Method and apparatus for magnetic sensor producing a changing magnetic field

• US 10,145,908 B2
• Filed: 07/19/2013
• Issued: 12/04/2018
• Est. Priority Date: 07/19/2013
• Status: Active Grant

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Inventors: David, Paul, Taylor, William P.
• Primary Examiner(s): Nguyen, Tung X
• Assistant Examiner(s): RODAK, LEE E
• Application Number:
  US13/946,400
• Publication Number:
  US 20150022198A1
• Time in Patent Office: 1,964 Days
• Field of Search: 324228, 324234, 324251-261, 3242072-20724, 32420725, 32420726
• CPC Class Codes: G01D 5/147 influenced by the movement of a third element, the position of Hall device and the source of magnetic field being fixed in respect to each other
• CPC Class Codes: G01D 5/2013 by a movable ferromagnetic element, e.g. a core G01D5/2033 takes precedence
• CPC Class Codes: G01R 33/00 Arrangements or instruments for measuring magnetic variables
• CPC Class Codes: G01R 33/07 Hall effect devices
• CPC Class Codes: G01R 33/09 Magnetoresistive devices
• CPC Class Codes: G01R 33/093 using multilayer structures, e.g. giant magnetoresistance sensors thin magnetic films H01F10/00

Abstract

Methods and apparatus for detecting a magnetic field include a semiconductor substrate, a coil configured to provide a changing magnetic field in response to a changing current in the coil; and a magnetic field sensing element supported by the substrate. The coil receives the changing current and, in response, generates a changing magnetic field. The magnetic field sensing element detects the presence of a magnetic target by detecting changes to the magnetic field caused by the target and comparing them to an expected value.

Claims

1. A magnetic field sensor comprising:

a semiconductor substrate;

a coil, supported by the semiconductor substrate, having a first terminal winding and a second opposite terminal winding, the coil configured to provide a changing magnetic field having a magnetic field vector with a direction parallel to a surface of the semiconductor substrate on which the coil is supported in response to a changing current in the coil; and

a plurality of magnetic field sensing elements arranged in a bridge configuration and supported by the substrate to detect a target by detecting variations in the changing magnetic field caused by the target;

wherein the target is physically separate from the semiconductor substrate; and

wherein a first pair of magnetic field sensing elements of the bridge configuration is positioned on the semiconductor substrate adjacent to the first terminal winding of the coil and a second pair of magnetic field sensing elements of the bridge configuration is positioned on the semiconductor substrate adjacent to the second terminal winding of the coil to increase a sensitivity of the magnetic field sensor to a target located in line with the magnetic field vector.

2. The magnetic field sensor of claim 1 wherein the coil is formed from at least one metal layer disposed on a surface of the substrate.

3. The magnetic field sensor of claim 1 wherein the plurality of magnetic field sensing elements comprises at least one giant magnetoresistive (GMR) element.

4. The magnetic field sensor of claim 1 wherein the plurality of magnetic field sensing elements comprises at least one Hall effect element.

5. The magnetic field sensor of claim 1 further including a current source coupled to the coil.

6. The magnetic field sensor of claim 1 further including a pulsed or transient current source coupled to the coil.

7. The magnetic field sensor of claim 1 wherein the coil is positioned above or below the substrate.

8. The magnetic field sensor of claim 1 wherein the coil is a separately formed element included in a same package with the substrate.

9. The magnetic field sensor of claim 1 wherein the direction of the changing magnetic field is a direction toward or away from the target.

10. The magnetic field sensor of claim 1 wherein the variations in the changing magnetic field are caused by movement of the target relative to the magnetic field sensor in the presence of the magnetic field.

11. The magnetic field sensor of claim 1 wherein the first pair of magnetic field sensing elements, the coil, and the first and second terminal windings of the coil are arranged in a line.

12. A method of detecting a magnetic field by a magnetic field sensor comprising:

providing a magnetic field sensor having a semiconductor substrate;

driving a changing current through a coil so that the coil generates a changing magnetic field having magnetic field vector with a direction parallel to a surface of the semiconductor substrate on which the coil is supported, the coil having a first terminal winding and a second, opposite terminal winding; and

detecting, with a plurality of magnetic field sensing elements supported by the substrate, a target by detecting variations in the changing magnetic field caused by the target;

wherein the target is physically separate from the semiconductor substrate; and

wherein the plurality of magnetic field sensing elements are positioned in a bridge configuration, a first pair of magnetic field sensing elements of the bridge configuration is positioned adjacent to the first terminal winding of the coil and a second pair of magnetic field sensing elements of the bridge is positioned at adjacent to the second terminal winding of the coil to increase a sensitivity of the magnetic field sensor to a target located in line with the magnetic field vector.

13. The method of claim 12 further comprising forming the coil from one or more metal layers disposed on a surface of the substrate.

14. The method of claim 12 wherein the plurality of magnetic field sensing elements comprises at least one GMR element.

15. The method of claim 12 wherein the plurality of magnetic field sensing elements comprises at least one Hall effect element.

16. The method of claim 12 further comprising supplying a pulsed or transient current to the coil.

17. The method of claim 12 further comprising attaching the coil to a top or bottom surface of the substrate.

18. The method of claim 12 further comprising providing the coil as a separately formed element within a same package as the substrate.

19. A magnetic field sensor comprising:

a semiconductor substrate;

a coil configured to provide a changing magnetic field having a magnetic field vector with a direction parallel to a surface of the semiconductor substrate on which the coil is supported in response to a changing current in the coil, the coil having a first terminal winding and a second, opposite terminal winding; and

a magnetoresistive transducer comprising a plurality of giant magnetoresistive (GMR) elements in a bridge configuration supported by the substrate to detect a target by detecting variations in the changing magnetic field caused by the target;

wherein a first pair of GMR elements of the bridge configuration is positioned adjacent to the first terminal winding of the coil and a second pair of GMR elements of the bridge configuration is positioned adjacent to the second terminal winding of the coil to increase a sensitivity of the magnetic field sensor to a target located in line with the magnetic field vector;

wherein the target is physically separate from the semiconductor substrate.

20. A method of detecting a magnetic field comprising:

providing a magnetic field sensor having a semiconductor substrate;

driving a changing current through a coil so that the coil generates a changing magnetic field having a magnetic field vector with a direction parallel to a surface of the semiconductor substrate on which the coil is supported;

detecting, with a magnetic field sensing element comprising a plurality of giant magnetoresistive (GMR) elements forming a bridge configuration supported by the substrate, a target by sensing variations in the changing magnetic field caused by the target; and

positioning a first pair of GMR elements of the bridge adjacent to a first terminal winding of the coil and positioning a second pair of GMR elements of the bridge adjacent to a second, opposing terminal winding of the coil to increase a sensitivity of the magnetic field sensor to a target located in line with the magnetic field vector;

wherein the target is physically separate from the semiconductor substrate.