Integrated fan-out package and method of fabricating the same

• US 10,163,824 B2
• Filed: 12/02/2016
• Issued: 12/25/2018
• Est. Priority Date: 12/02/2016
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chang, Shou-Zen, Tsai, Chung-Hao, Wang, Chuei-Tang, Wu, Kai-Chiang, Liu, Ming-Kai
• Primary Examiner(s): NIKMANESH, SEAHVOSH J
• Application Number:
  US15/367,196
• Publication Number:
  US 20180158787A1
• Time in Patent Office: 753 Days
• CPC Class Codes: H01L 2021/60022 using bump connectors, e.g. for flip chip mounting
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68318 Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68372 used to support a device or wafer when forming electrical connections thereto when forming bonding pads H01L24/03; when forming bump connectors H01L24/11; when forming layer connectors H01L24/27
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2223/6616 Vertical connections, e.g. vias
• CPC Class Codes: H01L 2223/6644 Packaging aspects of high-frequency amplifiers amplifiers per se H03F
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49822 : Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/5286 : Arrangements of power or ground buses
• CPC Class Codes: H01L 23/5389 : the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 23/552 : Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 : High-frequency adaptations
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

Abstract

An integrated fan-out package including an insulating encapsulation, a radio frequency integrated circuit (RF-IC), an antenna, a ground conductor, and a redistribution circuit structure is provided. The integrated circuit includes a plurality of conductive terminals. The RF-IC, the antenna, and the ground conductor are embedded in the insulating encapsulation. The ground conductor is between the RF-IC and the antenna. The redistribution circuit structure is disposed on the insulating encapsulation, and the redistribution circuit structure is electrically connected to the conductive terminals, the antenna, and the ground conductor. A method of fabricating the integrated fan-out package is also provided.

Claims

1. An integrated fan-out package, comprising:

an insulating encapsulation;

a radio frequency integrated circuit comprising a plurality of conductive terminals;

an antenna;

a ground conductor, wherein the radio frequency integrated circuit, the antenna and the ground conductor are embedded in the insulating encapsulation and the ground conductor is between the radio frequency integrated circuit and the antenna; and

a redistribution circuit structure disposed on the insulating encapsulation, wherein the redistribution circuit structure is electrically connected to the plurality of conductive terminals, the antenna and the ground conductor.

2. The package according to claim 1, wherein top surfaces of the antenna, the ground conductor and the insulating encapsulation are substantially aligned.

3. The package according to claim 1, wherein heights of the antenna and the grounded conductor are substantially the same.

4. The package according to claim 1, wherein the ground conductor comprises an electromagnetic wave reflector.

5. The package according to claim 1 further comprising a plurality of conductive balls disposed on and electrically connected to the redistribution circuit structure, wherein the plurality of conductive balls are electrically connected to at least one of the antenna, the ground conductor and the plurality of conductive terminals through the redistribution circuit structure.

6. The package according to claim 1 further comprising at least one passive component disposed on and electrically connected to the redistribution circuit structure, wherein the at least one passive component is electrically connected to at least one of the antenna, the ground conductor and the plurality of conductive terminals through the redistribution circuit structure.

7. The package according to claim 1 further comprising a shielding ring, wherein the shielding ring surrounds the radio frequency integrated circuit and is located between the grounded conductor and the radio frequency integrated circuit.

8. The package according to claim 1, wherein the grounded conductor comprises a shielding ring and the shielding ring surrounds the radio frequency integrated circuit.

9. An integrated fan-out package, comprising:

an insulating encapsulation;

a radio frequency integrated circuit comprising a plurality of conductive terminals;

a plurality of antennae;

a plurality of electromagnetic wave reflectors, wherein the radio frequency integrated circuit, the plurality of antennae and the plurality of electromagnetic wave reflectors are embedded in the insulating encapsulation and each of the plurality of electromagnetic wave reflectors is between the radio frequency integrated circuit and one of the plurality of antennae to reflect electromagnetic wave generated from the plurality of antennae respectively; and

a redistribution circuit structure disposed on the insulating encapsulation, wherein the redistribution circuit structure is electrically connected to the plurality of conductive terminals, the plurality of antennae and the plurality of electromagnetic wave reflectors, and the plurality of electromagnetic wave reflectors are connected to one another through the redistribution circuit structure.

10. The package according to claim 9, wherein the antennas comprise dipole antennas.

11. The package according to claim 9, wherein the electromagnetic wave reflectors are electrically insulated from the plurality of antennae and the plurality of electromagnetic wave reflectors are grounded.

12. The package according to claim 9, wherein heights of the plurality of antennae, the plurality of electromagnetic wave reflectors and the insulating encapsulation are substantially the same.

13. The package according to claim 9 further comprising a plurality of conductive balls disposed on and electrically connected to the redistribution circuit structure, wherein the plurality of conductive balls are electrically connected to at least one of the plurality of antennae, the plurality of electromagnetic wave reflectors and the plurality of conductive terminals through the redistribution circuit structure.

14. The package according to claim 9 further comprising at least one passive component disposed on and electrically connected to the redistribution circuit structure, wherein the at least one passive component is electrically connected to at least one of the plurality of antennae, the plurality of electromagnetic wave reflectors and the plurality of conductive terminals through the redistribution circuit structure.

15. The package according to claim 9 further comprising a shielding ring, wherein the shielding ring surrounds the radio frequency integrated circuit and is located between the plurality of electromagnetic wave reflectors and the radio frequency integrated circuit.