Process condition based dynamic defect inspection
First Claim
1. A wafer inspection method comprising:
- obtaining manufacturing process tool parameter data from a manufacturing process tool configured to process at least one wafer;
determining whether to bypass a defect inspection process of the at least one wafer or perform a defect inspection process of the at least one wafer based on the obtained manufacturing process tool parameter data; and
performing the defect inspection process of the at least one wafer in response to a determination to perform the defect inspection.
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Accused Products
Abstract
Defect inspection methods and systems that use process conditions to dynamically determine how to perform defect inspections during a semiconductor manufacturing process are disclosed. A defect inspection method may include: obtaining process conditions from a process tool utilized to process at least one wafer; determining whether to perform defect inspection of a layer, a wafer, or a high risk area/spot within the at least one wafer based on the process conditions obtained; bypassing the defect inspection when it is determined not to perform the defect inspection; and performing the defect inspection after the at least one wafer is processed by the process tool when it is determined to perform the defect inspection.
42 Citations
22 Claims
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1. A wafer inspection method comprising:
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obtaining manufacturing process tool parameter data from a manufacturing process tool configured to process at least one wafer; determining whether to bypass a defect inspection process of the at least one wafer or perform a defect inspection process of the at least one wafer based on the obtained manufacturing process tool parameter data; and performing the defect inspection process of the at least one wafer in response to a determination to perform the defect inspection. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A wafer manufacturing method comprising:
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processing at least one wafer utilizing a manufacturing process tool; obtaining manufacturing process tool parameter data from the manufacturing process tool; determining whether to bypass a defect inspection process of the at least one wafer or perform a defect inspection process of the at least one wafer based on obtained manufacturing process tool parameter data; and performing the defect inspection process of the at least one wafer in response to a determination to perform the defect inspection. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A system comprising:
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a data interface, the data interface configured to obtain manufacturing process tool parameter data from a manufacturing process tool configured to process at least one wafer; a processor in communication with the data interface, the processor configured to determine whether to bypass a defect inspection process of the at least one wafer or perform a defect inspection process of the at least one wafer based on obtained manufacturing process tool parameter data; and an inspection device in communication with the processor, wherein the processor is configured to direct the inspection device to perform the defect inspection process of the at least one wafer in response to a determination to perform the defect inspection. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A wafer inspection method comprising:
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obtaining manufacturing process tool parameter data from a manufacturing process tool configured to process at least one wafer; determining whether to bypass a defect inspection process of the at least one wafer or perform a defect inspection process of the at least one wafer based on the obtained manufacturing process tool parameter data; and bypassing the defect inspection process of the at least one wafer in response to the determination to bypass the defect inspection.
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22. A system comprising:
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a data interface, the data interface configured to obtain manufacturing process tool parameter data from a manufacturing process tool configured to process at least one wafer; a processor in communication with the data interface, the processor configured to determine whether to bypass a defect inspection process of the at least one wafer or perform a defect inspection process of the at least one wafer based on obtained manufacturing process tool parameter data; and an inspection device in communication with the processor, wherein the processor is configured to direct the inspection device to bypass the defect inspection process of the at least one wafer in response to a determination to bypass the defect inspection.
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Specification