Solar cell
First Claim
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1. A solar cell, comprising:
- a semiconductor substrate;
a conductive type region comprising a first conductive type region and a second conductive type region formed on one surface of the semiconductor substrate;
an electrode comprising a first electrode and a second electrode, wherein the first electrode is connected to the first conductive type region and the second electrode is connected to the second conductive type region; and
a passivation layer formed on the conductive type region,wherein the passivation layer includes at least one of silicon nitride and silicon carbide,wherein the electrode further comprises;
an adhesive layer being in contact with the conductive type region and being electrically conductive;
an electrode layer formed on the adhesive layer; and
a ribbon-connected layer formed on the electrode layer,wherein at least a part of the electrode layer has a width smaller than a width of the adhesive layer and the ribbon-connected layer, andwherein the adhesive layer has a coefficient of thermal expansion between a coefficient of thermal expansion of the first and second conductive type regions and a coefficient of thermal expansion of a portion of the electrode layer adjacent to the adhesive layer.
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Abstract
Discussed is a solar cell includes a semiconductor substrate, a conductive type region including a first conductive type region and a second conductive type region formed on one surface of the semiconductor substrate, an electrode including a first electrode and a second electrode, wherein the first electrode is connected to the first conductive type region and the second electrode is connected to the second conductive type region, and a passivation layer formed on the conductive type region. The passivation layer includes at least one of silicon nitride and silicon carbide.
18 Citations
20 Claims
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1. A solar cell, comprising:
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a semiconductor substrate; a conductive type region comprising a first conductive type region and a second conductive type region formed on one surface of the semiconductor substrate; an electrode comprising a first electrode and a second electrode, wherein the first electrode is connected to the first conductive type region and the second electrode is connected to the second conductive type region; and a passivation layer formed on the conductive type region, wherein the passivation layer includes at least one of silicon nitride and silicon carbide, wherein the electrode further comprises; an adhesive layer being in contact with the conductive type region and being electrically conductive; an electrode layer formed on the adhesive layer; and a ribbon-connected layer formed on the electrode layer, wherein at least a part of the electrode layer has a width smaller than a width of the adhesive layer and the ribbon-connected layer, and wherein the adhesive layer has a coefficient of thermal expansion between a coefficient of thermal expansion of the first and second conductive type regions and a coefficient of thermal expansion of a portion of the electrode layer adjacent to the adhesive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification