of claim 12, wherein:

the first frame rate is within a range from approximately 120 Hz to approximately 480 Hz; and

the second frame rate is within a range from approximately 30 Hz to approximately 60 Hz.

14. The method of claim 9, wherein the FPA is part of an infrared imaging module adapted to be inserted into a socket, and wherein the socket has a size less than approximately 8.5 mm by 8.5 mm.

15. The method of claim 9, further comprising:

receiving an intentionally blurred one of the captured image frames, wherein the intentionally blurred one of the captured image frames comprises blurred thermal image data associated with the scene and noise introduced by an infrared imaging system;

processing the intentionally blurred one of the captured image frames to determine a plurality of non-uniformity correction (NUC) terms to reduce at least a portion of the noise; and

applying the NUC terms to the captured image frames.

16. The method of claim 9, wherein the infrared sensors are microbolometers.