Bonding apparatus and bonding method of flexible display module

• US 10,126,578 B2
• Filed: 12/23/2015
• Issued: 11/13/2018
• Est. Priority Date: 12/23/2015
• Status: Expired due to Fees

• Current Assignee: Shenzhen Royole Technologies Co. Ltd
• Original Assignee: Shenzhen Royole Technologies Co. Ltd
• Inventors: Zhu, Jianlei
• Primary Examiner(s): Aychillhum, Andargie M
• Application Number:
  US15/752,824
• Publication Number:
  US 20180246364A1
• Time in Patent Office: 1,056 Days
• Field of Search: 361749, 361748
• CPC Class Codes: B23K 20/023 Thermo-compression bonding
• CPC Class Codes: B23K 20/22 taking account of the properties of the materials to be welded
• CPC Class Codes: B23K 2101/36 Electric or electronic devices
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: G02F 1/1333 Constructional arrangements; Manufacturing methodsG02F1/135, G02F1/136 take precedence
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G09F 9/301 flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/191 characterised by provisions for the orientation or alignment of the layer to be deposited
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells

Abstract

A bonding apparatus is provided, which includes a base frame and a bonding platform, a tensioning mechanism, and an elevating mechanism which are disposed on the base frame. The tensioning mechanism includes a first tensioning portion and a second tensioning portion disposed on both sides of the bonding platform respectively. The first tensioning portion and the second tensioning portion are respectively connected to both ends of an object and used to tension the object. The bonding platform includes a bonding plane and the bonding plane is used to contact the object. The elevating mechanism is used to drive the bonding plane and/or the tensioning mechanism to generate a relative displacement between the bonding plane and the tensioning mechanism, and make a surface of the object in contact with the bonding plane flat under an action of both of the bonding platform and the tensioning mechanism.

Claims

1. A bonding apparatus, comprising a base frame and a bonding platform, a tensioning mechanism, and an elevating mechanism which are disposed on the base frame;

the tensioning mechanism comprising a first tensioning portion and a second tensioning portion, the first tensioning portion being disposed on one side of the bonding platform and the second tensioning portion being disposed on the other side of the bonding platform, the first tensioning portion being connected to one end of an object and the second tensioning portion being connected to the other end of the object, and the first tensioning portion and the second tensioning portion being configured to tension the object;

the bonding platform comprising a bonding plane, the bonding plane being configured to contact the object; and

the elevating mechanism being configured to drive at least one of the bonding plane and the tensioning mechanism, to generate a relative displacement between the bonding plane and the tensioning mechanism, and make a surface of the object smooth in contact with the bonding plane under an action of both of the bonding platform and the tensioning mechanism, wherein the first tensioning portion comprises a pair of first rollers disposed apart from and opposite to each other and the first rollers are configured to clamp one end of the object;

wherein the first rollers do not roll when a first friction between the first rollers and the object is less than or equal to a predetermined value, and the first rollers roll when the first friction is greater than the predetermined value; and

the second tensioning portion comprises a pair of second rollers disposed apart from and opposite to each other and the second rollers are configured to clamp the other end of the object;

wherein the second rollers do not roll when a second friction between the second rollers and the object is less than or equal to the predetermined value, and the second rollers roll when the second friction is greater than the predetermined value.

2. The apparatus of claim 1, wherein the elevating mechanism comprises a first driving component, and the first driving component connects the bonding platform and the base frame and is configured to drive the bonding platform to move towards or away from the base frame.

3. The apparatus of claim 2, wherein the first driving component comprises a pitch adjusting structure, a first connecting rod, and a second connecting rod having a length equal to that of the first connecting rod;

wherein a middle part of the first connecting rod is hinged with a middle part of the second connecting rod, and the pitch adjusting structure is configured to adjust a distance between one end of the first connecting rod and one end of the second connecting rod.

4. The apparatus of claim 1, wherein the elevating mechanism comprises a first driving component, and the bonding platform comprises a first portion and a second portion, wherein

an upper surface of the first portion is the bonding plane and the second portion is fixed to the base frame;

and

the first driving portion is disposed between the first portion and the second portion and configured to drive the first portion to move towards or away from the second portion.

5. The apparatus of claim 2, wherein the bonding platform comprises a first protrusion, a second protrusion, and a third protrusion, wherein

the first driving component is configured to drive the first protrusion to rise, whereby an upper surface of the first protrusion forms the bonding plane;

or

the first driving component is configured to drive the first protrusion and the second protrusion to rise, whereby the upper surface of the first protrusion and an upper surface of the second protrusion are coplanar to form the bonding plane;

or

the first driving component is configured to drive the first protrusion, the second protrusion, and the third protrusion to rise, whereby the upper surface of the first protrusion, the upper surface of the second protrusion, and an upper surface of the third protrusion are coplanar to form the bonding plane.

6. The apparatus of claim 1, wherein the elevating mechanism comprises a second driving component, and the second driving component comprises a first bracket disposed on one side of the bonding platform and a second bracket disposed on the other side of the bonding platform, wherein

the first bracket is provided with a first sliding rail, the second bracket is provided with a second sliding rail, and sliding paths of the first sliding rail and the second sliding rail are both perpendicular to the bonding plane;

and

the first tensioning portion is movably connected to the first sliding rail and the second tensioning portion is movably connected to the second sliding rail.

7. The apparatus of claim 4, wherein the first driving component comprises a pitch adjusting structure, a first connecting rod, and a second connecting rod having a length equal to that of the first connecting rod;

wherein a middle part of the first connecting rod is hinged with a middle part of the second connecting rod, and the pitch adjusting structure is configured to adjust a distance between one end of the first connecting rod and one end of the second connecting rod.