Electrically-isolated and moisture-resistant designs for wearable devices

• US 10,182,750 B1
• Filed: 04/27/2018
• Issued: 01/22/2019
• Est. Priority Date: 04/27/2017
• Status: Active Grant

• Current Assignee: DexCom Incorporated
• Original Assignee: Verily Life Sciences LLC (Alphabet Inc.)
• Inventors: Philippine, Mandy, Matula, Scott, Vanderhaegen, Johan, Jung, Louis, Arumugam, Nivi
• Primary Examiner(s): Semenenko, Yuriy
• Application Number:
  US15/964,227
• Time in Patent Office: 270 Days
• CPC Class Codes: A61B 2562/166 the sensor is mounted on a specially adapted printed circuit board
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: A61B 5/1486 using enzyme electrodes, e.g. with immobilised oxidase
• CPC Class Codes: A61B 5/14865 invasive, e.g. introduced into the body by a catheter or needle or using implanted sensors
• CPC Class Codes: A61B 5/157 Devices characterised by integrated means for measuring characteristics of blood
• CPC Class Codes: A61B 5/6801 specially adapted to be attached to or worn on the body surface
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

An example continuous glucose monitor includes a printed circuit board (“PCB”) having first and second outer layers and an inner layer, the inner layer disposed between the first and second outer layers; a semiconductor package having four corner portions and a plurality of pins, the semiconductor package coupled to the first outer layer of the PCB via the plurality of pins; an electrical ground plane formed on the PCB and coupled to at least one pin at each of a first, second, and third of the four corner portions, and not coupled to any pins at a fourth corner portion; an electrical contact for a sensor wire formed on the second outer layer of the PCB; a sensor trace having a first portion disposed on the first outer layer, a second portion disposed on the inner layer, and a third portion disposed on the second outer layer, the sensor trace having a first end coupled to a first pin of the plurality of pins and a second end coupled to the electrical contact for the sensor wire, the first pin at the fourth corner of the semiconductor package; a plurality of guard rings disposed on the PCB, each guard ring encircling one of the portions of the sensor trace; and an encapsulant disposed around a perimeter of the semiconductor package, the encapsulant covering (i) the plurality of pins, (ii) the first portion of the sensor trace, (iii) the third portion of the sensor trace, wherein an upper surface of the semiconductor package remains exposed.

Claims

1. A wearable device comprising:

a printed circuit board (“

PCB”

) having first and second outer layers and an inner layer, the inner layer disposed between the first and second outer layers;

a semiconductor package having four corner portions and a plurality of pins, the semiconductor package coupled to the first outer layer of the PCB via the plurality of pins;

an electrical ground plane formed on the PCB and coupled to at least one pin at each of a first, second, and third of the four corner portions, and not coupled to any pins at a fourth corner portion;

an electrical contact for a sensor wire formed on the second outer layer of the PCB;

a sensor trace having a first portion disposed on the first outer layer, a second portion disposed on the inner layer, and a third portion disposed on the second outer layer, the sensor trace having a first end coupled to a first pin of the plurality of pins and a second end coupled to the electrical contact for the sensor wire, the first pin at the fourth corner portion of the semiconductor package;

a plurality of guard rings disposed on the PCB, each guard ring encircling one of the portions of the sensor trace; and

an encapsulant disposed around a perimeter of the semiconductor package, the encapsulant covering (i) the plurality of pins, (ii) the first portion of the sensor trace, (iii) the third portion of the sensor trace, wherein an upper surface of the semiconductor package remains exposed.

2. The wearable device of claim 1, further comprising the sensor wire coupled to the second outer layer of the PCB and extending from the PCB.

3. The wearable device of claim 2, further comprising a housing defining a cavity and comprising a first portion and a second portion, the first portion coupled to the second portion to define the cavity, the PCB disposed within the housing and the sensor wire extending through the housing.

4. The wearable device of claim 3, wherein the first portion of the housing is heat welded to the second portion of the housing.

5. The wearable device of claim 2, wherein the sensor wire comprises first and second electrodes, the first electrode comprising a platinum or platinum-coated wire, and the second electrode comprising a silver/silver-chloride (Ag/AgCl) material.

6. The wearable device of claim 1, wherein the encapsulant has a glass transition temperature greater than 45 degrees Celsius and a cure temperature of less than 175 degrees Celsius.

