Method for manufacturing an OLED backplate and method for manufacturing an OLED panel
First Claim
1. A method for manufacturing an OLED backplate, comprising the following steps of:
- step S1;
providing a TFT substrate, forming an electrode layer onto the TFT substrate by a depositing process and a patterning process, coating a layer of organic photoresist material onto the electrode layer and the TFT substrate, and exposing, developing and baking the layer of organic photoresist material to form a pixel defined layer, wherein the pixel defined layer has a pixel opening above the electrode layer, the pixel defined layer has side surfaces and a top surface, at this point, the side surfaces of the pixel defined layer have a hydrophilic property, the top surface of the pixel defined layer has a hydrophobic property, and a top surface of the electrode layer has photoresist residues thereon;
step S2;
coating a layer of general photoresist material onto the pixel defined layer, patterning the layer of general photoresist material by a photolithography process, and forming a protective photoresist layer onto the pixel defined layer to protect the top surface of the pixel defined layer, wherein the protective photoresist layer has a through opening above the pixel opening of the pixel defined layer, and the through opening fully exposes the corresponding pixel opening;
step S3;
applying an oxygen plasma onto an entire surface of the TFT substrate, and treating the electrode layer by the oxygen plasma to remove the photoresist residues thereon, wherein the top surface of the pixel defined layer covered by the protective photoresist layer is not affected by the oxygen plasma in the treating process, and the top surface of the pixel defined layer still has the hydrophobic property; and
step S4;
removing the protective photoresist layer on the pixel defined layer to obtain the OLED backplate.
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Abstract
A method for manufacturing an OLED backplate and a method for manufacturing an OLED panel are provided. In the method for manufacturing the OLED backplate of the present disclosure, a protective photoresist layer is manufactured on a pixel defined layer in which the top surface thereof has a hydrophobic property and the side surfaces thereof have a hydrophilic property before an electrode layer is treated by an oxygen plasma to remove photoresist residues, thereby the top surface of the pixel defined layer covered by the protective photoresist layer is not affected by the oxygen plasma in the proceeding of an oxygen plasma treatment, and still has the hydrophobic property. Therefore, the properties of the top surface of the pixel defined layer having the hydrophobic property and the side surfaces of the pixel defined layer having the hydrophilic property are kept while the photoresist residues on the electrode layer is removed, and thus an OLED device can be easily manufactured by an ink-jet printing process.
6 Citations
13 Claims
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1. A method for manufacturing an OLED backplate, comprising the following steps of:
-
step S1;
providing a TFT substrate, forming an electrode layer onto the TFT substrate by a depositing process and a patterning process, coating a layer of organic photoresist material onto the electrode layer and the TFT substrate, and exposing, developing and baking the layer of organic photoresist material to form a pixel defined layer, wherein the pixel defined layer has a pixel opening above the electrode layer, the pixel defined layer has side surfaces and a top surface, at this point, the side surfaces of the pixel defined layer have a hydrophilic property, the top surface of the pixel defined layer has a hydrophobic property, and a top surface of the electrode layer has photoresist residues thereon;step S2;
coating a layer of general photoresist material onto the pixel defined layer, patterning the layer of general photoresist material by a photolithography process, and forming a protective photoresist layer onto the pixel defined layer to protect the top surface of the pixel defined layer, wherein the protective photoresist layer has a through opening above the pixel opening of the pixel defined layer, and the through opening fully exposes the corresponding pixel opening;step S3;
applying an oxygen plasma onto an entire surface of the TFT substrate, and treating the electrode layer by the oxygen plasma to remove the photoresist residues thereon, wherein the top surface of the pixel defined layer covered by the protective photoresist layer is not affected by the oxygen plasma in the treating process, and the top surface of the pixel defined layer still has the hydrophobic property; andstep S4;
removing the protective photoresist layer on the pixel defined layer to obtain the OLED backplate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for manufacturing an OLED backplate, comprising the following steps of:
-
step S1;
providing a TFT substrate, forming an electrode layer onto the TFT substrate by a depositing process and a patterning process, coating a layer of organic photoresist material onto the electrode layer and the TFT substrate, and exposing, developing and baking the layer of organic photoresist material to form a pixel defined layer, wherein the pixel defined layer has a pixel opening above the electrode layer, the pixel defined layer has side surfaces and a top surface, at this point, the side surfaces of the pixel defined layer have a hydrophilic property, the top surface of the pixel defined layer has a hydrophobic property, and a top surface of the electrode layer has photoresist residues thereon;step S2;
coating a layer of general photoresist material onto the pixel defined layer, patterning the layer of general photoresist material by a photolithography process, and forming a protective photoresist layer onto the pixel defined layer to protect the top surface of the pixel defined layer, wherein the protective photoresist layer has a through opening above the pixel opening of the pixel defined layer, and the through opening fully exposes the corresponding pixel opening;step S3;
applying an oxygen plasma onto an entire surface of the TFT substrate, and treating the electrode layer by the oxygen plasma to remove the photoresist residues thereon, wherein the top surface of the pixel defined layer covered by the protective photoresist layer is not affected by the oxygen plasma in the treating process, and the top surface of the pixel defined layer still has the hydrophobic property; andstep S4;
removing the protective photoresist layer on the pixel defined layer to obtain the OLED backplate,wherein in the step S2, an edge of the through opening in the protective photoresist layer is 0-3 micrometers greater outward extension than an edge of the corresponding pixel opening, thereby fully exposing the corresponding pixel opening; wherein in the step S1, the organic photoresist material is exposed by using a first mask, and the first mask has a first pattern for forming the pixel opening; wherein in the step S2, a specific process for forming the protective photoresist layer by the photolithography process and the patterning is that;
a second mask is provided after the layer of general photoresist material is coated on the pixel defined layer, the second mask has a second pattern for forming the through opening, the layer of general photoresist material is exposed by using the second mask, and then the exposed general photoresist material is developed and baked to obtain the protective photoresist layer;wherein a shape of the second pattern is corresponded to a shape of the first pattern, and a distance between an edge and a center point of the second pattern is 1-3 μ
m greater than a distance between a corresponding edge and a center point of the first pattern. - View Dependent Claims (11, 12, 13)
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Specification