Electronic device and method of fabricating the same
First Claim
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1. A method of fabricating an electronic device, the method comprising:
- arranging a plurality of device chips on an upper surface of a single mounting substrate, each of the plurality of device chips having a first pad on a lower surface and having no bump on the lower surface, the mounting substrate having bumps on the upper surface of the mounting substrate;
bonding the first pads on the lower surface of the respective device chips and the bumps on the upper surface of the mounting substrate by applying an ultrasonic wave to the device chips from respective upper surfaces of the device chips; and
after bonding the first pads and the bumps, separating the mounting substrate having the plurality of device chips mounted thereon into a plurality of substrates each having the corresponding device chip thereon,wherein;
each of the device chips includes, on the lower surface of the device chip, a functional element and a frame body, the frame body surrounding the functional element and having a larger thickness than the functional element, andthe frame body is configured so as to be not in contact with any of the upper surface of the mounting substrate, the bumps and the second pads on the upper surface of the mounting substrate, after bonding the first pads and the bumps.
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Abstract
A method of fabricating an electronic device, the method including: arranging a device chip with no bump located on a lower surface of the device chip on a mounting substrate including a bump located on an upper surface of the mounting substrate; and bonding a pad located on the lower surface of the device chip and the bump by applying an ultrasonic wave to the device chip from an upper surface of the device chip.
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Citations
9 Claims
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1. A method of fabricating an electronic device, the method comprising:
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arranging a plurality of device chips on an upper surface of a single mounting substrate, each of the plurality of device chips having a first pad on a lower surface and having no bump on the lower surface, the mounting substrate having bumps on the upper surface of the mounting substrate; bonding the first pads on the lower surface of the respective device chips and the bumps on the upper surface of the mounting substrate by applying an ultrasonic wave to the device chips from respective upper surfaces of the device chips; and after bonding the first pads and the bumps, separating the mounting substrate having the plurality of device chips mounted thereon into a plurality of substrates each having the corresponding device chip thereon, wherein; each of the device chips includes, on the lower surface of the device chip, a functional element and a frame body, the frame body surrounding the functional element and having a larger thickness than the functional element, and the frame body is configured so as to be not in contact with any of the upper surface of the mounting substrate, the bumps and the second pads on the upper surface of the mounting substrate, after bonding the first pads and the bumps. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of fabricating an electronic device, the method comprising:
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forming a functional element on an upper surface of a substrate; forming a metal layer on the upper surface of the substrate so that the metal layer surrounds the functional element; cutting the substrate into a plurality of device chips by dicing the metal layer and the substrate with use of a dicing blade and thereby forming a burr on an upper surface of the metal layer; and causing a tool to hold at least one of the plurality of device chips by causing the tool to be in contact with an upper surface of the burr without being in contact with an upper surface of the functional element. - View Dependent Claims (9)
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Specification