7. The wearable device of claim 1, wherein the encapsulant has a glass transition temperature greater than an operating temperature range of the wearable device and a cure temperature substantially lower than a melting temperature of a housing material of the wearable device.

8. The wearable device of claim 1, wherein the encapsulant has a resistivity of at least 10¹³ ohms per centimeter.

9. The wearable device of claim 1, wherein a total height of the PCB and the semiconductor package is less than 9 millimeters.

10. A wearable device comprising:

a printed circuit board (“

PCB”

) having first and second outer layers and an inner layer, the inner layer disposed between the first and second outer layers;

a semiconductor package having four corner portions and a plurality of pins, the semiconductor package coupled to the first outer layer of the PCB via the plurality of pins;

an electrical ground plane formed on the PCB and coupled to at least one pin at each of first, second, and third corner portions of the four corner portions, and not coupled to any pins at a fourth corner portion;

an electrical contact for a sensor wire formed on the second outer layer of the PCB;

a sensor trace having a first portion disposed on the first outer layer, a second portion disposed on the inner layer, and a third portion disposed on the second outer layer, the sensor trace having a first end coupled to a first pin of the plurality of pins and a second end coupled to the electrical contact for the sensor wire, the first pin at the fourth corner portion of the semiconductor package; and

a plurality of guard rings disposed on the PCB, each guard ring encircling one of the portions of the sensor trace.

11. The wearable device of claim 10, further comprising the sensor wire coupled to the second outer layer of the PCB and extending from the PCB.

12. The wearable device of claim 11, wherein the sensor wire comprises first and second electrodes, the first electrode comprising a platinum or platinum-coated wire, and the second electrode comprising a silver/silver-chloride (Ag/AgCl) material.

13. The wearable device of claim 10, further comprising a housing defining a cavity and comprising a first portion and a second portion, the first portion coupled to the second portion to define the cavity, the PCB disposed within the housing and the sensor wire extending through the housing.

14. A method comprising:

forming a wearable biosensor electronics portion by;

providing a plurality of PCB layers;

affixing a semiconductor package to a first PCB layer of the PCB layers, the semiconductor package having a plurality of pins;

applying a first electrical trace to the PCB first layer, the first electrical trace having a first end coupled to a pin of the semiconductor package and a second end coupled to a first via formed in the first PCB layer;

applying a guard ring to the first PCB layer, the guard ring encircling the first electrical trace, the pin, and the first via;

applying a second electrical trace to a second PCB layer of the PCB layers, the second electrical trace having a first end coupled to a sensor wire and a second end coupled to a second via formed in the second PCB layer;

applying a third electrical trace on a third PCB layer of the PCB layers, the third electrical trace having a first end coupled to the first via and a second end coupled to the second via;

bonding the third PCB layer between the first and second PCB layers;

affixing the sensor wire to the second PCB layer, the sensor wire having a first portion extending away from the second PCB layer;

applying a first encapsulant over the pins of the semiconductor package and the first electrical trace, and not applying the encapsulant to an upper surface of the semiconductor package; and

applying the encapsulant over the second electrical trace;

disposing the wearable biosensor electronics portion in a first portion of a housing, the first portion defining a hole to receive the first portion of the sensor wire;

sealing a second portion of the housing to the first portion of the housing to enclose the wearable biosensor electronics portion; and

sealing the hole using the encapsulant.

15. The method of claim 14, further comprising:

affixing a second semiconductor package for a wireless transceiver to the first PCB layer, the second semiconductor package having a plurality of pins; and

applying the encapsulant to the pins of the second semiconductor package, and not applying the encapsulant to an upper surface of the second semiconductor package.

16. The method of claim 14, wherein the semiconductor package is for an application-specific integrated circuit to receive signals from the sensor wire and determine a glucose level.

17. The method of claim 14, wherein the sealing the second portion to the first portion comprises heat-welding.

18. The method of claim 14, wherein the encapsulant has a glass transition temperature greater than 45 degrees Celsius and a cure temperature of less than 175 degrees Celsius.

19. The method of claim 14, wherein the encapsulant has a resistivity of at least 10¹³ ohms per centimeter.

20. The method of claim 14, wherein the sensor wire comprises first and second electrodes, the first electrode comprising a platinum or platinum-coated wire, and the second electrode comprising a silver/silver-chloride (Ag/AgCl) material.